Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2009
05/21/2009US20090130812 Creating High Voltage FETs with Low Voltage Process
05/21/2009US20090130811 Method for manufacturing semiconductor device with uniform concentration ion doping in recess gate channel region
05/21/2009US20090130810 Fabrication method
05/21/2009US20090130809 Semiconductor memory device and method of manufacturing the same
05/21/2009US20090130808 Method of fabricating flash memory
05/21/2009US20090130807 Trench DRAM Cell with Vertical Device and Buried Word Lines
05/21/2009US20090130806 Power semiconductor component with charge compensation structure and method for the fabrication thereof
05/21/2009US20090130805 Advanced cmos using super steep retrograde wells
05/21/2009US20090130804 Method of fabricating semiconductor device
05/21/2009US20090130803 Stressed field effect transistor and methods for its fabrication
05/21/2009US20090130801 Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same
05/21/2009US20090130800 Manufacturing method of semiconductor device
05/21/2009US20090130799 Stacked dual MOSFET package
05/21/2009US20090130798 Process for Making a Semiconductor System
05/21/2009US20090130796 Sulfurization and Selenization of Electrodeposited Cigs Films by Thermal Annealing
05/21/2009US20090130795 Systems and methods for preparation of epitaxially textured thick films
05/21/2009US20090130793 Photo diode and method for manufacturing the same
05/21/2009US20090130791 Camera modules and methods of fabricating the same
05/21/2009US20090130790 Method for manufacturing nitride semiconductor light-emitting element
05/21/2009US20090130788 Flat panel display device and fabricating method thereof
05/21/2009US20090130787 Method for fabricating a plurality of electromagnetic radiation emitting semiconductor chips
05/21/2009US20090130786 Organic electroluminescent display device and method of fabricating the same
05/21/2009US20090130785 Manufacturing method of semiconductor integrated circuit device
05/21/2009US20090130784 Method for determining the position of the edge bead removal line of a disk-like object
05/21/2009US20090130783 Method of fabricating an ultra-small condenser microphone
05/21/2009US20090130782 Method and line for manufacturing semiconductor device
05/21/2009US20090130781 Method for simultaneously producing multiple wafers during a single epitaxial growth run and semiconductor structure grown thereby
05/21/2009US20090130780 Semiconductor processing system and method of processing a semiconductor wafer
05/21/2009US20090130779 Method of Forming a Magnetic Tunnel Junction Structure
05/21/2009US20090130614 Development device and development method
05/21/2009US20090130605 Resist composition
05/21/2009US20090130601 Method for fabricating semiconductor device
05/21/2009US20090130574 Sputtering target used for production of reflective mask blank for euv lithography
05/21/2009US20090130571 Masking process using photoresist
05/21/2009US20090130392 Method of producing a thin layer of semiconductor material
05/21/2009US20090130380 Method for manufacturing pourous structure and method for forming pattern
05/21/2009US20090130016 Doped thermionic cathode and method of making doped thermionic cathode
05/21/2009US20090130014 Silicon recycling method, and silicon and silicon ingot manufactured with that method
05/21/2009US20090129897 Side opening unified pod
05/21/2009US20090129612 Electretization method of condenser microphone, electretization apparatus, and manufacturing method of condenser microphone using it
05/21/2009US20090129419 Vcsel array device and method for manufacturing the vcsel array device
05/21/2009US20090129418 Semiconductor laser device and method of manufacturing the same
05/21/2009US20090129417 Surface-Emitting Laser Diode and Method of Manufacturing the Same
05/21/2009US20090129162 Method of making a non-volatile memory (NVM) cell structure and program biasing techniques for the NVM cell structure
05/21/2009US20090129143 Spin transfer MRAM device with separated CPP assisted writing
05/21/2009US20090129142 Semiconductor memory
05/21/2009US20090129028 Power module and method of fabricating the same
05/21/2009US20090128991 Methods and apparatuses for stacked capacitors for image sensors
05/21/2009US20090128793 Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method
05/21/2009US20090128768 Self-planarized passivation dielectric for liquid crystal on silicon structure and related method
05/21/2009US20090128728 Thin film transistor device, liquid crystal display device using the same, and method of fabricating the same
05/21/2009US20090128248 Filter and manufacturing method thereof
05/21/2009US20090128188 Pad invariant FPGA and ASIC devices
05/21/2009US20090128134 Semiconductor integrated circuit apparatus, measurement result management system, and management server
05/21/2009US20090128025 Dual panel type organic electroluminescent device and method of fabricating the same
05/21/2009US20090128022 Organic light emitting device and manufacturing method thereof
05/21/2009US20090127746 Heat treatment jig and heat treatment method for silicon wafer
05/21/2009US20090127722 Method for Processing a Spacer Structure, Method of Manufacturing an Integrated Circuit, Semiconductor Device and Intermediate Structure with at Least One Spacer Structure
05/21/2009US20090127720 Drop-mold conformable material as an encapsulation for an integrated circuit package system
05/21/2009US20090127719 Integrated circuit package system with package substrate having corner contacts
05/21/2009US20090127718 Flip chip wafer, flip chip die and manufacturing processes thereof
05/21/2009US20090127716 Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method
05/21/2009US20090127714 Contact plug of semiconductor device and method of forming the same
05/21/2009US20090127712 Nanotube-based directionally-conductive adhesive
05/21/2009US20090127711 Interconnect structure and method of making same
05/21/2009US20090127708 Copper pillar tin bump on semiconductor chip and method of forming the same
05/21/2009US20090127707 Semiconductor device and method for manufacturing the same
05/21/2009US20090127705 Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device
05/21/2009US20090127704 Method and System for Providing a Reliable Semiconductor Assembly
05/21/2009US20090127703 Method and System for Providing a Low-Profile Semiconductor Assembly
05/21/2009US20090127702 Package, subassembly and methods of manufacturing thereof
05/21/2009US20090127700 Thermal conductor lids for area array packaged multi-chip modules and methods to dissipate heat from multi-chip modules
05/21/2009US20090127697 Housing with a Cavity for a Mechanically-Sensitive Electronic Component and Method for Production
05/21/2009US20090127695 Surface mount package with enhanced strength solder joint
05/21/2009US20090127692 Method of connecting a semiconductor package to a printed wiring board
05/21/2009US20090127691 Semiconductor Power Module Packages with Simplified Structure and Methods of Fabricating the Same
05/21/2009US20090127690 Package and Manufacturing Method for a Microelectronic Component
05/21/2009US20090127686 Stacking die package structure for semiconductor devices and method of the same
05/21/2009US20090127685 Power Device Packages and Methods of Fabricating the Same
05/21/2009US20090127683 Integrated circuit package system with insulator
05/21/2009US20090127682 Chip package structure and method of fabricating the same
05/21/2009US20090127681 Semiconductor package and method of fabricating the same
05/21/2009US20090127680 Integrated circuit package-in-package system with wire-in-film encapsulant
05/21/2009US20090127677 Multi-Terminal Package Assembly For Semiconductor Devices
05/21/2009US20090127676 Back to Back Die Assembly For Semiconductor Devices
05/21/2009US20090127673 Method for producing semi-conducting devices and devices obtained with this method
05/21/2009US20090127672 Susceptor for epitaxial layer forming apparatus, epitaxial layer forming apparatus, epitaxial wafer, and method of manufacturing epitaxial wafer
05/21/2009US20090127670 Semiconductor device, method for manufacturing the same and mask pattern for manufacturing the same
05/21/2009US20090127669 Method for forming interlayer dielectric film, interlayer dielectric film, semiconductor device and semiconductor manufacturing apparatus
05/21/2009US20090127668 Stacked semiconductor device and method of forming serial path thereof
05/21/2009US20090127667 Semiconductor chip device having through-silicon-via (TSV) and its fabrication method
05/21/2009US20090127666 Semiconductor device, method of manufacturing the same, and phase shift mask
05/21/2009US20090127665 Semiconductor device and manufacturing method thereof
05/21/2009US20090127663 Group iii nitride semiconductor crystal growing method, group iii nitride semiconductor crystal substrate fabrication method, and group iii nitride semiconductor crystal substrate
05/21/2009US20090127661 Nitride semiconductor device and method of manufacturing the same
05/21/2009US20090127660 Structure and method for forming a guard ring to protect a control device in a power semiconductor ic
05/21/2009US20090127659 Bipolar junction transistor with a low collector resistance and method of forming the bipolar junction transistor in a CMOS process flow
05/21/2009US20090127658 Resistor in an integrated circuit
05/21/2009US20090127657 Semiconductor device and method of manufacturing the same
05/21/2009US20090127655 Capacitor for semiconductor device and method for fabricating the same
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