| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/01/2009 | US20090002622 Liquid crystal display panel and methods of manufacturing the same |
| 01/01/2009 | US20090002590 Semiconductor device |
| 01/01/2009 | US20090002589 Semiconductor device and manufacturing method thereof |
| 01/01/2009 | US20090001936 Structured silicon anode |
| 01/01/2009 | US20090001617 Alignment key, method for fabricating the alignment key, and method for fabricating thin film transistor substrate using the alignment key |
| 01/01/2009 | US20090001611 Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method |
| 01/01/2009 | US20090001609 Semiconductor Device and Method of Assembly |
| 01/01/2009 | US20090001605 Semiconductor package and method for manufacturing the same |
| 01/01/2009 | US20090001604 Semiconductor Package and Method for Producing Same |
| 01/01/2009 | US20090001603 High-Density Fine Line Structure And Method Of Manufacturing The Same |
| 01/01/2009 | US20090001602 Stack package that prevents warping and cracking of a wafer and semiconductor chip and method for manufacturing the same |
| 01/01/2009 | US20090001600 Electronic device including a plurality of singulated die and methods of forming the same |
| 01/01/2009 | US20090001599 Die attachment, die stacking, and wire embedding using film |
| 01/01/2009 | US20090001597 Semiconductor device having an interconnect electrically connecting a front and backside thereof and a method of manufacture therefor |
| 01/01/2009 | US20090001595 Integrated Circuit, Intermediate Structure and a Method of Fabricating a Semiconductor Structure |
| 01/01/2009 | US20090001594 Airgap interconnect system |
| 01/01/2009 | US20090001593 Integrated circuit package system with overhanging connection stack |
| 01/01/2009 | US20090001592 Metal interconnect forming methods and ic chip including metal interconnect |
| 01/01/2009 | US20090001591 Reducing resistivity in metal interconnects by compressive straining |
| 01/01/2009 | US20090001590 Wiring structure and method of manufacturing the same |
| 01/01/2009 | US20090001589 Nor flash device and method for fabricating the device |
| 01/01/2009 | US20090001588 Metal and alloy silicides on a single silicon wafer |
| 01/01/2009 | US20090001587 Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION |
| 01/01/2009 | US20090001586 Integrated circuit and seed layers |
| 01/01/2009 | US20090001585 Method of manufacturing flash memory device |
| 01/01/2009 | US20090001584 Semiconductor device and method for fabricating the same |
| 01/01/2009 | US20090001583 Method of manufacturing semiconductor device |
| 01/01/2009 | US20090001582 Semiconductor device with metal gate and method for fabricating the same |
| 01/01/2009 | US20090001581 Metal line of semiconductor device and method of forming the same |
| 01/01/2009 | US20090001580 METAL LINE OF SEMICONDUCTOR DEVICE HAVING A DIFFUSION BARRIER INCLUDING CRxBy AND METHOD FOR FORMING THE SAME |
| 01/01/2009 | US20090001579 Multi-layered metal line having an improved diffusion barrier of a semiconductor device and method for forming the same |
| 01/01/2009 | US20090001578 METAL LINE OF SEMICONDUCTOR DEVICE HAVING A DIFFUSION BARRIER WITH AN AMORPHOUS TaBN LAYER AND METHOD FOR FORMING THE SAME |
| 01/01/2009 | US20090001577 Metal line of semiconductor device with a triple layer diffusion barrier and method for forming the same |
| 01/01/2009 | US20090001576 Interconnect using liquid metal |
| 01/01/2009 | US20090001575 Printed Circuit Board, Mounting Method of Electronic Component, and Electronic Apparatus |
| 01/01/2009 | US20090001571 Semiconductor device and method of manufacturing the same |
| 01/01/2009 | US20090001570 Electronic device and method of manufacturing the same |
| 01/01/2009 | US20090001569 Semiconductor device and method for manufacturing the same |
| 01/01/2009 | US20090001568 Wafer-level solder bumps |
| 01/01/2009 | US20090001566 Semiconductor Device Having Improved Gate Electrode Placement and Decreased Area Design |
| 01/01/2009 | US20090001564 Package substrate dynamic pressure structure |
| 01/01/2009 | US20090001563 Integrated circuit package in package system with adhesiveless package attach |
| 01/01/2009 | US20090001562 Semiconductor device |
| 01/01/2009 | US20090001561 High Thermal Performance Packaging for Circuit Dies |
| 01/01/2009 | US20090001559 Semiconductor device, a method of manufacturing the same and an electronic device |
| 01/01/2009 | US20090001558 Lamp Seat for a Light Emitting Diode and Capable of Heat Dissipation, and Method of Manufacturing the Same |
| 01/01/2009 | US20090001557 Forming a semiconductor package including a thermal interface material |
| 01/01/2009 | US20090001556 Low temperature thermal interface materials |
| 01/01/2009 | US20090001554 Semiconductor device |
| 01/01/2009 | US20090001553 Mems Package and Method for the Production Thereof |
| 01/01/2009 | US20090001551 Novel build-up-package for integrated circuit devices, and methods of making same |
| 01/01/2009 | US20090001549 Integrated circuit package system with symmetric packaging |
| 01/01/2009 | US20090001547 High-Density Fine Line Structure And Method Of Manufacturing The Same |
| 01/01/2009 | US20090001545 Integrated circuit package system with side substrate |
| 01/01/2009 | US20090001544 Chip stacked structure and method of fabricating the same |
| 01/01/2009 | US20090001543 Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same |
| 01/01/2009 | US20090001541 Method and apparatus for stackable modular integrated circuits |
| 01/01/2009 | US20090001540 Stackable Package by Using Internal Stacking Modules |
| 01/01/2009 | US20090001539 Integrated circuit package system with top and bottom terminals |
| 01/01/2009 | US20090001538 Printed wiring board structure, electronic component mounting method and electronic apparatus |
| 01/01/2009 | US20090001537 Gettering material for encapsulated microdevices and method of manufacture |
| 01/01/2009 | US20090001536 Electronic Component and a Method of Fabricating an Electronic Component |
| 01/01/2009 | US20090001535 Semiconductor Module for a Switched-Mode Power Supply and Method for Its Assembly |
| 01/01/2009 | US20090001532 Plastic-Encapsulated Semiconductor Device with an Exposed Radiator at the Top and Manufacture Thereof |
| 01/01/2009 | US20090001526 Technique for forming an interlayer dielectric material of increased reliability above a structure including closely spaced lines |
| 01/01/2009 | US20090001525 High-k dual dielectric stack |
| 01/01/2009 | US20090001524 Generation and distribution of a fluorine gas |
| 01/01/2009 | US20090001523 Systems and Methods for Processing a Film, and Thin Films |
| 01/01/2009 | US20090001520 Thinned wafer having stress dispersion parts and method for manufacturing semiconductor package using the same |
| 01/01/2009 | US20090001519 Growth of planar, non-polar, group-iii nitride films |
| 01/01/2009 | US20090001517 Thermally enhanced semiconductor devices |
| 01/01/2009 | US20090001516 Semiconductor device and method of fabricating the same |
| 01/01/2009 | US20090001515 Semiconductor device and method for manufacturing the same |
| 01/01/2009 | US20090001514 Metal insulator metal capacitor and method of manufacturing the same |
| 01/01/2009 | US20090001510 Air gap in integrated circuit inductor fabrication |
| 01/01/2009 | US20090001509 Circuit system with circuit element |
| 01/01/2009 | US20090001508 Semiconductor device including fuse elements and bonding pad |
| 01/01/2009 | US20090001507 Semiconductor device |
| 01/01/2009 | US20090001506 Dual stress liner efuse |
| 01/01/2009 | US20090001505 Semiconductor device and method for forming device isolation film of semiconductor device |
| 01/01/2009 | US20090001504 Method for Transferring Semiconductor Element, Method for Manufacturing Semiconductor Device, and Semiconductor Device |
| 01/01/2009 | US20090001503 Semiconductor device having floating body element and bulk body element and method of manufacturing the same |
| 01/01/2009 | US20090001502 Semiconductor Devices and Methods of Manufacture Thereof |
| 01/01/2009 | US20090001501 Fiber Soi Substrate, Semiconductor Device Using Same and Method for Manufacturing Same |
| 01/01/2009 | US20090001499 Thick active layer for mems device using wafer dissolve process |
| 01/01/2009 | US20090001495 Image sensor package and fabrication method thereof |
| 01/01/2009 | US20090001492 Image Sensor and Method for Manufacturing the Same |
| 01/01/2009 | US20090001491 Method for producing a microchip that is able to detect infrared light with a semiconductor at room temperature |
| 01/01/2009 | US20090001488 Cantilever with integral probe tip |
| 01/01/2009 | US20090001487 Packaged device and method of manufacturing the same |
| 01/01/2009 | US20090001486 Forming a cantilever assembly for verticle and lateral movement |
| 01/01/2009 | US20090001485 Semiconductor Device and Manufacturing Method Thereof |
| 01/01/2009 | US20090001484 Reducing transistor junction capacitance by recessing drain and source regions |
| 01/01/2009 | US20090001483 Method for Forming a Nickelsilicide FUSI Gate |
| 01/01/2009 | US20090001482 Transistor of Semiconductor Device and Method for Fabricating the Same |
| 01/01/2009 | US20090001481 Digital circuits having additional capacitors for additional stability |
| 01/01/2009 | US20090001480 HIGH-k/METAL GATE MOSFET WITH REDUCED PARASITIC CAPACITANCE |
| 01/01/2009 | US20090001479 Transistor having reduced gate resistance and enhanced stress transfer efficiency and method of forming the same |
| 01/01/2009 | US20090001478 Semiconductor device and method of manufacturing the same |
| 01/01/2009 | US20090001477 Hybrid Fully-Silicided (FUSI)/Partially-Silicided (PASI) Structures |