Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2009
04/22/2009EP0979530B1 Semiconductor switch devices and their manufacture
04/22/2009EP0782766B1 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same
04/22/2009CN201226353Y Ultrasonic bonding cleaver for increasing gold-remaining angle
04/22/2009CN201226352Y Transfer forming device with liquid supply mechanism
04/22/2009CN201226351Y Mold strip positioning apparatus for packaging semiconductor
04/22/2009CN101416568A Components joining method and components joining structure
04/22/2009CN101416320A TFT substrate, reflective TFT substrate and method for manufacturing such substrates
04/22/2009CN101416317A Grown nanofin transistors
04/22/2009CN101416313A Power IC device and method for manufacturing same
04/22/2009CN101416309A Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
04/22/2009CN101416308A Semiconductor die packages using thin dies and metal substrates
04/22/2009CN101416301A Method for positioning components with which electrical contact can be made on a circuit carrier, and mounting system suitable for carrying out this method
04/22/2009CN101416300A Semiconductor device comprising soi transistors and bulk transistors and a method of forming the same
04/22/2009CN101416299A Flash memory device with enlarged control gate structure, and methods of making same
04/22/2009CN101416298A Semiconductor memory device
04/22/2009CN101416297A Epitaktische silizium-germanium fur einen reduzierten ubergangswiderstand bei feldeffekt-transistoren
04/22/2009CN101416296A Multi-step anneal of thin films for film densification and improved gap-fill
04/22/2009CN101416295A Hole inspection apparatus and hole inspection method using the same
04/22/2009CN101416294A Method of forming micro metal bump
04/22/2009CN101416293A Method to improve the step coverage and pattern loading for dielectric films
04/22/2009CN101416292A Copper electrodeposition in microelectronics
04/22/2009CN101416291A Copper interconnect wiring and method and apparatus for forming thereof
04/22/2009CN101416290A Field effect transistor
04/22/2009CN101416289A Field effect transistor
04/22/2009CN101416288A Grown nanofin transistors
04/22/2009CN101416287A Technique for providing stress sources in transistors in close proximity to a channel region by recessing drain and source regions
04/22/2009CN101416286A Silicon oxynitride gate dielectric formation using multiple annealing steps
04/22/2009CN101416285A Method of reducing interconnect line to line capacitance by using a low k spacer
04/22/2009CN101416284A Processing apparatus and processing method
04/22/2009CN101416283A Method of removing conductive metal oxide thin-film and apparatus thereof
04/22/2009CN101416282A Surface-protection tape for semiconductor wafers and substrate film for the surface-protection tape
04/22/2009CN101416281A Back-gated semiconductor device with a storage layer and methods for forming thereof
04/22/2009CN101416280A Method of forming an atomic layer thin film out of the liquid phase
04/22/2009CN101416279A Systems and methods for forming integrated circuit components having matching geometries
04/22/2009CN101416278A Simplified technological process for doubling range interval
04/22/2009CN101416277A Method and system for treating a dielectric film
04/22/2009CN101416276A Thermal processing system, components, and methods
04/22/2009CN101416275A Ferroelectric capacitor stack etch cleaning methods
04/22/2009CN101416270A Ion implanter
04/22/2009CN101416231A Display panel drive circuit and display device
04/22/2009CN101416118A Device substrate washing method
04/22/2009CN101416115A Exposure apparatus
04/22/2009CN101416109A Method of forming nanopattern and substrate having pattern formed using the method
04/22/2009CN101415866A Method for manufacturing epitaxial wafer
04/22/2009CN101415628A Package handler
04/22/2009CN101415627A Substrate cassette
04/22/2009CN101415320A Component supply device
04/22/2009CN101414654A Technique for preparing high-power LED ceramic heat-dissipating substrate
04/22/2009CN101414651A Luminous diode component for apparatus stacked by high refractive index nanometer particles and manufacturing method thereof
04/22/2009CN101414649A Method of manufacturing thin-film based pv modules
04/22/2009CN101414639A Lateral wall floating gate reset EPROM memory structure and manufacturing method thereof
04/22/2009CN101414638A Display device and method of manufacturing display device
04/22/2009CN101414637A Groove insulation cross-over gate heterojunction field effect transistor
04/22/2009CN101414636A Groove insulated gate type source-leakage composite field plate transistor with high electron mobility
04/22/2009CN101414635A Groove insulated gate type gate-leakage composite field plate power device and preparation method thereof
04/22/2009CN101414634A Heterojunction field effect transistor for groove insulated gate type multiple source field plate
04/22/2009CN101414633A Groove insulated gate type composite gate field plate device with high electron mobility
04/22/2009CN101414631A Semiconductor device and manufacture method thereof
04/22/2009CN101414629A Source field plate transistor with high electron mobility
04/22/2009CN101414628A Groove Gamma gate transistor with high electron mobility and preparing method thereof
04/22/2009CN101414627A Insulated gate type source-leakage composite field plate transistor with high electron mobility and preparing method thereof
04/22/2009CN101414626A Insulated gate type gate-leakage composite field plate power device
04/22/2009CN101414625A Groove gate type gate-leakage composite field plate transistor with high electron mobility
04/22/2009CN101414624A Gamma gate heterojunction field effect transistor and preparation method thereof
04/22/2009CN101414623A Groove gate type source-leakage composite field plate heterojunction field effect transistor and preparation method thereof
04/22/2009CN101414622A Composite field plate heterojunction field effect transistor based on source field plate and leakage field plate
04/22/2009CN101414617A Solid-state image sensing device and method for manufacturing the same
04/22/2009CN101414614A Image sensor device and fabrication method thereof
04/22/2009CN101414611A Semiconductor structure and manufacture method thereof
04/22/2009CN101414610A Display unit and method of manufacturing the same
04/22/2009CN101414608A Complementary metal oxide semiconductor device and method of manufacturing the same
04/22/2009CN101414607A Semiconductor device and method for fabricating the same
04/22/2009CN101414606A Stack capacitor in semiconductor device and method for fabricating the same
04/22/2009CN101414603A Stacked semiconductor package and method for manufacturing the same
04/22/2009CN101414602A Inner imbedded type multifunctional integration type structure for integration protection element and preparation method thereof
04/22/2009CN101414600A Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same
04/22/2009CN101414595A Package substrate and manufacturing method thereof
04/22/2009CN101414591A Island-shaped loading plate and preparation method thereof
04/22/2009CN101414590A Inter-connecting structure for semiconductor package and method of the same
04/22/2009CN101414589A IC structure and method for forming the same
04/22/2009CN101414587A Semiconductor device and method for providing cooling device on the surface thereof
04/22/2009CN101414586A Package for a power semiconductor device and package method
04/22/2009CN101414585A 光学设备及其制造方法 The optical device and manufacturing method thereof
04/22/2009CN101414584A Semiconductor device and method of fabricating semiconductor device
04/22/2009CN101414582A Method of fabricating flash memory device
04/22/2009CN101414581A Semiconductor device and method for manufacturing the same
04/22/2009CN101414580A CMOS image sensor and method for fabricating the same
04/22/2009CN101414579A CMOS image sensor and method for fabricating the same
04/22/2009CN101414578A Method for forming metal line in semiconductor device
04/22/2009CN101414577A Method for manufacturing semiconductor device
04/22/2009CN101414576A Semiconductor device and method for forming barrier metal layer thereof
04/22/2009CN101414575A Method for processing silicon-based liquid crystal metal routing
04/22/2009CN101414574A Plow groove isolation integration method
04/22/2009CN101414573A Preparation method for plow groove isolation structure capable of improving smile effect
04/22/2009CN101414572A Carrier frame for electronic components and production method for electronic components
04/22/2009CN101414571A Workpiece transfer mechanism, workpiece transfer method and workpiece processing system
04/22/2009CN101414570A Semiconductor technology method and semiconductor device system
04/22/2009CN101414569A Method and structure for manufacturing conductive film, and probe card with the conductive film
04/22/2009CN101414568A Method for detecting equipment parameter filtrating chip conical defect through regulating detect
04/22/2009CN101414567A Wafer encapsulation procedure capable of degenerating pre-calcination test and high-temperature test