Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2008
10/14/2008US7435670 Bit line barrier metal layer for semiconductor device and process for preparing the same
10/14/2008US7435669 Method of fabricating transistor in semiconductor device
10/14/2008US7435668 Method for doping impurities, and for producing a semiconductor device and applied electronic apparatus using a solution containing impurity ions
10/14/2008US7435667 Method of controlling polysilicon crystallization
10/14/2008US7435666 Epitaxial growth method
10/14/2008US7435665 CVD doped structures
10/14/2008US7435664 Wafer-level bonding for mechanically reinforced ultra-thin die
10/14/2008US7435663 Methods for dicing a released CMOS-MEMS multi-project wafer
10/14/2008US7435662 Method for manufacturing SOI wafer
10/14/2008US7435661 Polish stop and sealing layer for manufacture of semiconductor devices with deep trench isolation
10/14/2008US7435660 Migration enhanced epitaxy fabrication of active regions having quantum wells
10/14/2008US7435659 Method for manufacturing a semiconductor device having an alignment feature formed using an N-type dopant and a wet oxidation process
10/14/2008US7435658 Method of manufacturing metal-oxide-semiconductor transistor
10/14/2008US7435657 Method of fabricating transistor including buried insulating layer and transistor fabricated using the same
10/14/2008US7435656 Semiconductor device of transistor structure having strained semiconductor layer
10/14/2008US7435655 Semiconductor device and method for manufacturing the same
10/14/2008US7435654 Analog capacitor having at least three high-k dielectric layers, and method of fabricating the same
10/14/2008US7435653 Methods for forming a wrap-around gate field effect transistor
10/14/2008US7435652 Integration schemes for fabricating polysilicon gate MOSFET and high-K dielectric metal gate MOSFET
10/14/2008US7435651 Method to obtain uniform nitrogen profile in gate dielectrics
10/14/2008US7435650 Process for manufacturing trench MIS device having implanted drain-drift region and thick bottom oxide
10/14/2008US7435649 Floating-gate non-volatile memory and method of fabricating the same
10/14/2008US7435648 Methods of trench and contact formation in memory cells
10/14/2008US7435647 NOR-type flash memory device and manufacturing method thereof
10/14/2008US7435646 Method for forming floating gates within NVM process
10/14/2008US7435645 Dynamic random access memory (DRAM)
10/14/2008US7435644 Method of manufacturing capacitor of semiconductor device
10/14/2008US7435643 Fabrication method of a dynamic random access memory
10/14/2008US7435642 Method of evaluating the uniformity of the thickness of the polysilicon gate layer
10/14/2008US7435641 Low leakage MIM capacitor
10/14/2008US7435640 Method of fabricating gate structure
10/14/2008US7435639 Dual surface SOI by lateral epitaxial overgrowth
10/14/2008US7435638 Dual poly deposition and through gate oxide implants
10/14/2008US7435637 Quantum wire gate device and method of making same
10/14/2008US7435636 Fabrication of self-aligned gallium arsenide MOSFETs using damascene gate methods
10/14/2008US7435635 Method for crystallizing semiconductor material
10/14/2008US7435634 Methods of forming semiconductor devices having stacked transistors
10/14/2008US7435633 Electroluminescence device, manufacturing method thereof, and electronic apparatus
10/14/2008US7435632 Method for manufacturing a bottom substrate of a liquid crystal display device
10/14/2008US7435631 Liquid crystal display device and method of manufacturing the same
10/14/2008US7435630 Active matrix type organic light emitting diode device and fabrication method thereof
10/14/2008US7435629 Thin film transistor array panel and a manufacturing method thereof
10/14/2008US7435628 Method of forming a vertical MOS transistor
10/14/2008US7435627 Techniques for providing decoupling capacitance
10/14/2008US7435626 Rearrangement sheet, semiconductor device and method of manufacturing thereof
10/14/2008US7435625 Semiconductor device with reduced package cross-talk and loss
10/14/2008US7435624 Method of reducing mechanical stress on a semiconductor die during fabrication
10/14/2008US7435623 Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon
10/14/2008US7435622 High performance reworkable heatsink and packaging structure with solder release layer and method of making
10/14/2008US7435621 Method of fabricating wafer level package
10/14/2008US7435620 Low temperature methods of forming back side redistribution layers in association with through wafer interconnects
10/14/2008US7435619 Method of fabricating a 3-D package stacking system
10/14/2008US7435618 Method to manufacture a coreless packaging substrate
10/14/2008US7435616 CMOS image sensor and method of fabricating the same
10/14/2008US7435615 Method for fabricating CMOS image sensor
10/14/2008US7435614 Method for treating a structure to obtain an internal space and structure having an internal space
10/14/2008US7435613 Methods of fabricating a membrane with improved mechanical integrity
10/14/2008US7435612 CMOS-MEMS process
10/14/2008US7435611 Laser generated stress waves for stiction repair
10/14/2008US7435610 Fabrication of array pH sensitive EGFET and its readout circuit
10/14/2008US7435609 Manufacturing method for exposure mask, generating method for mask substrate information, mask substrate, exposure mask, manufacturing method for semiconductor device and server
10/14/2008US7435608 III-V group nitride system semiconductor self-standing substrate, method of making the same and III-V group nitride system semiconductor wafer
10/14/2008US7435607 Method of wafer laser processing using a gas permeable protective tape
10/14/2008US7435606 Light emitting devices and method for fabricating the same
10/14/2008US7435605 Method for fabricating a component having an electrical contact region
10/14/2008US7435604 Method of making light emitting diode
10/14/2008US7435530 Positive type resist composition and resist pattern formation method using same
10/14/2008US7435527 Mixture of acid generator and resin insoluble in alkaline developer and another acid decomposable compound
10/14/2008US7435525 Positive photosensitive resin composition, method for forming pattern, and electronic part
10/14/2008US7435514 Active mask lithography
10/14/2008US7435513 Reducing phase conflicts in complex designs
10/14/2008US7435512 Using a photomask that can prevent critical dimension biases of pattern images of different pattern densities while forming a circuit pattern
10/14/2008US7435445 Method for manufacturing semiconductor device
10/14/2008US7435396 Injrction and intake valve communicates with tank; pipe for pumping chemicals; supercritical carbon dioxide
10/14/2008US7435362 Redox-switchable materials
10/14/2008US7435355 Opposite trenches surrounding the microstructure are respectively etched on sides of the wafer, and the trench depth on the side of the wafer, on which the microstructure is, is equal to the design dimension of the microstructure; microstructure can be separated automatically when reaching required depth
10/14/2008US7435323 Includes an anode, a mask with openings supported between the anode and the wafer surface defining active regions by which a rate of conductive material deposition onto the surface can be varied, a conductive mesh below the upper mask surface, and an electrolyte
10/14/2008US7435302 Surface treatment apparatus and method for manufacturing liquid crystal display device
10/14/2008US7435301 Preparing a solution of a non-ionic surfactant, an alkaline compound, a metal corrosion inhibitor and water; cleaning an upper electrode of the MIS capacitor of a silicon germanium layer
10/14/2008US7435300 Dynamic film thickness control system/method and its utilization
10/14/2008US7435165 Transparent microporous materials for CMP
10/14/2008US7435074 Method for fabricating dual damascence structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascence patterning
10/14/2008US7434856 Gripper and method of operating the same
10/14/2008US7434676 Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility
10/14/2008US7434589 Wafer cleaning apparatus with anticipating malfunction of pump
10/14/2008US7434537 Device for the coating of objects
10/14/2008US7434512 Printing in a medium
10/14/2008US7434485 Sensor device for non-intrusive diagnosis of a semiconductor processing system
10/14/2008US7434306 Integrated transformer
10/09/2008WO2008122016A1 A multi-type test interface system and method
10/09/2008WO2008122012A2 Integrated non-volatile memory and peripheral circuitry fabrication
10/09/2008WO2008121978A1 Dual surface-roughened n-face high-brightness led
10/09/2008WO2008121976A2 Method to fabricate iii-n semiconductor devices on the n-face of layers which are grown in the iii-face direction using wafer bonding and substrate removal
10/09/2008WO2008121955A2 In-line lithography and etch system
10/09/2008WO2008121952A1 Methods for stripping material for wafer reclamation
10/09/2008WO2008121939A1 Plasma nitrided gate oxide, high-k metal gate based cmos device
10/09/2008WO2008121925A2 Semiconductor device including an amorphous nitrided silicon adhesion layer and method of manufacture therefor
10/09/2008WO2008121922A2 CHEMICAL MECHANICAL POLISHING METHOD AND APPARATUS FOR REDUCING MATERIAL RE-DEPOSITION DUE TO pH TRANSITIONS
10/09/2008WO2008121855A1 Methods of forming improved epi fill on narrow isolation bounded source/drain regions and structures formed thereby
10/09/2008WO2008121815A1 Hetero-bimos injection process for non-volatile flash memory