Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2008
10/09/2008US20080246139 Polar hybrid grid array package
10/09/2008US20080246137 Integrated circuit device and method for the production thereof
10/09/2008US20080246136 Chips having rear contacts connected by through vias to front contacts
10/09/2008US20080246132 Semiconductor device and method of manufacturing semiconductor device
10/09/2008US20080246129 Method of manufacturing semiconductor device and semiconductor device
10/09/2008US20080246126 Stacked and shielded die packages with interconnects
10/09/2008US20080246125 Semiconductor device and method for manufacturing semiconductor device
10/09/2008US20080246124 Plasma treatment of insulating material
10/09/2008US20080246123 Methods for controlling catalyst nanoparticle positioning and apparatus for growing a nanowire
10/09/2008US20080246121 Method of fabricating a device with a concentration gradient and the corresponding device
10/09/2008US20080246120 REDUCTION OF SILICIDE FORMATION TEMPERATURE ON SiGe CONTAINING SUBSTRATES
10/09/2008US20080246119 Large tuning range junction varactor
10/09/2008US20080246118 Method for realizing a contact of an integrated well in a semiconductor substrate, in particular for a base terminal of a bipolar transistor, with enhancement of the transistor performances
10/09/2008US20080246117 Surface patterned topography feature suitable for planarization
10/09/2008US20080246116 Symmetrical programmable crossbar structure
10/09/2008US20080246115 Robust esd cell
10/09/2008US20080246114 Integrated passive device with a high resistivity substrate and method for forming the same
10/09/2008US20080246109 SOI substrate, method for manufacturing the same, and semiconductor device
10/09/2008US20080246102 Semiconductor device and method for manufacturing the same
10/09/2008US20080246101 Method of poly-silicon grain structure formation
10/09/2008US20080246100 High-k dielectric film, method of forming the same and related semiconductor device
10/09/2008US20080246099 Low temperature poly oxide processes for high-k/metal gate flow
10/09/2008US20080246098 Split-channel antifuse array architecture
10/09/2008US20080246096 Semiconductor device including schottky barrier diode and method of manufacturing the same
10/09/2008US20080246094 Method for Manufacturing SRAM Devices with Reduced Threshold Voltage Deviation
10/09/2008US20080246092 Semiconductor device structure with strain layer and method of fabricating the semiconductor device structure
10/09/2008US20080246090 Self-aligned planar double-gate transistor structure
10/09/2008US20080246087 Mos transistor for reducing short-channel effects and its production
10/09/2008US20080246084 Power semiconductor device and method for producing the same
10/09/2008US20080246082 Trenched mosfets with embedded schottky in the same cell
10/09/2008US20080246081 Self-Aligned Trench MOSFET and Method of Manufacture
10/09/2008US20080246077 Method of fabricating semiconductor memory device and semiconductor memory device fabricated by the method
10/09/2008US20080246076 Methods for nanopatterning and production of nanostructures
10/09/2008US20080246075 Semiconductor device and method of manufacturing the same
10/09/2008US20080246071 Mos varactors with large tuning range
10/09/2008US20080246070 Methods and apparatus for forming a polysilicon capacitor
10/09/2008US20080246069 Folded Node Trench Capacitor
10/09/2008US20080246067 Dram device and method of manufacturing the same
10/09/2008US20080246059 Device Fabrication by Anisotropic Wet Etch
10/09/2008US20080246056 SILICIDE FORMATION FOR eSiGe USING SPACER OVERLAPPING eSiGe AND SILICON CHANNEL INTERFACE AND RELATED PFET
10/09/2008US20080246055 Semiconductor component including a monocrystalline semiconductor body and method
10/09/2008US20080246054 Self-supported nitride semiconductor substrate and its production method, and light-emitting nitride semiconductor device using it
10/09/2008US20080246053 P-Type Group III Nitride Semiconductor and Production Method Thereof
10/09/2008US20080246050 Organic light-emitting device including transparent conducting oxide layer as cathode and method of manufacturing the same
10/09/2008US20080246042 Pixel structure and method for forming the same
10/09/2008US20080246041 METHOD OF FABRICATING SOI nMOSFET AND THE STRUCTURE THEREOF
10/09/2008US20080246039 Method for producing a semiconductor integrated circuit including a thin film transistor and a capacitor
10/09/2008US20080246037 Flat display device and method of manufacturing the same
10/09/2008US20080246036 Semiconductor Device, Television Set, and Method for Manufacturing The Same
10/09/2008US20080246034 Thin film transistor for flat panel display and method of fabricating the same
10/09/2008US20080246033 Thin film transistor, organic light emitting device including thin film transistor, and manufacturing method thereof
10/09/2008US20080246032 Test structure for detecting via contact shorting in shallow trench isolation regions
10/09/2008US20080246031 PCM pad design for peeling prevention
10/09/2008US20080246030 Test structures and methods for inspection of semiconductor integrated circuits
10/09/2008US20080246028 Memory device, semiconductor device, and method for manufacturing memory device
10/09/2008US20080246022 Method for Producing Planar Transporting Resonance Heterostructures
10/09/2008US20080246021 Single electron transistor and method of manufacturing the same
10/09/2008US20080246019 Defect reduction by oxidation of silicon
10/09/2008US20080246016 Device With Damaged Breakdown Layer
10/09/2008US20080245974 Method of introducing material into a substrate by gas-cluster ion beam irradiation
10/09/2008US20080245880 Semiconductor device and method for manufacturing the same
10/09/2008US20080245843 Joining Method and Device Produced by this Method and Joining Unit
10/09/2008US20080245770 Positive Displacement Pumping Chamber
10/09/2008US20080245767 Etching, crystallization
10/09/2008US20080245554 Fabrication method and structure of pcb assembly, and tool for assembly thereof
10/09/2008US20080245479 Etching system
10/09/2008US20080245470 System and method for improved auto-boating
10/09/2008US20080245409 Inverted Metamorphic Solar Cell Mounted on Flexible Film
10/09/2008US20080245397 System and Method of Manufacturing Thermoelectric Devices
10/09/2008US20080245389 Method for cleaning elements in vacuum chamber and apparatus for processing substrates
10/09/2008US20080245388 Method for cleaning elements in vacuum chamber and apparatus for processing substrates
10/09/2008US20080245387 Method for cleaning elements in vacuum chamber and apparatus for processing substrates
10/09/2008US20080244900 Form better solder connection without insulation degradation; lead-free solder; electronic
10/09/2008DE112006003447T5 Prozess zur Vereinfachung einer Endbearbeitungssequenz und durch den Prozess erhaltene Anordnung Process of simplifying a Endbearbeitungssequenz and obtained by the process arrangement
10/09/2008DE112006003439T5 Ein zugbelasteter NMOS-Transistor mit Gruppe-III-N-Source-/Drain-Gebieten A zugbelasteter NMOS transistor with group-III-N source / drain regions
10/09/2008DE112006003349T5 Lademagazin und Dünne-Platten-Behälter Feeder and Thin Plate container
10/09/2008DE112006003059T5 Halbleiteranordnungen und Verfahren zur Herstellung derselben Semiconductor devices and methods of manufacturing the same
10/09/2008DE112006003034T5 Prüfgerät für elektronische Bauelemente und Verfahren zur Montage einer Leistungsplatine in dem Prüfgerät An electronic component tester and method for mounting a power board in the tester
10/09/2008DE112006002870T5 Bandaufklebevorrichtung und Aufklebeverfahren Bandaufklebevorrichtung and Aufklebeverfahren
10/09/2008DE112006002846T5 Bandaufklebevorrichtung, Montagevorrichtung und Montageverfahren Bandaufklebevorrichtung, mounting apparatus and method of assembly
10/09/2008DE10208044B4 Verfahren und Anordnung zum Überwachen eines Herstellungsprozesses Method and arrangement for monitoring a manufacturing process
10/09/2008DE102008017062A1 Laserbearbeitungsmschine Laserbearbeitungsmschine
10/09/2008DE102008017061A1 Wafer-Bearbeitungsverfahren Wafer processing method
10/09/2008DE102008016205A1 Verfahren und Schaltung zur Belastung von Zwischenverbindungen auf hoher Ebene in Halbleiterbauelementen Method and circuit for load of high-level interconnects in semiconductor devices
10/09/2008DE102008014894A1 Halbleitervorrichtung mit Schottky-Sperrdiode und Verfahren zu deren Herstellung A semiconductor device comprising Schottky barrier diode and methods for their preparation
10/09/2008DE102008012678A1 Verfahren zum Bilden einer metallischen Elektrode und die metallische Elektrode aufweisende Halbleitervorrichtung A method of forming a metallic electrode and the metal electrode semiconductor device having
10/09/2008DE102007037925B3 Metall-Oxid-Halbleiter-Struktur und Verfahren zum Bilden eines Bit-Leitung-Kontaktstöpsels Metal-oxide semiconductor structure and method of forming a bit line contact plug
10/09/2008DE102007035611A1 Verfahren zum Herstellen einer integrierten Schaltung, integrierte Schaltung sowie Speichermodul A method of fabricating an integrated circuit, integrated circuit, and storage module
10/09/2008DE102007034801A1 Bipolarintegration ohne zusätzliche Maskenschritte Bipolarintegration without additional mask steps
10/09/2008DE102007026589A1 Prüfgerät und Struktur der Prüfspitze desselben The same instrument and structure of the probe
10/09/2008DE102007022532A1 Integrierte Schaltung, Speicherzellenarray, Speicherzellenmodul sowie Verfahren zum Betreiben einer integrierten Schaltung Integrated circuit, memory cell array, memory cell module and method of operating an integrated circuit
10/09/2008DE102007021729B3 Method for processing semiconductor wafer, for manufacturing semiconductor wafer with revised edge geometry, involves carrying out material removing process of edge of semiconductor wafer
10/09/2008DE102007016922A1 Verfahren zur Detektion von Defekten auf der Rückseite eines Halbleiterwafers A method for detecting defects on the back of a semiconductor wafer
10/09/2008DE102007016553A1 Vorrichtung und Verfahren zur elektrischen Kontaktierung von Halbleiter-Bauelementen auf einem Wafer Apparatus and method for electrically contacting semiconductor devices on a wafer
10/09/2008DE102007016388A1 Device for wet treatment of substrates, has cage formed from two opposite lying, rectangular cover plates and toothed bars is fixed between all four sides of rectangular cover plates for sealing of received substrates
10/09/2008DE102007016374A1 Sensor for monitoring mold flux during molding of integrated circuit package on carrier element, has sensor wire provided in package, where end of sensor wire is fastened on semiconductor chip, and runs within mold compound
10/09/2008DE102007016257A1 Verfahren zur Herstellung eines elektrischen Trägerscheibenkontaktes mit vorderseitigem Anschluss A process for producing an electrical carrier disc contact with on face connection
10/09/2008DE102007016135A1 Method for structuring substrate material, involves arranging mask structure on main surface of substrate material in two substrate areas, and mask structure is removed above substrate area during short time interval
10/09/2008DE102007016061A1 Modul mit Halbleiterchip Module with semiconductor chip
10/09/2008DE102007015874A1 Verfahren zur Herstellung einer porösen Schicht A process for preparing a porous layer
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