| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/22/2009 | WO2009063584A1 Programmable device, control method of device and information processing system |
| 05/22/2009 | WO2009063583A1 Method for manufacturing flexible semiconductor device and flexible semiconductor device |
| 05/22/2009 | WO2009063582A1 Semiconductor device and method for manufacturing the same |
| 05/22/2009 | WO2009063562A1 Substrate transport device |
| 05/22/2009 | WO2009063372A1 Thermal stress reduction |
| 05/22/2009 | WO2009063288A1 Semiconductor structure having a protective layer |
| 05/22/2009 | WO2009063046A1 Method for fabricating isolated integrated semiconductor structures |
| 05/22/2009 | WO2009062887A1 Method and apparatus for ultrasonic bonding |
| 05/22/2009 | WO2009062882A2 Method for manufacturing a solar cell with a surface-passivating dielectric double layer, and corresponding solar cell |
| 05/22/2009 | WO2009062876A1 Reverse-conducting insulated gate bipolar transistor and corresponding manufacturing method |
| 05/22/2009 | WO2009062757A1 Method for connecting two joining surfaces |
| 05/22/2009 | WO2009062744A1 Method for dividing monocrystals |
| 05/22/2009 | WO2009062397A1 Corrosion inhibitor for semiconductor chip metal substrate and use method thereof |
| 05/22/2009 | WO2009046311A3 Composite slurries of nano silicon carbide and alumina |
| 05/22/2009 | WO2009046219A3 Mosfet active area and edge termination area charge balance |
| 05/22/2009 | WO2009046114A3 Two-transistor floating-body dynamic memory cell |
| 05/22/2009 | WO2009045864A3 Methods of low-k dielectric and metal process integration |
| 05/22/2009 | WO2009045635A3 Phase change memory structures |
| 05/22/2009 | WO2009045371A3 Flip chip interconnection with double post |
| 05/22/2009 | WO2009045050A3 Fluidic channel system and method for fabricating fine structure |
| 05/22/2009 | WO2009043008A3 Methods and arrangement for creating models for fine-tuning recipes |
| 05/22/2009 | WO2009042741A3 Method of enabling selective area plating on a substrate |
| 05/22/2009 | WO2009042461A3 Techniques for optical ion beam metrology |
| 05/22/2009 | WO2009036273A3 Horizontally depleted metal semiconductor field effect transistor |
| 05/22/2009 | WO2009035868A3 Intelligent inspection based on test chip probe failure maps |
| 05/22/2009 | WO2009035259A3 Apparatus for cutting processing memory card |
| 05/22/2009 | WO2009034496A3 Wafer, method of manufacturing integrated circuits on a wafer, and method of storing data about said circuits |
| 05/22/2009 | WO2009033126A3 Transport system with buffering |
| 05/22/2009 | WO2009032575A3 Semiconductor device having reduced single bit fails and a method of manufacture thereof |
| 05/22/2009 | WO2009023305A3 Method and system for printing aligned nanowires and other electrical devices |
| 05/22/2009 | WO2009020572A3 Stack packages using reconstituted wafers |
| 05/22/2009 | WO2009019266A3 Method of low-temperature transfer from a layer of self-assembled molecules |
| 05/22/2009 | WO2009019265A3 Method of transferring a layer onto a liquid material |
| 05/22/2009 | WO2009015984A3 Wafer joining method, wafer assemblage, and chip |
| 05/22/2009 | WO2009013409A3 Method for producing a set of chips mechanically interconnected by means of a flexible connection |
| 05/22/2009 | WO2008146869A3 Pattern forming method, pattern or mold formed thereby |
| 05/22/2009 | WO2008134225A3 Integrated circuit switching device, structure and method of manufacture |
| 05/22/2009 | WO2008051415A9 Method of manufacturing stacked chip packages |
| 05/22/2009 | WO2007041454A3 Systems and methods for determination of endpoint of chamber cleaning processes |
| 05/22/2009 | WO2007011438A3 Method and structure for reduction of soft error rates in integrated circuits |
| 05/22/2009 | WO2007005189A3 Source side injection storage device and method therefor |
| 05/22/2009 | WO2006130430A3 Photocathode structure and operation |
| 05/22/2009 | WO2006127914A3 Trench-gate field effect transistors and methods of forming the same |
| 05/21/2009 | US20090132880 Multiple-capture DFT system for detecting or locating crossing clock-domain faults during self-test or scan-test |
| 05/21/2009 | US20090132078 Controlling device for substrate processing apparatus and method therefor |
| 05/21/2009 | US20090131245 Controlled and selective formation of catalyst nanaoparticles |
| 05/21/2009 | US20090130956 Polishing apparatus and polishing method |
| 05/21/2009 | US20090130865 Method of patterning a layer using a pellicle |
| 05/21/2009 | US20090130864 Systems and methods for flash annealing of semiconductor devices |
| 05/21/2009 | US20090130863 Method and system for forming an air gap structure |
| 05/21/2009 | US20090130862 Multi-functional cyclic silicate compound, siloxane-based polymer prepared from the compound and process of producing insulating film using the polymer |
| 05/21/2009 | US20090130861 Dual damascene integration structures and method of forming improved dual damascene integration structures |
| 05/21/2009 | US20090130860 Method of manufacturing a semiconductor device and processing apparatus |
| 05/21/2009 | US20090130859 Semiconductor Device Manufacturing Method and Substrate Processing Apparatus |
| 05/21/2009 | US20090130858 Deposition system and method using a delivery head separated from a substrate by gas pressure |
| 05/21/2009 | US20090130857 Method of manufacturing a structure based on anisotropic etching, and silicon substrate with etching mask |
| 05/21/2009 | US20090130856 Method for monitoring process drift using plasma characteristics |
| 05/21/2009 | US20090130855 Phase change alloy etch |
| 05/21/2009 | US20090130854 Patterning structure and method for semiconductor devices |
| 05/21/2009 | US20090130853 Method for fabricating a deep trench in a substrate |
| 05/21/2009 | US20090130852 Process for improving critical dimension uniformity of integrated circuit arrays |
| 05/21/2009 | US20090130851 Method for manufacturing semiconductor device |
| 05/21/2009 | US20090130850 Semiconductor Devices and Method of Fabricating the Same |
| 05/21/2009 | US20090130849 Chemical mechanical polishing and wafer cleaning composition comprising amidoxime compounds and associated method for use |
| 05/21/2009 | US20090130848 Semiconductor device and method for production thereof |
| 05/21/2009 | US20090130847 Method of fabricating metal pattern without damaging insulation layer |
| 05/21/2009 | US20090130846 Semiconductor device fabrication method |
| 05/21/2009 | US20090130845 Direct electrodeposition of copper onto ta-alloy barriers |
| 05/21/2009 | US20090130844 Method of Forming Metal Line of Semiconductor Device |
| 05/21/2009 | US20090130843 Method of forming low-resistivity recessed features in copper metallization |
| 05/21/2009 | US20090130842 Method of forming contact hole and method of manufacturing semiconductor memory device using the same |
| 05/21/2009 | US20090130841 Method for forming contact in semiconductor device |
| 05/21/2009 | US20090130840 Protected Solder Ball Joints in Wafer Level Chip-Scale Packaging |
| 05/21/2009 | US20090130839 Manufacturing method of redistribution circuit structure |
| 05/21/2009 | US20090130838 Method of forming conductive bumps |
| 05/21/2009 | US20090130837 In situ deposition of a low k dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application |
| 05/21/2009 | US20090130836 Method of fabricating flash cell |
| 05/21/2009 | US20090130835 Method of manufacturing inverted t-shaped floating gate memory |
| 05/21/2009 | US20090130834 Methods of forming impurity containing insulating films and flash memory devices including the same |
| 05/21/2009 | US20090130833 Insulating buffer film and high dielectric constant semiconductor device and method for fabricating the same |
| 05/21/2009 | US20090130832 Silicon surface structuring method |
| 05/21/2009 | US20090130831 Semiconductor device and method of fabricating the same |
| 05/21/2009 | US20090130830 Method for fabricating optical semiconductor device |
| 05/21/2009 | US20090130829 Manufacturing method of semiconductor device and substrate processing apparatus |
| 05/21/2009 | US20090130828 Method for Forming Voltage Sustaining Layer with Opposite-Doped Islands for Semiconductor Power Devices |
| 05/21/2009 | US20090130827 Intrinsic amorphous silicon layer |
| 05/21/2009 | US20090130826 Method of Forming a Semiconductor Device Having a Strained Silicon Layer on a Silicon-Germanium Layer |
| 05/21/2009 | US20090130825 Joined Assembly, Wafer Holding Assembly, Attaching Structure Thereof and Method for Processing Wafer |
| 05/21/2009 | US20090130824 Arsenic and phosphorus doped silicon wafer substrates having intrinsic gettering |
| 05/21/2009 | US20090130823 Method of forming semiconductor device including trench gate structure |
| 05/21/2009 | US20090130822 Process for collective manufacturing of small volume high precision membranes and cavities |
| 05/21/2009 | US20090130821 Three dimensional packaging with wafer-level bonding and chip-level repair |
| 05/21/2009 | US20090130820 Method for manufacturing a semiconductor device |
| 05/21/2009 | US20090130819 Method for manufacturing semiconductor device |
| 05/21/2009 | US20090130818 Method for forming shallow trench isolation structure and method for preparing recessed gate structure using the same |
| 05/21/2009 | US20090130817 Method to eliminate re-crystallization border defects generated during solid phase epitaxy of a dsb substrate |
| 05/21/2009 | US20090130816 Method for manufacturing simox wafer and simox wafer manufactured thereby |
| 05/21/2009 | US20090130815 Semiconductor device and method for fabricating the same |
| 05/21/2009 | US20090130814 Semiconductor methods |
| 05/21/2009 | US20090130813 Method and System to Provide a Polysilicon Capacitor with Improved Oxide Integrity |