Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2009
04/23/2009US20090101285 Wafer spin chuck and an etcher using the same
04/23/2009US20090101284 Table for plasma processing apparatus and plasma processing apparatus
04/23/2009US20090101279 Adhesive, method of connecting wiring terminals and wiring structure
04/23/2009US20090101199 Conductive compositions and processes for use in the manufacture of semiconductor devices
04/23/2009US20090101198 Dye-sensitized solar cell and method of fabricating the same
04/23/2009US20090101197 Solar Battery and Production Method Thereof
04/23/2009US20090101180 Substrate treating apparatus and method of manufacturing the same
04/23/2009US20090101063 Method of Manufacturing GaN Crystal Substrate
04/23/2009US20090100917 Rocking y-shaped probe for critical dimension atomic force microscopy
04/23/2009US20090100911 Method for producing synthetic resin mold package, alcohol concentration sensor and apparatus for measuring alcohol concentration
04/23/2009US20090100668 Inductor formed in an integrated circuit
04/23/2009DE60133376T2 Vorrichtung zur thermischen verarbeitung von wafern A device for thermal processing of wafers
04/23/2009DE4345586B4 Verfahren zum Erzeugen von Vielfach-Dickschichtsubstraten A method of generating multiple thick film substrates
04/23/2009DE19714385B4 Verfahren zur Befestigung von Bauelementen in COB-Bauweise A process for fixing components in COB-construction
04/23/2009DE19602308B4 Ausricht-und Zuführvorrichtung für Chips Aligning and feeding device for chips
04/23/2009DE112007001436T5 CMOS-Schaltungen mit geringem Kontaktwiderstand und Verfahren zu deren Herstellung CMOS circuits with low contact resistance and process for their preparation
04/23/2009DE112007001280T5 Waferritzen mit ultrakurzen Laserimpulsen Wafer scribing with ultrashort laser pulses
04/23/2009DE112007001065T5 Verfahren und Vorrichtung zur Laserbearbeitung Method and apparatus for laser machining
04/23/2009DE112005000735B4 Siliciumelektrodenplatte für ein Plasmaätzen mit überlegener Haltbarkeit Silicon electrode plate for plasma etching with superior durability
04/23/2009DE10220189B4 Gate-Struktur für einen Transistor und Verfahren zu deren Herstellung Gate structure for a transistor and methods for their preparation
04/23/2009DE102008051560A1 Power module, particularly power semiconductor module, has housing with multiple receiving elements and carrier element, where elastic deformable cover is arranged on carrier element
04/23/2009DE102008050972A1 Halbleiter-Chipbaustein, Halbleiter-Chipbaugruppe und Verfahren zum Herstellen eines Bauelements A semiconductor chip package, semiconductor chip assembly and method of manufacturing a device
04/23/2009DE102008050511A1 Selektive Bildung einer Silizium-Kohlenstoff-Epitaxialschicht Selectively forming a silicon-carbon epitaxial layer
04/23/2009DE102008048651A1 Stapelkondensator in einem Halbleiterbauelement und Verfahren zu seiner Herstellung Stacked capacitor in a semiconductor device and process for its preparation
04/23/2009DE102008047762A1 Biosensor mit Transistorkanal im Nanobereich Biosensor with transistor channel at the nanoscale
04/23/2009DE102008047378A1 Leistungsbauelement und ein Verfahren zum Herstellen eines Leistungsbauelements Power component and a method for manufacturing a power device
04/23/2009DE102008035537A1 Halbleitervorrichtung und Verfahren zu ihrer Bildung Semiconductor device and methods for their formation
04/23/2009DE102008031511A1 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same
04/23/2009DE102007052217A1 Integrierter Schaltkreis mit NAND-Speicherzellen-Strängen An integrated circuit comprising NAND memory cell strings
04/23/2009DE102007050433A1 Halbleitermodul und Verfahren zum Herstellen eines Halbleitermoduls Semiconductor module and method for manufacturing a semiconductor module
04/23/2009DE102007050405A1 Elektrische Leistungskomponente, insbesondere Leistungshalbleiter-Modul, mit einer Kühlvorrichtung und Verfahren zum flächigen und wärmeleitenden Anbinden einer Kühlvorrichtung an eine elektrische Electric power component, in particular a power semiconductor module with a cooling device and method for two-dimensional bonding of a heat conducting and electrical cooling device to a
04/23/2009DE102007050102A1 Verfahren zur Herstellung eines Übertragungsmoduls sowie Übertragungsmodul A process for the preparation of a transfer module and transmission module
04/23/2009DE102007049811A1 Läuferscheibe, Verfahren zur Beschichtung einer Läuferscheibe sowie Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben Rotor disc, method for coating a rotor disc and method for simultaneous two-sided material-removing processing of semiconductor wafers
04/23/2009DE102007049810A1 Simultanes Doppelseitenschleifen von Halbleiterscheiben Simultaneous double side grinding of semiconductor wafers
04/23/2009DE102007049561A1 Halbleiterkörper und Verfahren zum Bearbeiten eines Halbleiterkörpers Semiconductor body and method of processing a semiconductor body
04/23/2009DE102007048957A1 Herstellungsverfahren für eine integrierte Schaltung, entsprechende integrierte Schaltungszwischenanordnung und entsprechende integrierte Schaltung Manufacturing process for an integrated circuit, an integrated circuit corresponding intermediate assembly and corresponding integrated circuit
04/23/2009DE102007047772A1 Temperierkammer zum Temperieren von elektronischen Bauelementen, insbesondere IC's Temperature chamber for controlling the temperature of electronic components, especially ICs
04/23/2009DE102007047600A1 Gripper system, particularly wafer gripper system, has primary gripping device and secondary gripping device, where secondary gripper device has support unit that is moved into primary moving direction
04/23/2009DE102006060800B4 Verfahren zum Bilden eines Grabens A method of forming a trench
04/23/2009DE102005021450B4 Integrierter Schaltkreis und Verfahren zur Herstellung eines integrierten Schaltkreises und dessen Verwendung Integrated circuit and method for producing an integrated circuit and the use thereof
04/23/2009DE102005020850B4 Dichtring für eine elektrochemische Zelle Sealing ring for an electrochemical cell
04/23/2009DE102004062224B4 Halbleitervorrichtung und Halbleitervorrichtungsmodul Semiconductor device and semiconductor device module
04/23/2009DE102004039209B4 Verfahren zur Herstellung einer n-dotierten Feldstoppzone in einem Halbleiterkörper und Halbleiterbauelement mit einer Feldstoppzone A process for producing an n-doped field stop zone in a semiconductor body and the semiconductor device having a field stop zone
04/23/2009DE102004025890B4 Substratinspektionsvorrichtung, Substratinspektionsverfahren und Verwendung des Verfahrens zum Herstellen einer Halbleitereinrichtung Substrate inspection device, substrate inspection method and use of the method for manufacturing a semiconductor device
04/23/2009DE10023154B4 Verfahren zum Löschen programmierbarer Zusammenschaltungszellen How to delete programmable interconnection cells
04/23/2009CA2702977A1 Novel chemistry used in biosensors
04/23/2009CA2701799A1 Controlled flow air precleaner
04/23/2009CA2639608A1 Method for the manufacture of a laser-inscribable and adhesive smart label
04/22/2009EP2051308A2 Method for manufacturing a nitride semiconductor device and device manufactured by the method
04/22/2009EP2051304A1 Semiconductor substrate, method for forming electrode, and method for manufacturing solar cell
04/22/2009EP2051302A1 Active matrix substrate and electronic display device
04/22/2009EP2051300A2 Package for a power semiconductor device
04/22/2009EP2051297A2 Substrate dividing method
04/22/2009EP2051296A2 Thin film transistor array and display apparatus
04/22/2009EP2051295A2 Semiconductor processing methods for forming electrical contacts, and semiconductor structures
04/22/2009EP2051294A2 Hypersensitive sensor comprising SOI flip-chip
04/22/2009EP2051293A1 Parallelism adjusting mechanism of probe card
04/22/2009EP2051292A1 Semiconductor device
04/22/2009EP2051291A2 High efficiency rectifier
04/22/2009EP2051290A1 Plasma processing method and plasma processing apparatus
04/22/2009EP2051289A1 Cleaning member, delivery member with cleaning function, and method of cleaning substrate processing apparatus
04/22/2009EP2051288A1 GaxIn1-xN SUBSTRATE AND GaxIn1-xN SUBSTRATE CLEANING METHOD
04/22/2009EP2051287A1 Method for forming conductive film, thin film transistor, panel with thin film transistor, and method for manufacturing thin film transistor
04/22/2009EP2051286A1 Semiconductor manufacturing apparatus
04/22/2009EP2051285A1 Substrate cleaning apparatus
04/22/2009EP2051282A2 Metal film production apparatus
04/22/2009EP2051064A1 Calibration method for end portion inspecting device
04/22/2009EP2051040A2 Polishing monitoring method and polishing apparatus
04/22/2009EP2050839A2 Method and apparatus for production of metal film
04/22/2009EP2050727A2 Ceramic Molded Product and Manufacturing Method Thereof
04/22/2009EP2050515A1 Cleaning member, delivery member with cleaning function, and method of cleaning substrate processing apparatus
04/22/2009EP2050140A1 Method of manufacturing a double gate transistor
04/22/2009EP2050139A1 Laminated structure, electronic element using the same, manufacturing method therefor, electronic element array, and display unit
04/22/2009EP2050133A1 Method of manufacturing semiconductor chip
04/22/2009EP2050132A2 Apparatus for storage of objects from the field of manufacture of electronic components
04/22/2009EP2050131A1 Method for producing an electric functional layer on a surface of a substrate
04/22/2009EP2050130A2 Transponder and method of producing a transponder
04/22/2009EP2050129A2 Device chip carriers, modules, and methods of forming thereof
04/22/2009EP2050127A2 Nanocrystalline materials for electronic applications
04/22/2009EP2050126A2 GROWTH OF MONOCRYSTALLINE GeN ON A SUBSTRATE
04/22/2009EP2050125A1 Strained layers within semiconductor buffer structures
04/22/2009EP2050124A1 Method of fabricating semiconductor devices on a group iv substrate with controlled interface properties and diffusion tails
04/22/2009EP2050119A1 Method and device for etching a substrate by means of a plasma
04/22/2009EP2049939A1 Light modulators comprising si-ge quantum well layers
04/22/2009EP2049710A1 Master electrode and method of forming it
04/22/2009EP2049304A1 Chemical mechanical polishing pads comprising liquid organic material core encapsulated in polymer shell and methods for producing the same
04/22/2009EP2003686A9 Field effect transistor
04/22/2009EP2003478A9 Projection optical system, aligner, and method for fabricating device
04/22/2009EP2003148A9 Fluorine-containing polymer, purification method, and radiation-sensitive resin composition
04/22/2009EP1859479B8 Method for microstructuring solid surfaces
04/22/2009EP1741127A4 Planar avalanche photodiode
04/22/2009EP1579368A4 Method and apparatus for monitoring a material processing system
04/22/2009EP1461414B1 Assembly for cell-based assays
04/22/2009EP1442307B1 System for compensating thermally induced motion of probe cards
04/22/2009EP1421612B1 LDMOS Transistor and method of fabricating the same
04/22/2009EP1347804A4 Ion implantation system and control method
04/22/2009EP1317768B1 Dry isotropic removal of inorganic anti-reflective coating after poly gate etching
04/22/2009EP1245036A4 Ion implantation ion source, system and method
04/22/2009EP1166340A4 Polymer-based electrospray nozzle for mass spectrometry
04/22/2009EP1023641A4 Design rule checking system and method