| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/07/2009 | EP1641591B1 Method for separating flat ceramic workpieces with a calculated radiation spot length |
| 01/07/2009 | EP1631701A4 Atmospheric pressure non-thermal plasma device to clean and sterilize the surface of probes, cannulas, pin tools, pipettes and spray heads |
| 01/07/2009 | EP1514302B1 Device for producing an electronic component having external contact surfaces and use of the device for producing an electronic component |
| 01/07/2009 | EP1493061A4 Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition |
| 01/07/2009 | EP1468452A4 High voltage power mosfet includes doped columns |
| 01/07/2009 | EP1468439A4 Method for fabricating a high voltage power mosfet having a voltage sustaining region that includes doped columns formed by rapid diffusion |
| 01/07/2009 | EP1450394B1 Semiconductor device and method for manufacturing same |
| 01/07/2009 | EP1395406B1 Method of separating components from a substrate |
| 01/07/2009 | EP1382071A4 Double diffused field effect transistor having reduced on-resistance |
| 01/07/2009 | EP1368825B1 Ruthenium silicide processing methods |
| 01/07/2009 | EP1356511B1 Use of protective caps as masks at a wafer scale |
| 01/07/2009 | EP1230667B1 Method and apparatus for controlling the volume of a plasma |
| 01/07/2009 | EP1214459B1 Pulsed plasma processing method and apparatus |
| 01/07/2009 | EP1196944B8 Apparatus and method for transferring a workpiece |
| 01/07/2009 | EP1178524B1 Method for fabricating device chips from thin sheet of pyroelectric material |
| 01/07/2009 | EP1147241B1 Diffusion bonded sputter target assembly and method of making same |
| 01/07/2009 | EP1138063B1 Fabrication of gallium nitride layers by lateral growth |
| 01/07/2009 | EP1114514B1 Very fine grain field programmable gate array architecture and circuitry |
| 01/07/2009 | EP1110238B1 Method of etching doped silicon dioxide with selectivity to undoped silicon dioxide with a high density plasma etcher |
| 01/07/2009 | EP1087041B1 Production method for silicon wafer and silicon wafer |
| 01/07/2009 | EP1063737B1 Method for manufacturing a film-type data carrier |
| 01/07/2009 | EP1060285A4 Apparatus and method for depositing a semiconductor material |
| 01/07/2009 | EP0948818B1 High density trench dmos transistor with trench bottom implant |
| 01/07/2009 | EP0910121B1 Semiconductor device |
| 01/07/2009 | CN201178093Y Temperature controlled etching trough |
| 01/07/2009 | CN201178092Y Single chip washer |
| 01/07/2009 | CN201178091Y Sheeting loading apparatus for etching machine |
| 01/07/2009 | CN201178090Y A method for measuring wafer liquid film middle variant in CMP process |
| 01/07/2009 | CN201178089Y Chip applicable intelligent label and flip chip module production apparatus |
| 01/07/2009 | CN101341805A Structure and method of fixing electronic parts to circuit board |
| 01/07/2009 | CN101341596A Self-aligned trench filling for narrow gap isolation regions |
| 01/07/2009 | CN101341595A Method for forming semiconductor device having pseudo-characteristic |
| 01/07/2009 | CN101341591A Semiconductor device and method for manufacturing same |
| 01/07/2009 | CN101341590A Method of manufacturing a semiconductor device |
| 01/07/2009 | CN101341589A Defect inspecting method and defect inspecting apparatus |
| 01/07/2009 | CN101341588A Semiconductor integrated circuit device, pdp driver and plasma display panel |
| 01/07/2009 | CN101341587A Apparatus and method for mounting electronic component |
| 01/07/2009 | CN101341586A Method of manufacturing flash memory cards |
| 01/07/2009 | CN101341585A Method of bonding |
| 01/07/2009 | CN101341584A Method for modifying highly dielectric thin film and semiconductor device |
| 01/07/2009 | CN101341583A Dielectric interface for group iii-v semiconductor device |
| 01/07/2009 | CN101341582A Light source device, substrate treating device, and substrate treating method |
| 01/07/2009 | CN101341581A Flame-perforated aperture masks |
| 01/07/2009 | CN101341580A Method for the manufacture of substrates, in particular for the optical, electronic or optoelectronic areas, and the substrate obtained in accordance with the said method |
| 01/07/2009 | CN101341579A Self-aligned trench field effect transistors with regrown gates and bipolar junction transistors with regrown base contact regions and methods of making |
| 01/07/2009 | CN101341578A Method and apparatus for processing multiphoton curable photoreactive compositions |
| 01/07/2009 | CN101341577A Method for manufacturing soi substrate, and soi substrate |
| 01/07/2009 | CN101341576A Integrated capacitor arrangement for ultrahigh capacitance values |
| 01/07/2009 | CN101341575A Improved singulation system and method |
| 01/07/2009 | CN101341574A Extended mainframe designs for semiconductor device manufacturing equipment |
| 01/07/2009 | CN101341501A Method of manufacturing rfid devices |
| 01/07/2009 | CN101341453A Constant voltage circuit and method of controlling output voltage of constant voltage circuit |
| 01/07/2009 | CN101340779A Carrier and method for manufacturing printed circuit board |
| 01/07/2009 | CN101340058A Nitride semiconductor stacked structure and semiconductor optical device, and methods for manufacturing the same |
| 01/07/2009 | CN101339959A Thin film transistor and preparation of semiconductor film |
| 01/07/2009 | CN101339958A Semiconductor device and manufacturing method of the semiconductor device |
| 01/07/2009 | CN101339957A Power fet with low on-resistance using merged metal layers |
| 01/07/2009 | CN101339955A Gate sensitive triggering unidirectional controlled silicon chip and production method thereof |
| 01/07/2009 | CN101339954A Oxide semiconductor, thin film transistor including the same and method of manufacturing a thin film transistor |
| 01/07/2009 | CN101339953A Organic light emitting element and method of manufacturing the same |
| 01/07/2009 | CN101339952A Solid-state imaging device and method for fabricating the same |
| 01/07/2009 | CN101339951A Image sensor package utilizing a removable protection film and method of making the same |
| 01/07/2009 | CN101339948A Nonvolatile memory device and method for fabricating the sam |
| 01/07/2009 | CN101339946A Semiconductor integrated circuit device and fabrication method for the same |
| 01/07/2009 | CN101339945A Semi-conductor apparatus |
| 01/07/2009 | CN101339940A Encapsulation construction and encapsulation method |
| 01/07/2009 | CN101339939A Encapsulation construction and encapsulation method |
| 01/07/2009 | CN101339936A Board having buried patterns and manufacturing method thereof |
| 01/07/2009 | CN101339934A Semiconductor device with welded leads and method of manufacturing the same |
| 01/07/2009 | CN101339933A Semiconductor device and method for manufacturing semiconductor device |
| 01/07/2009 | CN101339931A Semiconductor package having copper wire and throwing method |
| 01/07/2009 | CN101339930A Flip chip packaging body and manufacturing method thereof |
| 01/07/2009 | CN101339928A Inter-connecting structure for semiconductor device package and method of the same |
| 01/07/2009 | CN101339927A 半导体器件 Semiconductor devices |
| 01/07/2009 | CN101339926A Method of manufacturing nitride substrate for semiconductors, and nitride semiconductor substrate |
| 01/07/2009 | CN101339925A 半导体装置 Semiconductor device |
| 01/07/2009 | CN101339923A Method for forming thin film transistor array panel and the thin film transistor array panel |
| 01/07/2009 | CN101339922A Manufacturing method for one-time programmable device |
| 01/07/2009 | CN101339921A Manufacturing method of bi-polar transistor array isolated by double shallow slots |
| 01/07/2009 | CN101339920A Organic metal film preparation enhancing ultraviolet response of silicon based image device |
| 01/07/2009 | CN101339919A Semiconductor device and method for fabricating the same |
| 01/07/2009 | CN101339918A Method for manufacturing tungsten wire and method for manufacturing semiconductor device grid using the tungsten wire |
| 01/07/2009 | CN101339917A Solid-image capturing device, color filter, manufacturing method thereof and liquid crystal display device |
| 01/07/2009 | CN101339916A Electrostatic chuck |
| 01/07/2009 | CN101339915A Compact charging and baiting material feeding mechanism of bonder |
| 01/07/2009 | CN101339914A Two-dimensional electricity driving displacement platform |
| 01/07/2009 | CN101339913A Method for detecting position of defect on semiconductor wafer |
| 01/07/2009 | CN101339912A Ultrasonic thick aluminum thread pressure welding machine |
| 01/07/2009 | CN101339911A Mounted semiconductor device and a method for making the same |
| 01/07/2009 | CN101339910A wafer-level chip-scale packaging (wlcsp)manufacture method |
| 01/07/2009 | CN101339909A Package process of image inducting IC chip |
| 01/07/2009 | CN101339908A Electroplating method of electric contact mat and semi-conductor substrate having the electric contact mat |
| 01/07/2009 | CN101339907A Electronic substrate and method for mounting electronic components on substrates |
| 01/07/2009 | CN101339906A Preparation process of novel environmental semi-conductor photoelectronic material beta-FeSi2 film |
| 01/07/2009 | CN101339905A Method for manufacturing semiconductor device |
| 01/07/2009 | CN101339904A Method of manufacturing semiconductor device |
| 01/07/2009 | CN101339903A Methods for high temperature etching a high-k material gate structure |
| 01/07/2009 | CN101339902A Method of fabricating semiconductor high-voltage device |
| 01/07/2009 | CN101339901A Oxide film on wafer surface removing process and apparatus |
| 01/07/2009 | CN101339900A Method for surface modification of semiconductor layer and method of manufacturing semiconductor device |