| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/20/2009 | EP2060533A2 Semiconductor device and method of manufacturing the same |
| 05/20/2009 | EP2060326A2 Device and method to wet-treat goods |
| 05/20/2009 | EP2059947A2 Method and system for continuous large-area scanning implantation process |
| 05/20/2009 | EP2059946A1 Micropipe-free silicon carbide and related method of manufacture |
| 05/20/2009 | EP2059945A1 Device for wetting bumps of a semiconductor chip with a liquid substance |
| 05/20/2009 | EP2059328A1 Method of pumping gas |
| 05/20/2009 | EP2006894A9 Semiconductor device and process for producing the same |
| 05/20/2009 | EP1999792A4 Shielded gate trench(sgt) mosfet cells implemented with a schottky source contact |
| 05/20/2009 | EP1961035B1 Device and method for treating the surfaces of substrates |
| 05/20/2009 | EP1801866B1 Method of manufacturing a semiconductor device |
| 05/20/2009 | EP1719162A4 Method of making a semiconductor device using treated photoresist |
| 05/20/2009 | EP1696567B1 Level shift circuit, actuator apparatus using the same, and optical switch system |
| 05/20/2009 | EP1523585B1 Loading and unloading device for a coating unit |
| 05/20/2009 | EP1508584B1 Adhesive resin and film adhesives made by using the same |
| 05/20/2009 | EP1459390B1 Delta doped silicon carbide metal-semiconductor field effect transistors and methods of fabricating them |
| 05/20/2009 | EP1366207B1 Plating method of metal film on the surface of polymer |
| 05/20/2009 | EP1312115B1 Semiconductor arrangement and method for production thereof |
| 05/20/2009 | EP1243023B1 An insitu post etch process to remove remaining photoresist and residual sidewall passivation |
| 05/20/2009 | EP1146967A4 Flow controller |
| 05/20/2009 | EP0939431B1 Cerium oxide abrasive and method of abrading substrates |
| 05/20/2009 | DE20122889U1 Röntgensystem X-ray system |
| 05/20/2009 | DE112007001460T5 Flüssigkeitsauslassverfahren und Flüssigkeitsauslassvorrichtung in einer Temperatursteuervorrichtung Flüssigkeitsauslassverfahren and liquid discharging in a temperature control device |
| 05/20/2009 | DE112007001365T5 Elektrodenbondierungsverfahren und Teilmontageeinrichtung Elektrodenbondierungsverfahren and part mounting device |
| 05/20/2009 | DE112007001161T5 Selektives Bilden von Abstandhaltern auf Transistoren unterschiedlicher Klassen auf derselben Baugruppe Selectively forming spacers on transistors of different classes on the same assembly |
| 05/20/2009 | DE10318074B4 Verfahren zur Herstellung von BOC Modul Anordnungen mit verbesserten mechanischen Eigenschaften Process for the preparation of BOC module assemblies with improved mechanical properties |
| 05/20/2009 | DE102008056194A1 Vorrichtung und Verfahren zum Stoppen eines Ätzprozesses Apparatus and method for stopping an etching process |
| 05/20/2009 | DE102008052470A1 Verfahren zum Prozessieren eines Kontaktpads, Verfahren zum Herstellen eines Kontaktpads und integriertes Schaltkreiselement A method for processing a contact pad, methods of making a contact pad and integrated circuit element |
| 05/20/2009 | DE102008051465A1 Halbleiterbaustein Semiconductor device |
| 05/20/2009 | DE102008051464A1 Halbleiterbaustein Semiconductor device |
| 05/20/2009 | DE102008051259A1 Leistungshalbleiterbauelement Power semiconductor component |
| 05/20/2009 | DE102008049059A1 Ein Wafer und ein Verfahren zum Vereinzeln eines Wafers A wafer and a method of dicing a wafer |
| 05/20/2009 | DE102008048424A1 Elektronikbauelement Electronic component |
| 05/20/2009 | DE102008048423A1 Integriertes Schaltungsbauelement The integrated circuit device |
| 05/20/2009 | DE102008010784B3 Wärmeabfuhrtechnisch polyvalente Wärmeübertragungsvorrichtung für wenigstens ein Halbleiterbauelement sowie zugehöriges Test- und Betriebsverfahren Heat dissipation Technically polyvalent heat transfer device for at least a semiconductor device and associated testing and operating procedures |
| 05/20/2009 | DE102008007543B3 Stack of chips has multiple semiconductor chips arranged on one another, where each semiconductor chip has upper side, lower side and lateral surface encircling border of upper and lower sides |
| 05/20/2009 | DE102007054851A1 MBE-Einrichtung und Verfahren zu deren Betrieb MBE device and method for its operation |
| 05/20/2009 | DE102007053249A1 Semiconductor body has longitudinal structure with multiple rectangular-shaped areas, which contain integrated circuits, and other multiple areas, formed as scribed frame |
| 05/20/2009 | DE102007052053A1 Eine Zugverformungsquelle unter Anwendung von Silizium/Germanium-Material in global verformtem Silizium A Zugverformungsquelle using silicon / germanium material in globally strained silicon |
| 05/20/2009 | DE102007026745B4 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same |
| 05/20/2009 | DE102006039001B4 Verfahren zum Herstellen einer mehrschichtigen Verbindungsstruktur A method for manufacturing a multilayer interconnection structure |
| 05/20/2009 | DE102005063468B4 Verfahren zum Herstellen eines Flaschengrabens und eines Flaschengrabenkondensators A method of manufacturing a bottle and a bottle trench capacitor grave |
| 05/20/2009 | DE102005034011B4 Halbleiterbauteil für Hochfrequenzen über 10 GHz und Verfahren zur Herstellung desselben Of the same semiconductor device for high frequencies exceeding 10 GHz and methods for preparing |
| 05/20/2009 | DE102004048201B4 Halbleiterbauteil mit Haftvermittlerschicht, sowie Verfahren zu deren Herstellung A semiconductor device comprising an adhesion promoter layer, as well as processes for their preparation |
| 05/20/2009 | DE10146854B4 Elektronisches Bauteil mit wenigstens einem Halbleiterchip und Verfahren zur Herstellung eines elektronischen Bauteils mit wenigstens einem Halbleiterchip Electronic component with at least one semiconductor chip and method for producing an electronic component comprising at least one semiconductor chip |
| 05/20/2009 | CN201243011Y Frame for bearing silicon chip |
| 05/20/2009 | CN201243010Y Silicon chip flower basket |
| 05/20/2009 | CN201243009Y Quick-dismantling mechanism for thimble |
| 05/20/2009 | CN201243008Y Sprinkling anti-pollution device |
| 05/20/2009 | CN201242659Y Acceptance cabinet body structure |
| 05/20/2009 | CN201239920Y 研磨垫 Abrasive pad |
| 05/20/2009 | CN201239914Y Lock ring spiro union structure for clamp of chemical-mechanical lapping bench |
| 05/20/2009 | CN201239910Y Polishing pad regulator and chemical mechanical device equipped therewith |
| 05/20/2009 | CN101438632A Apparatus and method for generating atmospheric-pressure plasma |
| 05/20/2009 | CN101438429A III nitride compound semiconductor laminated structure |
| 05/20/2009 | CN101438418A Photoelectric conversion element and manufacturing method of photoelectric conversion element |
| 05/20/2009 | CN101438414A Isolation structure for semiconductor device with multiple terminals |
| 05/20/2009 | CN101438412A Semiconductor device having a semiconductor-on-insulator configuration and a superlattice and associated methods |
| 05/20/2009 | CN101438406A Light-emitting device with inorganic housing |
| 05/20/2009 | CN101438400A Dynamic memory cell structures |
| 05/20/2009 | CN101438399A Ion implantation combined with in situ or ex situ heat treatment for improved field effect transistors |
| 05/20/2009 | CN101438398A Method for fabricating a gate dielectric of a field effect transistor |
| 05/20/2009 | CN101438397A Imaging position correction method, imaging method, and substrate imaging apparatus |
| 05/20/2009 | CN101438396A Grooved substrates for uniform underfilling solder ball assembled electronic devices |
| 05/20/2009 | CN101438395A Semiconductor on glass insulator made using improved thinning process |
| 05/20/2009 | CN101438394A Semiconductor process integrating source/drain stressors and interlevel dielectric layer stressors |
| 05/20/2009 | CN101438393A Method for making an integrated circuit having an embedded non-volatile memory |
| 05/20/2009 | CN101438392A Non-volatile nanocrystal memory and method therefor |
| 05/20/2009 | CN101438391A Method and apparatus for photo-excitation of chemicals for atomic layer deposition of dielectric film |
| 05/20/2009 | CN101438390A A method of fabricating a structure for a semiconductor device |
| 05/20/2009 | CN101438389A Recessed workfunction metal in CMOS transistor gates |
| 05/20/2009 | CN101438388A Dielectric spacers for metal interconnects and method to form the same |
| 05/20/2009 | CN101438387A Batch processing platform for ALD and CVD |
| 05/20/2009 | CN101438386A Intermediate tone mask with a plurality of semi-permeation parts and method of manufacturing the same |
| 05/20/2009 | CN101438385A Exposure apparatus and device manufacturing method |
| 05/20/2009 | CN101438384A Server and program |
| 05/20/2009 | CN101438383A Device and method for wet treating plate-like substrates |
| 05/20/2009 | CN101438382A Electronic device including a guest material within a layer and a process for forming the same |
| 05/20/2009 | CN101438246A Semiconductor IC |
| 05/20/2009 | CN101438217A Time weighted moving average filter |
| 05/20/2009 | CN101438210A Photosensitive composition, photosensitive film, photosensitive laminate, method of forming permanent pattern and printed board |
| 05/20/2009 | CN101438208A Photosensitive resin composition |
| 05/20/2009 | CN101438207A Method for making an improved thin film solar cell interconnect using etch and deposition processes |
| 05/20/2009 | CN101437981A In-situ chamber clean process to remove by-product deposits from chemical vapor etch chamber |
| 05/20/2009 | CN101437914A Adhesive sheet, and connecting structure for circuit member and semiconductor device which use the adhesive sheet |
| 05/20/2009 | CN101437912A Oxidation-stabilized cmp compositions and methods |
| 05/20/2009 | CN101437364A Device mounting structure and device mounting method |
| 05/20/2009 | CN101437354A Plasma processing apparatus |
| 05/20/2009 | CN101436639A Method for making led encapsulation substrate |
| 05/20/2009 | CN101436634A Photosemiconductor package, manufacturing method thereof and photoelectric sensor equipped therewith |
| 05/20/2009 | CN101436632A LED chip component with heat-dissipating substrate and preparation method thereof |
| 05/20/2009 | CN101436631A Method for packaging LED |
| 05/20/2009 | CN101436614A Antimonous schottky diode and self-aligning manufacturing method |
| 05/20/2009 | CN101436613A Transparent thin-film transistor and manufacturing method of the transistor |
| 05/20/2009 | CN101436612A Field effect transistor and method for forming the same |
| 05/20/2009 | CN101436607A Electric resistance transition memory and manufacturing method thereof |
| 05/20/2009 | CN101436605A Image sensor and method for manufacturing thereof |
| 05/20/2009 | CN101436604A Image sensor and method of manufacturing the same |
| 05/20/2009 | CN101436600A Semiconductor device and method for manufacturing the same, and electric device |
| 05/20/2009 | CN101436599A Semiconductor device and method of manufacturing the same |
| 05/20/2009 | CN101436597A Ferro-electricity film capacitor for ferro-electric memory and preparation method thereof |