Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2008
12/03/2008CN101315878A Heat processing furnace and method of manufacturing the same
12/03/2008CN101315877A Substrate processing sytstem and apparatus
12/03/2008CN101315876A Two-fluid supply module for substrate cleaning and cleaning device using the same
12/03/2008CN101315875A Plasma generator and workpiece processing apparatus using the same
12/03/2008CN101315874A Substrate holding apparatus and substrate processing method
12/03/2008CN101315873A Methods for manufacturing a structure on or in a substrate, imaging layer for generating sublithographic structures, method for inverting a sublithographic pattern, device obtainable by manufacturing
12/03/2008CN101315872A Apparatus and method for thermally treating wafer
12/03/2008CN101315871A Multi-project wafer and method of making wafer
12/03/2008CN101315870A Semiconductor processing platform
12/03/2008CN101315869A Gas controller, its protection device and method
12/03/2008CN101315867A Filament lamp and light irradiation type heat treatment device
12/03/2008CN101315860A Dosage accuracy monitoring systems of implanters
12/03/2008CN101315524A Substrate carrying device
12/03/2008CN101315519A Anti-leakage type photoresist bottle
12/03/2008CN101315518A Photomask testing method, photomask manufacture method, electronic component manufacture method, testing mask and testing mask set
12/03/2008CN101315517A Mask plate of image element groove section and thin-film transistor using the same
12/03/2008CN101315516A Alternative phase-shifting mask and manufacturing method thereof
12/03/2008CN101315515A Frequency tripling using spacer mask having interposed regions
12/03/2008CN101315514A Mask plate and matching method of photo-etching machine nesting precision using mask plate
12/03/2008CN101315505A Recoverable image element structure
12/03/2008CN101315497A Liquid crystal display panel and method for producing the same
12/03/2008CN101315410A Pre-burning test device of semiconductor component
12/03/2008CN101314846A Substrate carrying mechanism and substrate treating device having the same
12/03/2008CN101314845A Independent MO source pipe line of semiconductor material growth apparatus and application thereof
12/03/2008CN101314841A Manufacturing apparatus and manufacturing method of light-emitting device
12/03/2008CN101314470A Carbon nanotube having improved conductivity, process of preparing the same, and electrode comprising the carbon nanotube
12/03/2008CN101314216A Polishing pad, the use thereof and the method for manufacturing the same
12/03/2008CN101314212A Ultra-precision processing apparatus based on photon crystal material and imaging monitoring method
12/03/2008CN101314211A Compound semiconductor substrate, method of polishing compound semiconductor substrate, method of manufacturing compound semiconductor epitaxial substrate, and compound semiconductor epitaxial substra
12/03/2008CN101314199A Solder paste composite and its application
12/03/2008CN100441077C Radiator
12/03/2008CN100441074C Multi-layer integrated circuit package
12/03/2008CN100441065C Plasma processor appts. and method, and antenna
12/03/2008CN100440651C Separating of optical integrated modules and structures formed thereby
12/03/2008CN100440637C Feeding power connector and electro-static chuck device
12/03/2008CN100440580C Thermal treatment, layout pattern forming method, photoelectric device and its manufacture
12/03/2008CN100440557C Semiconductor light emitting device and device
12/03/2008CN100440556C Semiconductor light emitting device and device
12/03/2008CN100440551C Electrode layer, light generating device including the same and method of forming the same
12/03/2008CN100440543C Stress sensor chip based on SOI
12/03/2008CN100440542C 半导体装置 Semiconductor device
12/03/2008CN100440540C Transistor structures and methods for making the same
12/03/2008CN100440538C Semiconductor device and semiconductor device mfg. system
12/03/2008CN100440537C Partial consumption SOI MOS transistor and making method
12/03/2008CN100440536C Semiconductor device and production method thereof
12/03/2008CN100440535C Phase-change memory unit combined by reversible phase-change resistance and transistor and preparing method thereof
12/03/2008CN100440534C Semiconductor device and method for manufacturing same
12/03/2008CN100440531C Organic electro-luminescence display device and fabricating method thereof
12/03/2008CN100440527C Solid-state imaging device and method for driving the same
12/03/2008CN100440525C Image sensor and method for fabricating the same
12/03/2008CN100440524C CMOS image sensor and method for manufacturing the same
12/03/2008CN100440523C High-activity coefficient active picture element image sensor structure and producing method threof
12/03/2008CN100440521C 半导体装置 Semiconductor device
12/03/2008CN100440520C Semiconductor device and process for manufacturing the same
12/03/2008CN100440519C Solid camera device, producing method and interline transmission CCD image sensor
12/03/2008CN100440517C Semiconductor device with increased channel length and method for fabricating the same
12/03/2008CN100440516C Nonvolatile memory device
12/03/2008CN100440515C Method for manufacturing semiconductor device, and semiconductor device
12/03/2008CN100440514C Non-volatile floating gate memory cell and array thereof and method of formation
12/03/2008CN100440513C Three-dimensional complementary metal oxide semiconductor device structure and producing method thereof
12/03/2008CN100440511C Bidirectional photocontrol crystalbrake tube chip, photoarcing coupler and solid relay
12/03/2008CN100440509C Circuit device and method for manufacturing same
12/03/2008CN100440506C Circuit comprising a capacitor and at least one semiconductor component, and method for designing same
12/03/2008CN100440504C Alternate bump metallurgy bars for power and ground routing
12/03/2008CN100440503C Multi-layered complementary wire structure and manufacturing method thereof
12/03/2008CN100440502C 半导体装置 Semiconductor device
12/03/2008CN100440501C Interconnection structure having wings
12/03/2008CN100440499C Semiconductor device and its manufacturing method
12/03/2008CN100440496C Fluxless flip chip inter connection
12/03/2008CN100440495C 半导体装置及其制造方法 Semiconductor device and manufacturing method
12/03/2008CN100440494C Semiconductor device and manufacturing method for the same
12/03/2008CN100440493C 半导体集成电路器件 The semiconductor integrated circuit device
12/03/2008CN100440492C Method and apparatus for chip cooling using a liquid metal thermal interface
12/03/2008CN100440489C A porous silicon chip and its preparing method
12/03/2008CN100440488C Intermediate chip module,semiconductor element, circuit substrate and electronic equipment
12/03/2008CN100440487C Display array, multi-layer complementary wire structure and mfg. method
12/03/2008CN100440486C Manufacturing method for phase change ram with electrode layer process
12/03/2008CN100440485C Method of manufacturing a nonvolatile semiconductor memory device
12/03/2008CN100440484C Method of fabricating flash memory device
12/03/2008CN100440483C Semiconductor memory having charge trapping memory cells and fabrication method
12/03/2008CN100440482C Method of manufacturing a semiconductor device
12/03/2008CN100440481C Semiconductor device and method of fabricating the same
12/03/2008CN100440480C Method and system for calibrating attribute of complete model of research system
12/03/2008CN100440479C MOS transistor and method for manufacturing MOS transistor structure
12/03/2008CN100440478C Method of producing thin layers of semiconductor material from a double-sided donor wafer
12/03/2008CN100440477C Method for making thin layers containing microcomponents
12/03/2008CN100440476C Substrate placing mechanism and substrate processing device
12/03/2008CN100440475C Method for detecting transfer shift of transfer mechanism and semiconductor processing equipment
12/03/2008CN100440474C Tape bonding apparatus and tape bonding method and electronic device production method
12/03/2008CN100440473C Fabrication method of semiconductor integrated circuit device
12/03/2008CN100440472C Semiconductor device and method of making the same, circuit board, and electronic instrument
12/03/2008CN100440471C Method for manufacturing electronic device
12/03/2008CN100440470C Bonding head for bonding machine
12/03/2008CN100440469C Method of making a semiconductor chip packaging structure with a metal containment wall and a solder terminal
12/03/2008CN100440468C Method for manufacturing circuit device
12/03/2008CN100440467C Semiconductor chip and manufacturing method for the same, and semiconductor device
12/03/2008CN100440466C Wire bonder with calibration device and method
12/03/2008CN100440465C Wire bonder
12/03/2008CN100440464C Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component
12/03/2008CN100440463C Production of surface-adhering lead wire frame