Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2008
10/08/2008CN101281898A Structure for testing integrality of grid medium layer, forming method and test method thereof
10/08/2008CN101281897A Matrix type structure for testing integrality of gate oxic horizon
10/08/2008CN101281892A 半导体装置及其制造方法 Semiconductor device and manufacturing method
10/08/2008CN101281888A Semiconductor encapsulation construction and manufacturing method thereof
10/08/2008CN101281887A Method for preparing light inductor
10/08/2008CN101281886A Recessed gate mos transistor device and manufacture method thereof
10/08/2008CN101281885A Method of fusing trimming for semiconductor device
10/08/2008CN101281884A Method for preparing SiOx thin film for silicon base photoelectricity integrated device
10/08/2008CN101281883A Method for forming threading hole on substrate
10/08/2008CN101281882A Method for forming threading hole on substrate
10/08/2008CN101281881A Method for forming layer-across connecting structure
10/08/2008CN101281880A Semiconductor component and manufacturing method thereof
10/08/2008CN101281879A Double-stage self-aligning contact window and manufacturing method thereof
10/08/2008CN101281878A Control device for driving crystal-fetching arm of crystal-storing machine
10/08/2008CN101281877A Method for measuring MOS transistor dismatching features, territory pattern and forming method thereof
10/08/2008CN101281876A Method of manufacturing semiconductor device and semiconductor device
10/08/2008CN101281875A Grain automatic positioning, and stack type encapsulation structure as well as manufacturing method thereof
10/08/2008CN101281874A Grain automatic positioning, and stack type encapsulation structure as well as manufacturing method thereof
10/08/2008CN101281873A Apparatus for installing semiconductor chip
10/08/2008CN101281872A Wiring substrate and wiring substrate manufacturing method
10/08/2008CN101281871A Composite hard mask layer, metal-oxide-semiconductor transistor and manufacturing method thereof
10/08/2008CN101281870A Method for manufacturing semiconductor device
10/08/2008CN101281869A Method for preparing power MOS tube capable of improving grid oxic horizon homogeneity
10/08/2008CN101281868A Method for etching soldering pad
10/08/2008CN101281867A System and method for controlling etching deviation
10/08/2008CN101281866A Method for forming shallow groove as well as shallow groove structure
10/08/2008CN101281865A Method for manufacturing semiconductor device with deep groove
10/08/2008CN101281864A Method and apparatus for improving hydride vapour phase epitaxy growth GaN material homogeneity
10/08/2008CN101281863A Method for preparing large scale nonpolar surface GaN self-supporting substrate
10/08/2008CN101281862A Silicone base 3C-silicon carbide heteroepitaxy growth method based on aluminum nitride buffer layer
10/08/2008CN101281861A Wafer processing method
10/08/2008CN101281860A Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
10/08/2008CN101281859A Etching reaction system
10/08/2008CN101281858A Substrate holder and plating apparatus
10/08/2008CN101281857A Method of manufacturing a semiconductor device
10/08/2008CN101281856A Wafer linking boride surface treating pigment as well as linking method
10/08/2008CN101281855A Method for cleaning electro-static chuck
10/08/2008CN101281404A Method and system for factory automation system
10/08/2008CN101281393A Program processing method of semiconductor producing system
10/08/2008CN101281379A Method for removing photoresist as well as method for reworking of photoetching technology
10/08/2008CN101281375A Method for removing micro-air blister / particulate in liquid, liquid supplier and uses thereof
10/08/2008CN101281374A Method for testing whether etching solution is valid or not
10/08/2008CN101281365A Material pattern, and mold, metal thin-film pattern, metal pattern using thereof, and methods of forming the same
10/08/2008CN101281363A Pellicle and method for preparing the same
10/08/2008CN101281361A A photomask with sub-resolution assist feature and manufature method thereof
10/08/2008CN101281334A Display substrate and LCD with the same
10/08/2008CN101281332A Array substrate for liquid crystal display device and manufacturing method of the same
10/08/2008CN101280158A Chemico-mechanical polishing slurry for polysilicon
10/08/2008CN101279710A Method for judging wafer backside alignment overlay accuracy and wafer thereof
10/08/2008CN101279533A Printing system, printing method and method for printing thin-film transistor and RLC circuit
10/08/2008CN100425105C Plasma processing method and apparatus
10/08/2008CN100424899C Preparing high conductivity suede non-blended ZnO film by MOCVD method
10/08/2008CN100424892C Heterojunction pn diode based on silicon nanoline and producing method thereof
10/08/2008CN100424890C Semiconductor device and method of manufacturing the same
10/08/2008CN100424889C Semi-conductor transistor possessing decreased grid electrode-source electrode /drain capacitor
10/08/2008CN100424888C Semiconductor device and manufacturing method of the same
10/08/2008CN100424887C Trench MIS device having implanted drain-drift region and thick bottom oxide and process for manufacturing the same
10/08/2008CN100424886C Finfet body contact structure and method for founding same
10/08/2008CN100424884C CMOS image sensor and method for fabricating the same
10/08/2008CN100424879C Deep-submicron CMOS process inductively compensated photoelectric detector and its manufacturing method
10/08/2008CN100424878C Ferroelectric film capacity used for ferroelectric memorizer and its manufacturing method
10/08/2008CN100424877C Semiconductor memory device and method of arranging signal and power lines thereof
10/08/2008CN100424876C Semiconductor device
10/08/2008CN100424874C Semiconductor device with suppressed copper migration
10/08/2008CN100424871C Overhang support for a stacked semiconductor device, and method of forming thereof
10/08/2008CN100424869C Semiconductor device, wafer and method of designing and manufacturing the same
10/08/2008CN100424868C A semiconductor device and method for manufacturing the semiconductor device
10/08/2008CN100424867C Interconnect structure of integrated circuit
10/08/2008CN100424866C Tape circuit substrate and semiconductor chip package using the same
10/08/2008CN100424865C Semiconductor device with a protected active die region and method therefor
10/08/2008CN100424862C Semiconductor device and manufacturing method thereof, circuit board, electro-optic device, electronic device
10/08/2008CN100424859C Electronic device and producing method thereof
10/08/2008CN100424858C Electronic device and producing method thereof
10/08/2008CN100424856C Method for making channel capacitor dynamic random access storage unit
10/08/2008CN100424855C Method for forming integrated advanced semiconductor device using sacrificial stress layer
10/08/2008CN100424854C High ft and fmax bipolar transistor and method of making same
10/08/2008CN100424853C Three dimensional integrated circuit and method of design
10/08/2008CN100424852C Knife scraping method glass passivation process for silicon current rectifier
10/08/2008CN100424851C Method of manufacturing semiconductor device
10/08/2008CN100424850C Method for producing shallow trench isolation structure and semiconductor structure
10/08/2008CN100424849C Electrostatically clamped edge ring for plasma processing
10/08/2008CN100424848C Wiring structure to minimize stress induced void formation
10/08/2008CN100424847C Method for preparing transistor and combined improved structure obtained thereby
10/08/2008CN100424846C Light emitting diode with static damage protective function and its producing method
10/08/2008CN100424845C Semiconductor device and manufacturing method of the same
10/08/2008CN100424844C Design method for plating of printed circuit board strip and manufacturing method of semiconductor chip package using the same
10/08/2008CN100424843C Semiconductor device produced with binder
10/08/2008CN100424842C Wiring board and method of producing the same
10/08/2008CN100424841C Method for mfg. semiconductor device and method for removing gap wall
10/08/2008CN100424840C Method of manufacturing thin film transistor
10/08/2008CN100424839C Method for producing heavy blended gallium nitride field effect transistor
10/08/2008CN100424838C Method for III family elements two-time spreading and raising large power transistor blocking current-voltage characteristics
10/08/2008CN100424837C Method for making high-frequency high-power silicon-germanium heterojunction double-pole transistor
10/08/2008CN100424836C Process for producing rectifier tube chip by one time coating source full spreading
10/08/2008CN100424835C Deposition method of TiN film having a multi-layer structure
10/08/2008CN100424834C Method for preparing good ohmic contact on thin film of cubic boron nitride
10/08/2008CN100424833C Method for mfg. nitrogen doped dielectric layer
10/08/2008CN100424832C Method and apparatus for plasma etching
10/08/2008CN100424831C Electroconductive pattern, manufacturintg method for electronic device and electronic device
10/08/2008CN100424830C Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer
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