Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2008
10/02/2008US20080242031 Method for fabricating p-channel field-effect transistor (fet)
10/02/2008US20080242030 Method for manufacturing fin transistor that prevents etching loss of a spin-on-glass insulation layer
10/02/2008US20080242029 Method and structure for making a top-side contact to a substrate
10/02/2008US20080242028 Method of making three dimensional nand memory
10/02/2008US20080242027 Non-Volatile Memory Integrated Circuit
10/02/2008US20080242026 Method of manufacturing a semiconductor memory device having a floating gate
10/02/2008US20080242025 3-dimensional flash memory device and method of fabricating the same
10/02/2008US20080242024 Method of manufacturing semiconductor device
10/02/2008US20080242023 Method for preparing a metal-oxide-semiconductor transistor
10/02/2008US20080242022 Electronic device including discontinuous storage elements within a dielectric layer and process of forming the electronic device
10/02/2008US20080242021 Method of fabricating a bottle trench and a bottle trench capacitor
10/02/2008US20080242020 Method of manufacturing a mos transistor device
10/02/2008US20080242019 Method of fabricating semiconductor device
10/02/2008US20080242018 Method of reducing channeling of ion implants using a sacrificial scattering layer
10/02/2008US20080242017 Method of manufacturing semiconductor mos transistor devices
10/02/2008US20080242016 Methods for fabricating semiconductor device structures with reduced susceptibility to latch-up and semiconductor device structures formed by the methods
10/02/2008US20080242015 Methods of Forming CMOS Integrated Circuit Devices Having Stressed NMOS and PMOS Channel Regions Therein and Circuits Formed Thereby
10/02/2008US20080242014 Methods for fabricating semiconductor substrates with silicon regions having differential crystallographic orientations
10/02/2008US20080242013 Semiconductor device and a method of manufacturing the same
10/02/2008US20080242012 High quality silicon oxynitride transition layer for high-k/metal gate transistors
10/02/2008US20080242011 Method of fabricating non-volatile memory device
10/02/2008US20080242010 At least penta-sided-channel type of finfet transistor
10/02/2008US20080242009 Semiconductor memory devices and methods for fabricating the same
10/02/2008US20080242008 Method of making three dimensional nand memory
10/02/2008US20080242007 Method for selectively etching portions of a layer of material based upon a density or size of semiconductor features located thereunder
10/02/2008US20080242006 Methods of forming nand flash memory with fixed charge
10/02/2008US20080242005 Method for manufacturing semiconductor device
10/02/2008US20080242004 Inkjet printed wirebonds, encapsulant and shielding
10/02/2008US20080242003 Integrated circuit devices with integral heat sinks
10/02/2008US20080242002 Apparatus and Methods for Cooling Semiconductor Integrated Circuit Package Structures
10/02/2008US20080242001 Lid Attachment Mechanism
10/02/2008US20080242000 Wafer-level-chip-scale package and method of fabrication
10/02/2008US20080241999 Semiconductor device and manufacturing method therefor
10/02/2008US20080241998 Method for fabricating a low cost integrated circuit (ic) package
10/02/2008US20080241997 Interposer and method for producing the same and electronic device
10/02/2008US20080241996 Manufacturing method of semiconductor device
10/02/2008US20080241995 Adhesive Sheet For Both Dicing And Die Bonding And Semiconductor Device Manufacturing Method Using The Adhesive Sheet
10/02/2008US20080241994 Print Mask and Method of Manufacturing Electronic Components Using The Same
10/02/2008US20080241993 Gang flipping for ic packaging
10/02/2008US20080241992 Method of assembling chips
10/02/2008US20080241991 Gang flipping for flip-chip packaging
10/02/2008US20080241985 Microelectronic imaging units and methods of manufacturing microelectronic imaging units
10/02/2008US20080241984 Method for manufacturing semicondcutor sensor
10/02/2008US20080241981 Thin film semiconductor device and method for manufacturing same
10/02/2008US20080241980 Liquid crystal display
10/02/2008US20080241978 Light emitting device processes
10/02/2008US20080241977 Semiconductor device with electrode pad having probe mark
10/02/2008US20080241976 Semiconductor device production process
10/02/2008US20080241975 Automated process control using optical metrology and photoresist parameters
10/02/2008US20080241974 Determining photoresist parameters using optical metrology
10/02/2008US20080241973 Method of correcting a mask pattern and method of manufacturing a semiconductor device
10/02/2008US20080241972 Method of manufacturing a semiconductor device, pattern correction apparatus, and computer-readable recording medium
10/02/2008US20080241971 Method and apparatus for performing a site-dependent dual patterning procedure
10/02/2008US20080241970 Method and apparatus for performing a site-dependent dual damascene procedure
10/02/2008US20080241969 In-line lithography and etch system
10/02/2008US20080241968 Manufacturing method, remanufacturing method and reshipping method for a semiconductor memory device
10/02/2008US20080241758 Photoresist stripping solution and a method of stripping photoresists using the same
10/02/2008US20080241753 Mixture of polysilsesquioxane and acid generator
10/02/2008US20080241747 Positive Resist Composition and Method of Forming Resist Pattern
10/02/2008US20080241715 Eliminating problems occuring on restart of coating, transferring and developing system interrupted during continuous operation; semiconductor photolithography production
10/02/2008US20080241596 Magnetoresistive Multilayer Film
10/02/2008US20080241575 Selective aluminum doping of copper interconnects and structures formed thereby
10/02/2008US20080241574 Semiconductor device having structure with sub-lithography dimensions
10/02/2008US20080241555 Strained metal nitride films and method of forming
10/02/2008US20080241491 Method of preparing a substrate having a layer or pattern of metal on it
10/02/2008US20080241484 Patterned Substrate and Method for Producing Same
10/02/2008US20080241412 Producing equipment capable of handling large scale semiconductor production; such as plasma spray formation of smooth, uniform thick film of yttrium oxide or yttrium aluminum garnet on quartz, glass and/or aluminum substrate
10/02/2008US20080241403 Coating and developing system, coating and developing method and storage medium
10/02/2008US20080241386 Atomic Layer Deposition Methods
10/02/2008US20080241385 Vapor deposition; titanium nitride thin films formed via TiCl4 gas is adsorbed on substrate and feeding NH3 gas as reactant gas in treating chamber
10/02/2008US20080240891 Transfer and inspection devices of object to be inspected
10/02/2008US20080240648 Photoelectric conversion module for direct optical interconnection and method of manufacturing the same
10/02/2008US20080240544 System for creating an inspection recipe, system for reviewing defects, method for creating an inspection recipe and method for reviewing defects
10/02/2008US20080240188 Semiconductor laser chip and method of formation thereof
10/02/2008US20080239827 Methods of forming and operating nand memory with side-tunneling
10/02/2008US20080239816 Semiconductor memory device and method of manufacturing the same
10/02/2008US20080239815 Semiconductor device and manufacturing method thereof
10/02/2008US20080239814 Non-volatile memory device and method for fabricating the same
10/02/2008US20080239792 Metal silicide alloy local interconnect
10/02/2008US20080239791 Nano-Electronic Memory Array
10/02/2008US20080239781 Semiconductor memory device and method of forming a layout of the same
10/02/2008US20080239686 Semiconductor device having semiconductor structure bodies on upper and lower surfaces thereof, and method of manufacturing the same
10/02/2008US20080239629 Method and structure for reducing cracks in a dielectric layer in contact with metal
10/02/2008US20080239625 Electronic component manufacturing method
10/02/2008US20080239614 Electrostatic chuck with separated electrodes
10/02/2008US20080239290 Reticle defect inspection apparatus and reticle defect inspection method
10/02/2008US20080239265 Angularly resolved scatterometer, inspection method, lithographic apparatus, lithographic processing cell device manufacturing method and alignment sensor
10/02/2008US20080239260 Exposure apparatus and device manufacturing method
10/02/2008US20080239227 Pixel Structure, Display Panel, Electro-Optical Device, and Method for Manufacturing the Same
10/02/2008US20080239218 Transflective type liquid crystal display panel and method of fabricating the same
10/02/2008US20080239217 Semi-Transmissive/Semi-Reflective Electrode Substrate, Method for Manufacturing Same, and Liquid Crystal Display Using Such Semi-Transmissive/Semi-Reflective Electrode Substrate
10/02/2008US20080239209 Polarizer-and-compensator assembly and method for makeing the same
10/02/2008US20080239189 Thin film transistor array, method for manufacturing the same and active matrix display
10/02/2008US20080239188 Display substrate, liquid crystal display device having the same and method of manufacturing the same
10/02/2008US20080239185 Active matrix display and method for producing the same
10/02/2008US20080239183 Stacked storage capacitor structure for a thin film transistor liquid crystal display
10/02/2008US20080239175 Liquid crystal display device with sensing function and method of fabricaging the same
10/02/2008US20080239029 Functional liquid supply apparatus, liquid droplet ejection apparatus, method of manufacturing electro-optical apparatus, electro-optical apparatus and electronic apparatus
10/02/2008US20080239002 Cast-in place ink feed structure using encapsulant
10/02/2008US20080238997 Highly integrated wafer bonded mems devices with release-free membrane manufacture for high density print heads
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