Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2014
06/12/2014US20140161570 Substrate processing apparatus
06/12/2014US20140161429 Thermal processing apparatus and thermal processing method for heating substrate by light irradiation
06/12/2014US20140160841 Self-aligned floating gate in a vertical memory structure
06/12/2014US20140160677 Electronic device cooling with microjet impingement and method of assembly
06/12/2014US20140160675 Landside stiffening capacitors to enable ultrathin and other low-z products
06/12/2014US20140160385 Semiconductor device and fabrication method thereof
06/12/2014US20140159759 Wiring fault detection method, wiring fault detection apparatus, and method for manufacturing semiconductor substrate
06/12/2014US20140159325 Substrate support assembly having metal bonded protective layer
06/12/2014US20140159321 Holding device for holding a patterned wafer
06/12/2014US20140159254 Dicing tape-integrated film for semiconductor back surface
06/12/2014US20140159245 Semiconductor device and a method of manufacturing the same
06/12/2014US20140159244 Process to Achieve Contact Protrusion for Single Damascene Via
06/12/2014US20140159243 Metal Conductor Chemical Mechanical Polish
06/12/2014US20140159241 Structures and Methods to Enhance Copper Metallization
06/12/2014US20140159240 Thermal Management Structure with Integrated Heat Sink
06/12/2014US20140159239 Methods of selectively removing a substrate material and related semiconductor structures
06/12/2014US20140159234 Semiconductor manufacturing process and structure thereof
06/12/2014US20140159232 Apparatus and Method for Three Dimensional Integrated Circuits
06/12/2014US20140159231 Semiconductor assembly
06/12/2014US20140159228 High density substrate routing in bbul package
06/12/2014US20140159227 Patterning transition metals in integrated circuits
06/12/2014US20140159223 Apparatus and Method for Package Reinforcement
06/12/2014US20140159217 Multichip package and fabrication method thereof
06/12/2014US20140159216 Semiconductor module, semiconductor device having semiconductor module, and method of manufacturing semiconductor module
06/12/2014US20140159215 Semiconductor device and method of manufacturing the same
06/12/2014US20140159214 Low cost repackaging of thinned integrated devices
06/12/2014US20140159211 Semiconductor structure and process thereof
06/12/2014US20140159209 Manufacturing method for a micromechanical component and a corresponding micromechanical component
06/12/2014US20140159208 III-V Compound Semiconductor Epitaxy From a Non-III-V Substrate
06/12/2014US20140159206 Methods and Apparatus for ESD Structures
06/12/2014US20140159195 Decoupling capacitor and method of making same
06/12/2014US20140159193 Semiconductor device and method for fabricating the same
06/12/2014US20140159170 Semiconductor device dielectric interface layer
06/12/2014US20140159169 Recessing and capping of gate structures with varying metal compositions
06/12/2014US20140159164 Double sidewall image transfer process
06/12/2014US20140159150 Semiconductor device and semiconductor device manufacturing method
06/12/2014US20140159140 Buried word line structure and method of forming the same
06/12/2014US20140159135 Air Gap Isolation In Non-Volatile Memory Using Sacrificial Films
06/12/2014US20140159120 Conformal Doping
06/12/2014US20140159118 III-Nitride Transistor with Source-Connected Heat Spreading Plate
06/12/2014US20140159112 Method for forming group iii/v conformal layers on silicon substrates
06/12/2014US20140159111 Semiconductor composite film with heterojunction and manufacturing method thereof
06/12/2014US20140159108 Method of forming an esd device and structure therefor
06/12/2014US20140159103 Partial soi on power device for breakdown voltage improvement
06/12/2014US20140159098 Semiconductor lead frame package and led package
06/12/2014US20140159085 Light emitting diode package and manufacturing method thereof
06/12/2014US20140159066 Stabilization structure including sacrificial release layer and staging bollards
06/12/2014US20140159063 Vertical solid-state transducers and high voltage solid-state transducers having buried contacts and associated systems and methods
06/12/2014US20140159057 Silicon carbide semiconductor device and method for manufacturing the same
06/12/2014US20140159056 Silicon carbide semiconductor device and method for manufacturing the same
06/12/2014US20140159055 Substrates for semiconductor devices
06/12/2014US20140159052 Method and structure for transistor with reduced drain-induced barrier lowering and on resistance
06/12/2014US20140159047 Manufacturing process of oxide insulating layer and flexible structure of ltps-tft (low-temperature polycrystalline silicon thin film transistor) display
06/12/2014US20140159046 Flexible display substrate, the manufacturing method thereof and a flexible display device
06/12/2014US20140159045 Semiconductor device
06/12/2014US20140159042 Top down aluminum induced crystallization for high efficiency photovoltaics
06/12/2014US20140159041 Semiconductor device
06/12/2014US20140159040 Authentication using graphene based devices as physical unclonable functions
06/12/2014US20140159030 Process for preparing nanoparticle embedded electronic device
06/12/2014US20140158996 Method of manufacturing poly-crystalline silicon layer, method of manufacturing an organic light-emitting display apparatus including the same, and organic light-emitting display apparatus manufactured by using the same
06/12/2014US20140158986 Highly Conductive Nano-structures incorporated in Semiconductor Nanocomposites
06/12/2014US20140158980 Emitting Device with Compositional and Doping Inhomogeneities in Semiconductor Layers
06/12/2014US20140158976 Iii-n semiconductor-on-silicon structures and techniques
06/12/2014US20140158303 Bonding system, substrate processing system, and bonding method
06/12/2014US20140158299 Multi-Chamber Semiconductor Processing Device
06/12/2014US20140158167 Method and apparatus for cleaning a substrate using non-newtonian fluids
06/12/2014US20140158160 Substrate cleaning apparatus and substrate cleaning method
06/12/2014US20140158159 Substrate cleaning apparatus and substrate cleaning method
06/12/2014DE112012003990T5 Aufschlämmung und Verfahren zum Herstellen einer Aufschlämmung Slurry and method for preparing a slurry
06/12/2014DE112012003057T5 Verfahren zum Stabilisieren von hydriertem, amorphem Silicium und amorphen, hydrierten Siliciumlegierungen A process for stabilizing hydrogenated amorphous silicon and amorphous hydrogenated silicon alloys with
06/12/2014DE112010000774T5 Solarzellenverfahren und -strukturen Solar cells procedures and structures
06/12/2014DE102013225410A1 Laserbearbeitungsvorrichtung Laser processing apparatus
06/12/2014DE102013221157A1 Leistungsfähige vertikale Durchverbindung Powerful vertical Average Connection
06/12/2014DE102013221153A1 Embedding-technologie mit hohem wirkungsgrad Embedding technology with high efficiency
06/12/2014DE102013113082A1 Organische Leuchtdiodenanzeige mit hoher Lumineszenz Organic light emitting display with high luminescence
06/12/2014DE102013111011A1 Verfahren zur Herstellung einer Speicherzelle, Verfahren zur Herstellung einer Speicherzellenanordnung und Speicherzelle A method for fabricating a memory cell, method of manufacturing a memory cell array and memory cell
06/12/2014DE102013107244A1 Gestapelter Fan-Out-Halbleiterchip Stacked fan-out semiconductor chip
06/12/2014DE102013103502A1 System und Verfahren zur Reinigung von FOUP System and method for the purification of FOUP
06/12/2014DE102012222791A1 Verfahren zur Kontaktierung eines Halbleiters und Halbleiterbauelement mit erhöhter Stabilität gegenüber thermomechanischen Einflüssen A method for contacting a semiconductor and semiconductor device having increased stability against thermo-mechanical influences
06/12/2014DE102012222679A1 Verfahren zur Herstellung eines Schaltmoduls und eines zugehörigen Gittermoduls sowie ein zugehöriges Gittermodul und korrespondierende elektronische Baugruppe A process for producing a switching module and an associated grating module and an associated grating module and corresponding electronic assembly
06/12/2014DE102012222491A1 Elektronisches Bauteil mit einem gespritzten Bauteilgehäuse Electronic component with a molded component housing
06/12/2014DE102012222475A1 Leuchtdiode aufweisend mehrere leuchtstoffbereiche Light-emitting diode comprising a plurality of fluorescent areas
06/12/2014DE102012222459A1 Circuit device for producing renewable energy, has metal reservoir that is adapted in circuit device portion, if any overflow of circuit elements occurs to cool in order to delay formation of arc
06/12/2014DE102012214253A1 Laserbasiertes Verfahren und Bearbeitungstisch zur Metallisierung der Rückseite eines Halbleiterbauelements Laser-based method and machining table for metallizing the back of a semiconductor device
06/12/2014DE102012112058A1 MEMS-Bauelement und Verfahren zur Verkapselung von MEMS-Bauelementen MEMS device and method of encapsulating MEMS devices
06/12/2014DE102012111895A1 Method for producing solar module, involves heating electrical contact layer to preset temperature by laser radiation so that partial recesses are formed by removing portion of semiconductor layer together with electrical contact layer
06/12/2014DE102012110549A1 Silicon substrate, has reactive multilayer comprising two-dimensional nanosheets made of different materials, and insulating layer arranged between upper cap substrate and reactive multilayer and connected with lower substrate
06/12/2014DE102012110542A1 Semiconductor substrate e.g. silicon substrate of subsystem, is connected with another semiconductor substrate, so as to encapsulate passive or active device between two substrates in cavity hermetically
06/12/2014DE102012109211A1 Optoelektronische Bauelementevorrichtung, Verfahren zum Herstellen einer optoelektronischen Bauelementevorrichtung und Verfahren zum Betreiben einer optoelektronischen Bauelementevorrichtung Optoelectronic Devices device, method of manufacturing an opto-electronic device components and methods of operating an opto-electronic device components
06/12/2014DE102012109208A1 Verfahren zum Bearbeiten einer Vorrichtung mit wenigstens einer elektrischen Schichtenstruktur und Bauelementanordnung zum Bearbeiten einer Vorrichtung mit wenigstens einer elektrischen Schichtenstruktur A method for processing a device having at least one electrical component layers structure and arrangement for processing a device having at least one electrical-layer structure
06/12/2014DE102012024255A1 Method for manufacturing and series interconnecting of photovoltaic elements to thin-layer solar module, involves structuring total area of module by structuring step so that breadth of segment is locally adjusted for generating current
06/12/2014DE102010021765B4 Herstellungsverfahren zur Anordnung zweier Verbindungspartner mittels einer Niedertemperatur Drucksinterverbindung Manufacturing process for the arrangement of two link partners by means of a low-temperature pressure sintering connection
06/12/2014DE102006049613B4 Verfahren des Bildens von Reihen-Auswahltransistoren einer EEPROM-Vorrichtung vom NAND-Typ und damit gebildete Vorrichtungen Method of forming row select transistor of an EEPROM device NAND-type and devices formed therewith
06/11/2014EP2741426A1 High-frequency module
06/11/2014EP2741337A1 Semiconductor heterostructure field effect transistor and method for making thereof
06/11/2014EP2741336A1 Semiconductor device, and manufacturing method for same
06/11/2014EP2741321A2 Semiconductor device and method of manufacturing the same
06/11/2014EP2741320A1 FinFET device with dual-strained channels and method for manufacturing thereof
06/11/2014EP2741319A1 Field effect transistor
06/11/2014EP2741318A1 Semiconductor element and method for manufacturing semiconductor element
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