| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/22/2009 | CN100481437C Semiconductor structure implementing sacrificial material |
| 04/22/2009 | CN100481436C Semiconductor device, method of cutting electrical fuse, and method of determining electrical fuse state |
| 04/22/2009 | CN100481435C Reprogrammable fuse structure and method |
| 04/22/2009 | CN100481434C Semiconductor integrated circuit and method for manufacturing the same, and mask |
| 04/22/2009 | CN100481433C Semiconductor device having improved metal wiring |
| 04/22/2009 | CN100481432C Semiconductor device with dual damascene structure in wafer |
| 04/22/2009 | CN100481428C Semiconductor apparatus and manufacturing method thereof |
| 04/22/2009 | CN100481427C Signal transfer film, display apparatus and method of manufacturing the same |
| 04/22/2009 | CN100481425C Semiconductor device having aluminum electrode and metallic electrode |
| 04/22/2009 | CN100481424C Semiconductor device and method for manufacturing the same |
| 04/22/2009 | CN100481421C Method for fabricating semiconductor package |
| 04/22/2009 | CN100481420C Stack type chip packaging structure, chip packaging body and manufacturing method thereof |
| 04/22/2009 | CN100481419C Feeding apparatus and feeding method for semiconductor lead frame |
| 04/22/2009 | CN100481418C ARC layer for semiconductor device and manufacturing method thereof |
| 04/22/2009 | CN100481416C Semiconductor device and stacked semiconductor device and the manufacturing methods thereof |
| 04/22/2009 | CN100481415C Chip packaging member and manufacturing method thereof |
| 04/22/2009 | CN100481414C Semiconductor device and manufacturing thereof |
| 04/22/2009 | CN100481409C 芯片封装结构及其封装制程 Chip packaging structure and packaging process |
| 04/22/2009 | CN100481406C Improved etch method |
| 04/22/2009 | CN100481403C Electronic device substrate and fabrication method thereof, and electronic device fabricating method |
| 04/22/2009 | CN100481402C Semiconductor device and manufacturing method thereof |
| 04/22/2009 | CN100481401C Method for producing active component array base plate |
| 04/22/2009 | CN100481400C Systems and production methods for a high density, compact memory array |
| 04/22/2009 | CN100481399C Method of manufacturing flash memory device |
| 04/22/2009 | CN100481398C Production methods for memory and semiconductor element |
| 04/22/2009 | CN100481397C Etching method for non-volatile memory body |
| 04/22/2009 | CN100481396C Non-volatile memory device and manufacturing method thereof |
| 04/22/2009 | CN100481395C ROM memory and manufacturing method therefor |
| 04/22/2009 | CN100481394C Method of manufacturing semiconductor integrated circuit |
| 04/22/2009 | CN100481393C Fabrication of lean-free stacked capacitors |
| 04/22/2009 | CN100481392C Manufacturing method of semiconductor element |
| 04/22/2009 | CN100481391C Flash memory, and manufacturing method thereof |
| 04/22/2009 | CN100481390C Method for fabricating semiconductor device |
| 04/22/2009 | CN100481389C Programmable resistive RAM and manufacturing method thereof |
| 04/22/2009 | CN100481388C Method and system for removing impairment of integrated circuit |
| 04/22/2009 | CN100481387C Production method of semiconductor chip |
| 04/22/2009 | CN100481386C Methods for symmetric deposition of a metal layer in the fabrication of a semiconductor device |
| 04/22/2009 | CN100481385C Methods for metal arc layer formation |
| 04/22/2009 | CN100481384C Conductor-dielectric structure and fabricating method thereof |
| 04/22/2009 | CN100481383C Method for manufacturing semiconductor device and semiconductor device |
| 04/22/2009 | CN100481382C Method for fabricating semiconductor device |
| 04/22/2009 | CN100481381C Method for forming metal line in flash memory device |
| 04/22/2009 | CN100481380C Method for manufacturing interconnect structure for semiconductor devices |
| 04/22/2009 | CN100481379C Method of adhesion improvement for low K dielectrics to conductive materials |
| 04/22/2009 | CN100481378C Laminated body and semiconductor device |
| 04/22/2009 | CN100481377C Semiconductor device and manufacturing method |
| 04/22/2009 | CN100481376C Semiconductor device and manufacturing method thereof, circuit plate and electronic device |
| 04/22/2009 | CN100481375C Method and structure of double lining for isolating shallow slot |
| 04/22/2009 | CN100481374C Non-volatile semiconductor memory devices having self-aligned gate conductive layers and fabricating methods thereof |
| 04/22/2009 | CN100481373C Manufacturing method of semiconductor device |
| 04/22/2009 | CN100481372C Chip bearing apparatus |
| 04/22/2009 | CN100481371C Substrate placing stage |
| 04/22/2009 | CN100481370C Device for transfer of flat display panel |
| 04/22/2009 | CN100481369C Electrostatic chuck device |
| 04/22/2009 | CN100481368C Substrate treatment apparatus |
| 04/22/2009 | CN100481367C Method and device for controlling position of cassette in semiconductor manufacturing equipment |
| 04/22/2009 | CN100481366C Electrostatic chuck, substrate support, clamp and electrode structure and producing method thereof |
| 04/22/2009 | CN100481365C Methods and apparatus for a band to band transfer module |
| 04/22/2009 | CN100481364C System for manufacturing panel display |
| 04/22/2009 | CN100481363C Judging method for bottom thin film residual thickness in opening |
| 04/22/2009 | CN100481362C Fabrication method of semiconductor integrated circuit device |
| 04/22/2009 | CN100481361C Method for estimating semiconductor device |
| 04/22/2009 | CN100481360C Method for inspection, process for making analytic piece, method for analysis, and analyzer |
| 04/22/2009 | CN100481359C Display panel and manufacturing method thereof |
| 04/22/2009 | CN100481358C Chip packaging and chip packaging method |
| 04/22/2009 | CN100481357C Method for manufacturing a substrate with cavity |
| 04/22/2009 | CN100481356C Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures |
| 04/22/2009 | CN100481355C Polysilicon transverse crystallizing method and polysilicon thin-film transistor manufactured by the same |
| 04/22/2009 | CN100481354C Method for producing silicon contacting device on low grid spreading electric capacity isolator |
| 04/22/2009 | CN100481353C Semiconductor device and manufacturing method thereof |
| 04/22/2009 | CN100481352C Semiconductor device and manufacturing method thereof |
| 04/22/2009 | CN100481351C Self-aligned split-gate nonvolatile memory structure and a method of making the same |
| 04/22/2009 | CN100481350C Method for fabricating thin film transistor |
| 04/22/2009 | CN100481349C Method for manufacturing variant barrier gallium nitride FET |
| 04/22/2009 | CN100481348C Salinized substance process and method of fabricating semiconductor device using the same |
| 04/22/2009 | CN100481347C Semiconductor integrated circuit |
| 04/22/2009 | CN100481346C Al/Ti/Al/Ni/Au ohmic contact system adapted to GaN device |
| 04/22/2009 | CN100481345C Thermal oxidation of a SiGe layer and applications thereof |
| 04/22/2009 | CN100481344C Nitrogen-free dielectric anti-reflective coating and hardmask |
| 04/22/2009 | CN100481343C Plasma ashing process |
| 04/22/2009 | CN100481342C System and method for processing wafer using single frequency RF power in plasma processing chamber |
| 04/22/2009 | CN100481341C Carrier for double side polishing machine and double side polishing machine employing the same, and double side polishing method |
| 04/22/2009 | CN100481340C Apparatus and method for polishing a substrate |
| 04/22/2009 | CN100481339C Method for controlling thickness of silicon single crystal cutting abrasive disc residual damage layer |
| 04/22/2009 | CN100481338C Proximity meniscus manifold |
| 04/22/2009 | CN100481337C Division starting point forming method in body to be divided, and dividing method for body to be divided |
| 04/22/2009 | CN100481336C Method for producing nonvolatile storage member |
| 04/22/2009 | CN100481335C Method for manufacturing semiconductor element |
| 04/22/2009 | CN100481334C Method for forming a passivated metal layer |
| 04/22/2009 | CN100481333C Method for fabricating a semiconductor device having different metal silicide portions |
| 04/22/2009 | CN100481332C Laser irradiation method and apparatus |
| 04/22/2009 | CN100481331C Process for producing doped semiconductor wafers from silicon, and the semiconductor wafers produced thereby |
| 04/22/2009 | CN100481330C III nitride semiconductor and fabricating method thereof |
| 04/22/2009 | CN100481329C Apparatus and method for thin film deposition |
| 04/22/2009 | CN100481328C Flexible single-crystal film and method of manufacturing the same |
| 04/22/2009 | CN100481327C Flexible electro-optical apparatus and method for manufacturing the same |
| 04/22/2009 | CN100481326C Method for manufacturing compound substrate of semiconductor |
| 04/22/2009 | CN100481325C Projection exposure apparatus, exposure method, and element producing method |
| 04/22/2009 | CN100481324C Ultrasonic cleaning monocrystalline silicon piece method and device thereof |
| 04/22/2009 | CN100481323C Test handler and operation method thereof |