Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2008
12/04/2008WO2008146688A1 Method for producing adhesive, method for connecting electronic component and bonded body
12/04/2008WO2008146655A1 Optical element holding apparatus, lens barrel, exposure apparatus and device manufacturing method
12/04/2008WO2008146641A1 Polishing composition
12/04/2008WO2008146638A1 Thin film and method for manufacturing semiconductor device using the thin film
12/04/2008WO2008146626A1 Composition for antireflection film formation and method for resist pattern formation using the composition
12/04/2008WO2008146625A1 Composition for antireflection film formation and method for resist pattern formation using the composition
12/04/2008WO2008146610A1 Magnetic storage device
12/04/2008WO2008146608A1 Vaporizing apparatus and film forming apparatus provided with vaporizing apparatus
12/04/2008WO2008146584A1 Process for producing high-concentration ozone water, apparatus therefor, method of substrate surface treatment and apparatus therefor
12/04/2008WO2008146575A1 Compound-type thin film, method for compound-type thin film formation, and electronic apparatus using the thin film
12/04/2008WO2008146572A1 Transparent conductive film pattern forming method and organic electroluminescence transparent conductive film resin substrate
12/04/2008WO2008146553A1 Magnetic random access memory
12/04/2008WO2008146539A1 Electronic component mounting device and mounting method
12/04/2008WO2008146505A1 Semiconductor device
12/04/2008WO2008146442A1 Epitaxial wafer manufacturing method and epitaxial wafer
12/04/2008WO2008146441A1 Soi wafer manufacturing method
12/04/2008WO2008146438A1 Sticking device, method for preventing adhesive from dissolving, and method for sticking
12/04/2008WO2008146356A1 Automatic wiring device, automatic wiring method, automatic wiring program, and computer-readable recording medium containing the program
12/04/2008WO2008145999A1 Organic el device and manufacturing method thereof
12/04/2008WO2008145946A1 A method of filling trenches on a substrate
12/04/2008WO2008145930A2 Method for assembling a member of a holder by sintering a conducting powder mass
12/04/2008WO2008145482A1 Dispersion comprising cerium oxide, silicon dioxide and amino acid
12/04/2008WO2008145480A1 Dispersion comprising cerium oxide, sheet silicate and amino acid
12/04/2008WO2008145229A2 Method for the treatment of flat substrates, and use of said method
12/04/2008WO2008145186A1 Floating-body dram cell capacitively coupled to an electrode in an sti region and fabrication method thereof
12/04/2008WO2008145085A1 Gripper, in particular a bernoulli gripper
12/04/2008WO2008144923A1 Nc-si/sio2 coatings and direct lithographic patterning thereof
12/04/2008WO2008123869A3 Millimeter-long nanowires
12/04/2008WO2008121262A3 Glass-ceramic-based semiconductor-on-insulator structures and method for making the same
12/04/2008WO2008120094A3 Electronic device with improved ohmic contact
12/04/2008WO2008103714A3 Transfer mask in micro-ball mounter
12/04/2008WO2008094287A3 Three-dimensional integrated circuit for analyte detection
12/04/2008WO2008088907A3 Encapsulated graphite heater and process
12/04/2008WO2008088599B1 Forced ion migration for chalcogenide phase change memory device
12/04/2008WO2008077048A3 Substrate processing apparatus and method
12/04/2008WO2008069057A3 Etching amorphous semiconductor oxides with alkaline etchant solution
12/04/2008WO2008066952A3 Selective destruction of metallic nanostructures via electromagnetic radiation
12/04/2008WO2008060349A3 Method for heteroepitaxial growth of high-quality n-face gan, inn, and ain and their alloys by metal organic chemical vapor deposition
12/04/2008WO2008042932A3 Interdigitated leadfingers
12/04/2008WO2008042040A3 Methods to accelerate photoimageable material stripping from a substrate
12/04/2008WO2008036722A3 Locking feature and method for manufacturing transfer molded ic packages
12/04/2008WO2008014128B1 User interface system
12/04/2008WO2008005075A3 System and method for treating a coating on a substrate
12/04/2008WO2008002670B1 Varying pitch adapter and a method of forming a varying pitch adapter
12/04/2008WO2007133701A3 Reduced capacity carrier, transport, load port, buffer system
12/04/2008WO2007124413A3 Drive circuit and drain extended transistor for use therein
12/04/2008WO2007123819B1 Method for making lens features
12/04/2008WO2007120324A3 A dual metal silicide scheme using a dual spacer process
12/04/2008WO2007103610A3 Method and apparatus for a stepped-drift mosfet
12/04/2008WO2007098302A3 Poly pre-doping anneals for improved gate profiles
12/04/2008WO2007095404A3 Method for making an integrated circuit having an embedded non-volatile memory
12/04/2008WO2007062383A3 Integration of pore sealing liner into dual-damascene methods and devices
12/04/2008WO2007034391A3 A method of fabricating a structure for a semiconductor device
12/04/2008US20080301622 Method of determining defects in photomask
12/04/2008US20080301621 Mask pattern correcting method
12/04/2008US20080301610 Semiconductor integrated circuit having reduced cross-talk noise
12/04/2008US20080300728 Flow rate control system and shower plate used for partial pressure control system
12/04/2008US20080299880 Substrate holding apparatus and substrate polishing apparatus
12/04/2008US20080299784 Apparatus and method for thermally treating semiconductor device capable of preventing wafer from warping
12/04/2008US20080299783 Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
12/04/2008US20080299782 Atomic layer deposition systems and methods including silicon-containing tantalum precursor compounds
12/04/2008US20080299781 Method of forming semiconductor device and semiconductor device
12/04/2008US20080299780 Method and apparatus for laser oxidation and reduction
12/04/2008US20080299779 Systems and methods for controlling the effective dielectric constant of materials used in a semiconductor device
12/04/2008US20080299778 Silicon film dry etching method
12/04/2008US20080299777 Silicon nitride film dry etching method
12/04/2008US20080299776 Frequency doubling using spacer mask
12/04/2008US20080299775 Gapfill extension of hdp-cvd integrated process modulation sio2 process
12/04/2008US20080299774 Pitch multiplication using self-assembling materials
12/04/2008US20080299773 Semiconductor device manufacturing method
12/04/2008US20080299772 Methods of fabricating electronic devices using direct copper plating
12/04/2008US20080299771 Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby
12/04/2008US20080299770 Method for increasing etch rate during deep silicon dry etch
12/04/2008US20080299769 Semiconductor fabrication method suitable for mems
12/04/2008US20080299768 Manufacturing method of substrate with through electrode
12/04/2008US20080299767 Method for Forming a Semiconductor Device Having a Salicide Layer
12/04/2008US20080299766 Method for fabricating semiconductor device
12/04/2008US20080299765 Method of Fabricating a Structure for a Semiconductor Device
12/04/2008US20080299764 Interconnection having dual-level or multi-level capping layer and method of forming the same
12/04/2008US20080299763 Method for fabricating semiconductor device
12/04/2008US20080299762 Method for forming interconnects for 3-D applications
12/04/2008US20080299761 Interconnection process
12/04/2008US20080299760 Method for manufacturing a semiconductor device
12/04/2008US20080299759 Method to form a via
12/04/2008US20080299758 Method of manufacturing semiconductor device
12/04/2008US20080299757 Wafer structure and method for fabricating the same
12/04/2008US20080299756 Method and apparatus for plating a semiconductor package
12/04/2008US20080299755 Methods of fabricating non-volatile memory devices including a chlorine cured tunnel oxide layer
12/04/2008US20080299754 Methods for forming MOS devices with metal-inserted polysilicon gate stack
12/04/2008US20080299753 Peripheral Gate Stacks and Recessed Array Gates
12/04/2008US20080299752 Fabrication method of semiconductor device
12/04/2008US20080299750 Multiple millisecond anneals for semiconductor device fabrication
12/04/2008US20080299749 Cluster ion implantation for defect engineering
12/04/2008US20080299748 Group III-V Crystal
12/04/2008US20080299747 Method for forming amorphouse silicon film by plasma cvd
12/04/2008US20080299746 Semiconductor Substrate Fabrication Method
12/04/2008US20080299745 Wafer separating method
12/04/2008US20080299744 Manufacturing method of semiconductor substrate and semiconductor device
12/04/2008US20080299743 Manufacturing method of semiconductor device
12/04/2008US20080299742 Method for manufacturing SOI wafer
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