Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2008
10/07/2008US7431764 Method for pulling up single crystal
10/07/2008US7431705 Die-first multi-chip modules and methods of manufacture
10/07/2008US7431585 Apparatus and method for heating substrates
10/07/2008US7431584 Heat processing apparatus and heat processing method
10/07/2008US7431225 Methods of operating a liquid vaporizer
10/07/2008US7431158 Flexible substrate storage equipment and flexible substrate storing method
10/07/2008US7431040 Method and apparatus for dispensing a rinse solution on a substrate
10/07/2008US7431038 Wet processing device and wet processing method
10/07/2008US7430986 Plasma confinement ring assemblies having reduced polymer deposition characteristics
10/07/2008US7430985 Plasma processing equipment
10/07/2008US7430950 Apparatus for cutting adhesive tape
10/07/2008US7430893 Systems and methods for detecting contaminants
10/07/2008US7430798 Electronic component attaching tool
10/07/2008CA2465879C Plasma processing apparatus
10/07/2008CA2432068C Plasma generator
10/07/2008CA2296085C Microelectronic components and electronic networks comprising dna
10/04/2008CA2584359A1 Large scale nanofiber extruder
10/02/2008WO2008119038A2 Improved method of reducing channeling of ion implants using a sacrificial scattering layer
10/02/2008WO2008118941A2 Plasma dry etch process for metal-containing gates
10/02/2008WO2008118840A2 Method of manufacturing metal silicide contacts
10/02/2008WO2008118837A1 Semiconductor device manufactured using an improved plasma etch process for a fully silicided gate flow process
10/02/2008WO2008118825A1 Forming a non-planar transistor having a quantum well channel
10/02/2008WO2008118824A2 Signaling circuit and method for integrated circuit devices and systems
10/02/2008WO2008118811A1 On-chip memory cell and method of manufacturing same
10/02/2008WO2008118780A1 Temperature effects on overlay accuracy
10/02/2008WO2008118774A1 Copper die bumps with electromigration cap and plated solder
10/02/2008WO2008118729A1 Structure and method for sicoh interfaces with increased mechanical strength
10/02/2008WO2008118683A1 Electrostatic chuck with separated electrodes
10/02/2008WO2008118634A2 Amine-arresting additives for materials used in photolithographic processes
10/02/2008WO2008118535A2 Post-supported microbolometer pixel
10/02/2008WO2008118435A1 Three dimensional nand memory and method of making thereof
10/02/2008WO2008118433A1 Three dimensional nand memory and method of making thereof
10/02/2008WO2008118432A1 Three dimensional nand memory and method of making thereof
10/02/2008WO2008118428A1 Laser scribing system and method of use
10/02/2008WO2008118271A1 Isolated integrated circuit devices
10/02/2008WO2008118225A2 Tungsten interconnect super structure for semiconductor power devices
10/02/2008WO2008118191A2 Reprogrammable parallel nanomanufacturing
10/02/2008WO2008117948A1 Suction pad for semicondcutor transfer device
10/02/2008WO2008117903A1 Apparatus for inspecting wafer and method therefor
10/02/2008WO2008117891A1 Crystal oscillator piece and method for manufacturing the same
10/02/2008WO2008117883A1 Synthetic grindstone
10/02/2008WO2008117832A1 Vacuum processing apparatus
10/02/2008WO2008117810A1 Noncrystalline oxide semiconductor thin film, process for producing the noncrystalline oxide semiconductor thin film, process for producing thin-film transistor, field-effect transistor, light emitting device, display device, and sputtering target
10/02/2008WO2008117798A1 Method for forming silicon nitride film, method for manufacturing nonvolatile semiconductor memory device, nonvolatile semiconductor memory device and plasma processing apparatus
10/02/2008WO2008117781A1 Cvd film-forming apparatus
10/02/2008WO2008117742A1 Zinc oxide semiconductor manufacturing method and zinc oxide semiconductor manufacturing apparatus
10/02/2008WO2008117727A1 Substrate transfer apparatus, substrate transfer module, substrate transfer method and computer readable storage medium
10/02/2008WO2008117702A1 Method for metal patterned wiring formation and semiconductor device produced using the method
10/02/2008WO2008117697A1 Semiconductor manufacturing apparatus, method for managing apparatus operation parameter, and program
10/02/2008WO2008117696A1 Double-layered film and pattern-forming method using the same, resin composition for forming lower layer of double-layered film, and positive radiation-sensitive resin composition for forming upper layer of double-layered film
10/02/2008WO2008117693A1 Positive-working radiation-sensitive composition and method for resist pattern formation using the composition
10/02/2008WO2008117675A1 Filming apparatus, filming method, and storage medium
10/02/2008WO2008117647A1 Organic field effect transistor
10/02/2008WO2008117627A1 Method for growing algan crystal on silicon substrate
10/02/2008WO2008117608A1 Plasma processor
10/02/2008WO2008117607A1 Electrostatick chuck and plasma processing equipment with electrostatick chuck
10/02/2008WO2008117595A1 Gallium nitride epitaxial wafer, and method of fabricating gallium nitride semiconductor light emitting device
10/02/2008WO2008117593A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device
10/02/2008WO2008117592A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device
10/02/2008WO2008117582A1 Method for forming metal film using carbonyl material, method for forming multilayered wiring structure, method for manufacturing semiconductor device, and film forming apparatus
10/02/2008WO2008117573A1 Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing method, and method for manufacturing semiconductor device
10/02/2008WO2008117564A1 Method for manufacturing nitride single crystal
10/02/2008WO2008117513A1 Conductive bump, method for producing the same, and electronic component mounted structure
10/02/2008WO2008117509A1 Soi wafer manufacturing method
10/02/2008WO2008117489A1 Adhesive film for producing semiconductor device
10/02/2008WO2008117488A1 Semiconductor device and method for manufacturing the same
10/02/2008WO2008117468A1 Tester
10/02/2008WO2008117464A1 Semiconductor device, and its manufacturing method
10/02/2008WO2008117450A1 Process for producing organic transistor and organic transistor
10/02/2008WO2008117444A1 Method for aligning exposure position for lithography processing
10/02/2008WO2008117431A1 Semiconductor device and method for manufacturing semiconductor device
10/02/2008WO2008117430A1 Semiconductor device manufacturing method and semiconductor device
10/02/2008WO2008117426A1 Semiconductor device and process for producing the same
10/02/2008WO2008117398A1 Multicolumn electron beam exposure device and multicolumn electron beam exposure method
10/02/2008WO2008117395A1 Organic semiconductor element and its manufacturing method
10/02/2008WO2008117380A1 Semiconductor integrated circuit device and its test method
10/02/2008WO2008117362A1 Organic transistor and process for producing the same
10/02/2008WO2008117358A1 Electron beam device
10/02/2008WO2008117355A1 Semiconductor substrate manufacturing device, semiconductor substrate manufacturing method and semiconductor substrate
10/02/2008WO2008117197A1 Split axes stage design for semiconductor applications
10/02/2008WO2008117173A1 Method for producing self-supporting membranes
10/02/2008WO2008116917A1 Method for detecting surface defects on a substrate and device using said method
10/02/2008WO2008116880A1 Mask-saving production of complementary lateral high-voltage transistors with a resurf structure
10/02/2008WO2008116879A1 Process for manufacturing a composite substrate
10/02/2008WO2008116875A1 Bipolar integration without additional masking steps
10/02/2008WO2008116859A1 Device and method for the removal of solder residue using a vacuum connection and an open-pored porous material
10/02/2008WO2008116761A1 Method and device for producing a bond connection
10/02/2008WO2008116477A1 Microlithographic method
10/02/2008WO2008116379A1 A cleaning solution and its use
10/02/2008WO2008097551A3 Iii-nitride semiconductor device
10/02/2008WO2008094826B1 Electronic component handler having gap set device
10/02/2008WO2008085498A3 Method for aligning die to substrate
10/02/2008WO2008085451A3 Switches for shorting during mems etch release
10/02/2008WO2008045422A3 Edge connect wafer level stacking
10/02/2008WO2008002670A3 Varying pitch adapter and a method of forming a varying pitch adapter
10/02/2008WO2007143301A3 Controlled zone microwave plasma system
10/02/2008WO2007137221A3 Dual side cooling integrated transistor module and methods of manufacture
10/02/2008WO2007127407A3 Active mask lithography
10/02/2008WO2007121007A3 Method and apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system
10/02/2008WO2007120994A3 Methods and apparatus for selective pre-coating of a plasma processing chamber
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