Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2008
10/02/2008WO2007111696A3 Methods, defect review tools, and systems for locating a defect in a defect review process
10/02/2008WO2007087046A3 Semiconductor constructions, methods of forming semiconductor constructions, light-conducting conduits, and optical signal propagation assemblies
10/02/2008WO2007081686A3 Gas switching section including valves having different flow coefficients for gas distribution system
10/02/2008WO2007081528A8 Environmentally robust passivation structures for high-voltage silicon carbide semiconductor devices
10/02/2008WO2006053128A3 Pallet based system for forming thin-film solar cells
10/02/2008WO2006052481A3 Semiconductor device having post-mold nickel/palladium/gold plated leads
10/02/2008WO2005104780A3 Vertical structure semiconductor devices
10/02/2008WO2005102871A3 Wafer container with sealable door
10/02/2008WO2005003928A3 Replicated derivatives having demand-based, adjustable returns, and trading exchange therefor
10/02/2008US20080244477 Simulation Model for a Semiconductor Device Describing a quasi-Static density of a Carrier as a Non-quasi-static model
10/02/2008US20080243403 Storage medium storing thereon power consumption analysis program, and power consumption analysis method
10/02/2008US20080243293 Fabrication system and fabrication method
10/02/2008US20080242199 Polishing apparatus and method of reconditioning polishing pad
10/02/2008US20080242197 Wafer polish monitoring method and device
10/02/2008US20080242118 Methods for forming dense dielectric layer over porous dielectrics
10/02/2008US20080242117 Apparatus to reduce wafer edge temperature and breakage of wafers
10/02/2008US20080242116 Method for forming strained silicon nitride films and a device containing such films
10/02/2008US20080242115 Semiconductor device and method for manufacturing semiconductor device
10/02/2008US20080242114 Thermal anneal method for a high-k dielectric
10/02/2008US20080242113 Film forming method of high-k dielectric film
10/02/2008US20080242112 Phase-separated dielectric structure fabrication process
10/02/2008US20080242111 Atomic layer deposition of strontium oxide via n-propyltetramethyl cyclopentadiendyl precursor
10/02/2008US20080242110 Capping Layer Formation Onto a Dual Damescene Interconnect
10/02/2008US20080242109 Method for growing a thin oxynitride film on a substrate
10/02/2008US20080242108 Method for fabricating semiconductor device
10/02/2008US20080242107 Method for manufacturing a semiconductor device by using an ALD technique
10/02/2008US20080242106 CHEMICAL MECHANICAL POLISHING METHOD AND APPARATUS FOR REDUCING MATERIAL RE-DEPOSITION DUE TO pH TRANSITIONS
10/02/2008US20080242105 Semiconductor manufacturing apparatus, semiconductor wafer manufacturing method using this apparatus, and recording medium having program of this method recorded therein
10/02/2008US20080242104 Semiconductor device, method of manufacturing thereof and mask for dividing exposure
10/02/2008US20080242103 Method of manufacturing semiconductor device and semiconductor manufacturing apparatus
10/02/2008US20080242102 Chemistry for removal of photo resist, organic sacrifical fill material and etch polymer
10/02/2008US20080242101 Process Control Method in Spin Etching and Spin Etching Apparatus
10/02/2008US20080242100 Semiconductor device and fabrications thereof
10/02/2008US20080242099 Method for forming contact hole using dry and wet etching processes in semiconductor device
10/02/2008US20080242098 Method for forming pattern in semiconductor device
10/02/2008US20080242097 Selective deposition method
10/02/2008US20080242096 Method for preparing bottle-shaped deep trenches
10/02/2008US20080242095 Method for forming trench in semiconductor device
10/02/2008US20080242094 Method of making a semiconductor structure utilizing spacer removal and semiconductor structure
10/02/2008US20080242093 Method for manufacturing semiconductor integrated circuit device
10/02/2008US20080242092 Method of manufacturing spacer
10/02/2008US20080242091 Mixture of tetrazole compound and abrasive grains with oxidizer
10/02/2008US20080242090 Metal-polishing liquid and polishing method
10/02/2008US20080242089 Method for Distributed Processing at Copper CMP
10/02/2008US20080242088 Method of forming low resistivity copper film structures
10/02/2008US20080242087 Magnetron sputtering apparatus and method for manufacturing semiconductor device
10/02/2008US20080242086 Plasma processing method and plasma processing apparatus
10/02/2008US20080242085 Showerhead electrodes and showerhead electrode assemblies having low-particle performance for semiconductor material processing apparatuses
10/02/2008US20080242084 Method for planarizing an insulation layer in a semiconductor device capable of omitting a mask process and an etching process
10/02/2008US20080242083 Method for Manufacturing Memory Element
10/02/2008US20080242082 Method for fabricating back end of the line structures with liner and seed materials
10/02/2008US20080242081 Polishing method, polishing apparatus, and method for manufacturing semiconductor device
10/02/2008US20080242080 Method for implementing diffusion barrier in 3D memory
10/02/2008US20080242079 In-situ formation of conductive filling material in through-silicon via
10/02/2008US20080242078 Process of filling deep vias for 3-d integration of substrates
10/02/2008US20080242077 Strained metal silicon nitride films and method of forming
10/02/2008US20080242076 Method of making semiconductor die stack having heightened contact for wire bond
10/02/2008US20080242075 Method for forming non-volatile memory devices
10/02/2008US20080242074 Method of Forming Gate Pattern of Flash Memory Device
10/02/2008US20080242073 Method for fabricating a nonvolatile memory device
10/02/2008US20080242072 Plasma dry etch process for metal-containing gates
10/02/2008US20080242071 Method for passivating gate dielectric films
10/02/2008US20080242070 Integration schemes for fabricating polysilicon gate mosfet and high-k dielectric metal gate mosfet
10/02/2008US20080242069 Hybrid soi/bulk semiconductor transistors
10/02/2008US20080242068 Method for manufacturing a semiconductor device
10/02/2008US20080242067 Semiconductor substrate and method of manufacture thereof
10/02/2008US20080242066 Method Of Manufacturing Semiconductor
10/02/2008US20080242065 Control of ion angular distribution function at wafer surface
10/02/2008US20080242064 Manufacturing method of semiconductor device
10/02/2008US20080242062 Fabrication of diverse structures on a common substrate through the use of non-selective area growth techniques
10/02/2008US20080242061 Precursor gas mixture for depositing an epitaxial carbon-doped silicon film
10/02/2008US20080242060 METHOD FOR FORMING AlGaN CRYSTAL LAYER
10/02/2008US20080242059 Atomic layer deposition (ALD) reactor process to form nickel layer on silicon substrate, wherein ALD process cycle comprises pulsing a nickel precursor into reactor, purging reactor after nickel precursor, and pulsing mixture of hydrogen and silane into reactor
10/02/2008US20080242058 Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device
10/02/2008US20080242057 Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
10/02/2008US20080242056 System and method for cutting using a variable astigmatic focal beam spot
10/02/2008US20080242055 Wafer laser processing method and laser processing equipment
10/02/2008US20080242054 Dicing and drilling of wafers
10/02/2008US20080242053 Integrated circuit system with a debris trapping system
10/02/2008US20080242052 Method of forming ultra thin chips of power devices
10/02/2008US20080242051 Method for manufacturing semiconductor device
10/02/2008US20080242050 Method for manufacturing semiconductor device
10/02/2008US20080242049 Method for generating a micromechanical structure
10/02/2008US20080242048 Method for manufacturing soi substrate
10/02/2008US20080242047 Method of forming isolation structure of semiconductor memory device
10/02/2008US20080242046 Method on Forming an Isolation Film or a Semiconductor Device
10/02/2008US20080242045 Method for fabricating trench dielectric layer in semiconductor device
10/02/2008US20080242044 Method for Fabricating Nonvolatile Memory Device
10/02/2008US20080242043 Method for checking alignment accuracy using overlay mark
10/02/2008US20080242042 Method for fabricating a capacitor in a semiconductor device
10/02/2008US20080242041 Selective Deposition of Germanium Spacers on Nitride
10/02/2008US20080242040 Method of forming a semiconductor structure
10/02/2008US20080242039 Method of enhancing dopant activation without suffering additional dopant diffusion
10/02/2008US20080242038 Methods of forming a multilayer capping film to minimize differential heating in anneal processes
10/02/2008US20080242037 Semiconductor device having self-aligned epitaxial source and drain extensions
10/02/2008US20080242036 Semiconductor device and manufacturing method thereof
10/02/2008US20080242035 Manufacturing method of semiconductor device
10/02/2008US20080242034 Method of making three dimensional nand memory
10/02/2008US20080242033 Self-Aligned LDMOS Fabrication Method Integrated Deep-Sub-Micron VLSI Process, Using A Self-Aligned Lithography Etches And Implant Process
10/02/2008US20080242032 Carbon-Doped Epitaxial SiGe
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