| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 06/10/2009 | EP2068350A1 Multiple layer floating gate non-volatile memory device |
| 06/10/2009 | EP2068349A1 Stage device and exposure device |
| 06/10/2009 | EP2068348A1 Conductive isostructural compounds |
| 06/10/2009 | EP2068160A2 Apparatus and method for observing defects in semiconductor wafers |
| 06/10/2009 | EP2068112A1 Mobile unit system, pattern forming device, exposing device, exposing method, and device manufacturing method |
| 06/10/2009 | EP2067884A1 III Nitride crystal substrate, and light-emitting device and method of its manufacture |
| 06/10/2009 | EP2067880A1 Electroless plating method |
| 06/10/2009 | EP2067879A1 Plated material having metal thin film formed by electroless plating, and method for production thereof |
| 06/10/2009 | EP2067878A1 Plated material having metal thin film formed by electroless plating, and method for production thereof |
| 06/10/2009 | EP2067875A1 Method of forming film and film forming apparatus |
| 06/10/2009 | EP2067571A2 Polishing apparatus and polishing method |
| 06/10/2009 | EP2067173A1 Semiconductor device and manufacturing method thereof |
| 06/10/2009 | EP2067169A1 Shielding floating gate tunneling element structure |
| 06/10/2009 | EP2067168A2 Reduced leakage dram memory cells with vertically oriented nanorods and manufacturing methods therefor |
| 06/10/2009 | EP2067167A1 Electronic device and method for making the same |
| 06/10/2009 | EP2067166A1 Method and device for wetting the bumps of a semiconductor chip with soldering flux |
| 06/10/2009 | EP2067165A2 Method of manufacturing an integrated circuit |
| 06/10/2009 | EP2067164A1 Semiconductor device and method of forming a semiconductor device |
| 06/10/2009 | EP2067163A2 Masking of and material constraint for depositing battery layers on flexible substrates |
| 06/10/2009 | EP2067162A2 Device and method for removing liquid from a surface of a disc-like article |
| 06/10/2009 | EP2066593A1 Mechanically flexible and durable substrates and method of making |
| 06/10/2009 | EP1815506A4 Method to enhance cmos transistor performance by inducing strain in the gate and channel |
| 06/10/2009 | EP1783148B1 High-molecular compound, acid generator, positive resist compositions, and method for formation of resist patterns |
| 06/10/2009 | EP1721344A4 Method of manufacturing a superjunction device |
| 06/10/2009 | EP1622742A4 Chemical mechanical polishing compositions for step-ii copper liner and other associated materials and method of using same |
| 06/10/2009 | EP1588412A4 Diffusion barrier and method therefor |
| 06/10/2009 | EP1586007A4 Electron beam processing for mask repair |
| 06/10/2009 | EP1570511A4 RELAXED SiGe LAYERS ON Si OR SILICON-ON-INSULATOR SUBSTRATES BY ION IMPLANTATION AND THERMAL ANNEALING |
| 06/10/2009 | EP1529310A4 Porous low-k dielectric interconnect structures |
| 06/10/2009 | EP1478976B1 Critical dimension control using full phase and trim masks |
| 06/10/2009 | EP1476872B1 Extraction of a binary code from physical parameters of an integrated circuit |
| 06/10/2009 | EP1350264A4 Method for forming a pattern and a semiconductor device |
| 06/10/2009 | EP1133440A4 Automated opening and closing of ultra clean storage containers |
| 06/10/2009 | EP1090159B8 Deposition of coatings using an atmospheric pressure plasma jet |
| 06/10/2009 | EP1025584B1 Integrated electronic circuit comprising at least an electronic power component |
| 06/10/2009 | EP1016129B2 Controlling threading dislocation densities using graded layers and planarization |
| 06/10/2009 | EP0944851B1 Assembly of optical components optically aligned and method for making this assembly |
| 06/10/2009 | DE602005005872T2 Herstellungsverfahren einer Klebefolie zum Lasersplaten mit einer kontrollierten Oberflächenrauhigkeit (Ra) Manufacturing process of an adhesive sheet for laser Platen with controlled surface roughness (Ra) |
| 06/10/2009 | DE19926756B4 Elektronische Schaltkreisvorrichtung und Verfahren zum Herstellen derselben Electronic circuit device and method of manufacturing the same |
| 06/10/2009 | DE19924583B4 Verfahren und Einrichtung zur Oberflächenzustandsüberwachung Method and apparatus for surface condition monitoring |
| 06/10/2009 | DE112007001892T5 P-Kanal-Feldeffekttransistor aus nanokristallinem Diamant P-channel field-effect transistor of nanocrystalline diamond |
| 06/10/2009 | DE112007001860T5 Siliziumcarbidhalbleitervorrichtung und Verfahren zu deren Herstellung Siliziumcarbidhalbleitervorrichtung and processes for their preparation |
| 06/10/2009 | DE10356367B4 Verfahren zur Herstellung eines Bauelements und Bauelement A method for producing a component and component |
| 06/10/2009 | DE10343257B4 Verfahren zur Herstellung von Zwischenverbindungen bei Chip-Sandwich-Anordnungen Process for the preparation of intermediate compounds in chip-sandwich assemblies |
| 06/10/2009 | DE10260155B4 Verfahren zur Herstellung einer Halbleitereinrichtung A process for producing a semiconductor device |
| 06/10/2009 | DE10247017B4 SiC-Einkristall, Verfahren zur Herstellung eines SiC-Einkristalls, SiC-Wafer mit einem Epitaxiefilm und Verfahren zur Herstellung eines SiC-Wafers, der einen Epitaxiefilm aufweist SiC single crystal, methods for producing an SiC single crystal, SiC wafer with an epitaxial film and method for manufacturing a SiC wafer having an epitaxial film |
| 06/10/2009 | DE10240449B4 Verfahren zur Herstellung einer dielektrischen Schicht mit geringem Leckstrom, wobei eine erhöhte kapazitive Kopplung erzeugt wird A process for preparing a dielectric layer having a low leakage current, wherein an increased capacitive coupling is generated |
| 06/10/2009 | DE10223709B4 Verfahren zum Herstellen eines Doppel-Gate-Transistors A method of manufacturing a double gate transistor |
| 06/10/2009 | DE10205563B4 Gehäustes Halbleiterbauelement mit zwei Die-Paddles sowie zugehöriges Herstellungsverfahren A housed semiconductor component with two paddles and the manufacturing method thereof |
| 06/10/2009 | DE10203198B4 Verfahren zur Materialbearbeitung mit Laserimpulsen großer spektraler Bandbreite und Vorrichtung zur Durchführung des Verfahrens Method for machining material with laser pulses large spectral bandwidth and device for carrying out the method |
| 06/10/2009 | DE102008060390A1 Substratbearbeitungsvorrichtung The substrate processing apparatus |
| 06/10/2009 | DE102008060380A1 Verfahren zum Ausbilden einer Änderungsschicht in einem Substrat A method of forming a layer change in a substrate, |
| 06/10/2009 | DE102008058834A1 Elektronische Anordnung und Verfahren zur Herstellung derselben An electronic device and method of manufacturing the same |
| 06/10/2009 | DE102008046397A1 Verifizierung auf Basis von Transaktionen eines Systems auf einem Chip auf Systemebene durch Übersetzen von Transaktionen in Maschinencodierung Verification on the basis of transactions of a system on a chip on system level by translating transactions into machine code |
| 06/10/2009 | DE102008046253A1 Verfahren zur Herstellung des Bildsensors A method of manufacturing the image sensor |
| 06/10/2009 | DE102008046030A1 Bildsensor und Verfahren zu seiner Herstellung Image sensor and method for its preparation |
| 06/10/2009 | DE102008009086B3 Integrated circuit manufacturing method, involves oxidizing metallic layer of transistor, and implementing temperature step for activating dopants before oxidization of metallic layer or simultaneously for oxidizing metallic layer |
| 06/10/2009 | DE102007059218A1 Method for guiding the temperature in a diffusion oven comprises using an average temperature rise which is larger than a first average rise of a first linear or non-linear temperature-time function progression |
| 06/10/2009 | DE102007058876A1 Method for processing wafer surfaces in the production of solar cells comprises inserting wafers into a treatment chamber, contacting with an alkaline treatment solution containing a texturing agent and further processing |
| 06/10/2009 | DE102007058829A1 Textur- und Reinigungsmedium zur Oberflächenbehandlung von Wafern und dessen Verwendung Texture and cleaning medium for the surface treatment of wafers and to the use thereof |
| 06/10/2009 | DE102007058802B3 Thermodenvorrichtung Thermodenvorrichtung |
| 06/10/2009 | DE102007058711A1 New benzoperylene carboxylic acid bisimide compounds useful e.g. as pigments for aquarel- and water-colors, for coloring e.g. paper, and polymers e.g. polyvinyl chloride, for labeling materials with security attributes such as cheques |
| 06/10/2009 | DE102007058649A1 Information reading-out device for wafer, has radiation source i.e. LED, for irradiating semiconductor substrate with electromagnetic radiation, where radiation source and sensor are arranged in relation to sides of substrate |
| 06/10/2009 | DE102007058644A1 Chemikalienresistente Halterung für Chips mit empfindlichen Strukturen auf der Oberseite Chemical-resistant holder for chips with sensitive structures on top |
| 06/10/2009 | DE102007058503A1 Verfahren zur nasschemischen Behandlung einer Halbleiterscheibe Process for wet-chemical treatment of a semiconductor wafer |
| 06/10/2009 | DE102007057688A1 Verspanntes Zwischenschichtdielektrikum mit einer geringeren Wahrscheinlichkeit für eine Hohlraumbildung in einem Halbleiterbauelement unter Anwendung einer Ätzsteuerzwischenschicht mit erhöhter Dicke Strained interlayer dielectric with a lower likelihood of void formation in a semiconductor device using a thickness-increased Ätzsteuerzwischenschicht |
| 06/10/2009 | DE102007057686A1 Verfahren und Halbleiterbauelement mit einer Schutzschicht zum Reduzieren der Verspannungsrelaxation in einer Doppelverspannungsbeschichtungstechnik The method and semiconductor device with a protective layer to reduce the stress relaxation in a dual tension coating technique |
| 06/10/2009 | DE102007057223A1 Herstellungsverfahren zum Ausbilden einer integrierten Schaltungsvorrichtung und entsprechende integrierte Schaltungsvorrichtung Preparation method of forming an integrated circuit device and corresponding integrated circuit device |
| 06/10/2009 | DE102007009912B4 Verfahren zur Herstellung einer kupferbasierten Metallisierungsschicht mit einer leitenden Deckschicht durch ein fortschrittliches Integrationsschema A process for preparing a copper-based metallization layer with a conductive outer layer by an advanced integration scheme |
| 06/10/2009 | DE102006058010B9 Halbleiterbauelement mit Hohlraumstruktur und Herstellungsverfahren A semiconductor device structure and manufacturing method with cavity |
| 06/10/2009 | DE102006025342B4 Halbleitervorrichtung mit isoliertem Gate und Herstellungsverfahren dafür A semiconductor device comprising insulated gate and production method thereof |
| 06/10/2009 | DE102006006423B4 Leistungshalbleitermodul und zugehöriges Herstellungsverfahren The power semiconductor module and associated production method |
| 06/10/2009 | DE102005005709B4 Einrichtung zur Bearbeitung von Materialoberflächen Means for processing of material surfaces |
| 06/10/2009 | DE102004039693B4 Vergussmasse, Chipmodul und Verfahren zur Herstellung eines Chipmoduls Potting compound chip module and method of producing a chip module |
| 06/10/2009 | DE10048374B4 Verfahren zum großflächigen Verbinden von Verbindungshalbleitermaterialien Method for large-area bonding compound semiconductor materials |
| 06/10/2009 | CN201256145Y Manufacturing process and construction for integrated circuit |
| 06/10/2009 | CN201256144Y Gas-liquid mixed constant temperature system for silicon chip drying |
| 06/10/2009 | CN101454894A Engineering strain in thick strained-soi substrates |
| 06/10/2009 | CN101454893A Nonvolatile memory with variable drain voltage |
| 06/10/2009 | CN101454892A Semiconductor device and manufacturing method thereof |
| 06/10/2009 | CN101454891A Improving control of localized air gap formation in an interconnect stack |
| 06/10/2009 | CN101454890A Producing soi structure using ion shower |
| 06/10/2009 | CN101454889A Formation of improved soi substrates using bulk semiconductor wafers |
| 06/10/2009 | CN101454888A Substrate transfer apparatus |
| 06/10/2009 | CN101454887A Electronic component, semiconductor package and electronic device |
| 06/10/2009 | CN101454886A A method for depositing and curing low-k films for gapfill and conformal film applications |
| 06/10/2009 | CN101454885A Methods of forming solder connections and structure thereof |
| 06/10/2009 | CN101454884A Selective spacer formation on transistors of different classes on the same device |
| 06/10/2009 | CN101454883A Method of forming a transistor having gate protection and transistor formed according to the method |
| 06/10/2009 | CN101454882A High density trench fet with integrated schottky diode and method of manufacture |
| 06/10/2009 | CN101454881A Method for forming insulating film and method for manufacturing semiconductor device |
| 06/10/2009 | CN101454880A Plasma cvd method, method for forming silicon nitride film, method for manufacturing semiconductor device and plasma cvd method |
| 06/10/2009 | CN101454879A Etching solution for substrate |
| 06/10/2009 | CN101454878A Method for dry-etching interlayer insulating film |
| 06/10/2009 | CN101454877A Novel deposition-plasma cure cycle process to enhance film quality of silicon dioxide |
| 06/10/2009 | CN101454876A Method for removing damaged dielectric material |
| 06/10/2009 | CN101454875A Semiconductor on insulator structure made using radiation annealing |
| 06/10/2009 | CN101454874A Selective epitaxial formation of semiconductor films |
| 06/10/2009 | CN101454873A Radio frequency devices with enhanced ground structure |
| 06/10/2009 | CN101454872A Stripper composition for photoresist |