Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2009
07/16/2009WO2009089248A2 Apparatus and method of aligning and positioning a cold substrate on a hot surface
07/16/2009WO2009089245A2 Heated showerhead assembly
07/16/2009WO2009089244A1 Showerhead insulator and etch chamber liner
07/16/2009WO2009089158A2 Functionalized fullerenes for nanolithography applications
07/16/2009WO2009089122A2 Controlled deflection of large area semiconductor substrates for shipping & manufacturing containers
07/16/2009WO2009089089A1 Microdevice fabrication
07/16/2009WO2009089026A2 Composition and method for polishing nickel-phosphorous-coated aluminum hard disks
07/16/2009WO2009088922A2 Methods and apparatus for forming memory lines and vias in three dimensional memory arrays using dual damascene process and imprint lithography
07/16/2009WO2009088910A2 Laser chalcogenide phase change device and method
07/16/2009WO2009088906A1 Press fit passive component
07/16/2009WO2009088890A2 Memory cell with planarized carbon nanotube layer and methods of forming the same
07/16/2009WO2009088889A1 Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element formed over a bottom conductor and methods of forming the same
07/16/2009WO2009088888A2 Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element and methods of forming the same
07/16/2009WO2009088883A2 Low-defect-density crystalline structure and method for making same
07/16/2009WO2009088882A2 Edge-contacted vertical carbon nanotube transistor
07/16/2009WO2009088807A1 Flexible membrane assembly for a cmp system
07/16/2009WO2009088770A1 Gas delivery system for an ion source
07/16/2009WO2009088660A1 Method of etching a high aspect ratio contact
07/16/2009WO2009088659A2 Micropad formation for a semiconductor
07/16/2009WO2009088588A2 Methods for fabricating pmos metal gate structures
07/16/2009WO2009088587A2 Methods of forming nanodots using spacer patterning techniques and structures formed thereby
07/16/2009WO2009088565A2 Method of forming a thermo pyrolytic graphite-embedded heatsink
07/16/2009WO2009088523A1 Pivot arm assembly for semiconductor wafer handling robots and method for making the same
07/16/2009WO2009088452A1 Improved sawtooth electric field drift region structure for power semiconductor devices
07/16/2009WO2009088233A2 Inline mold apparatus of a resin molding device
07/16/2009WO2009088123A1 Template for forming solder bumps, method of manufacturing the template and method of inspecting solder bumps using the template
07/16/2009WO2009088004A1 Exposure method and exposure device
07/16/2009WO2009088003A1 Exposure method, exposure device, and device manufacturing method
07/16/2009WO2009087958A1 Production method for semiconductor device
07/16/2009WO2009087950A1 Semiconductor device and manufacturing method thereof
07/16/2009WO2009087931A1 Electrolytic method
07/16/2009WO2009087930A1 Semiconductor element manufacturing method
07/16/2009WO2009087906A1 Film forming method and film forming apparatus
07/16/2009WO2009087903A1 Projecting electrode and method of manufacturing the same
07/16/2009WO2009087889A1 Polymerizable fluorine-containing monomer, fluorine-containing polymer and method for forming resist pattern
07/16/2009WO2009087887A1 Plasma processing apparatus
07/16/2009WO2009087855A1 Semiconductor device manufacturing method
07/16/2009WO2009087846A1 Method for manufacturing semiconductor device
07/16/2009WO2009087805A1 Spatial light modulator, illumination optical system, aligner, and device manufacturing method
07/16/2009WO2009087796A1 Cold jointing apparatus, and cold jointing method
07/16/2009WO2009087784A1 Laser anneal method and device
07/16/2009WO2009087723A1 Ingot cutting apparatus and cutting method
07/16/2009WO2009087713A1 Semiconductor device and method for manufacturing the same
07/16/2009WO2009087712A1 Method for pattern formation
07/16/2009WO2009087561A1 Semiconductor device
07/16/2009WO2009087492A1 Semiconductor processing method
07/16/2009WO2009087335A1 Eeprom cell with charge loss
07/16/2009WO2009087290A1 Method of fabricating a microelectronic structure involving molecular bonding
07/16/2009WO2009086983A1 Reduction of watermarks in hf treatments of semiconducting substrates
07/16/2009WO2009086782A1 A plasma processing apparatus
07/16/2009WO2009086772A1 Gas distribution system and semiconductor processing device using the gas distribution system
07/16/2009WO2009066983A3 Method of curing defects in spin-on-glass
07/16/2009WO2009066286A3 Amorphous group iii-v semiconductor material and preparation thereof
07/16/2009WO2009058376A3 Temperature control module using gas pressure to control thermal conductance between liquid coolant and component body
07/16/2009WO2009057927A3 Package for semiconductor device and packaging method thereof
07/16/2009WO2009044083A3 Method for reducing porosity of a metal deposit by ionic bombardment
07/16/2009WO2009042997A3 Wafer bow metrology arrangements and methods thereof
07/16/2009WO2009025913A3 Magnesium-based coatings for nanocrystals
07/16/2009WO2008066884A8 Semiconductor structure with interconnect comprising silver and method of forming the same
07/16/2009US20090181553 Apparatus and method of aligning and positioning a cold substrate on a hot surface
07/16/2009US20090181552 Laser processing apparatus and method for manufacturing semiconductor substrate
07/16/2009US20090181551 Integrated circuit system employing multiple exposure dummy patterning technology
07/16/2009US20090181550 Film formation method and apparatus for semiconductor process
07/16/2009US20090181549 Method for forming a gate insulating film
07/16/2009US20090181548 Vertical plasma processing apparatus and method for semiconductor process
07/16/2009US20090181547 Method of producing semiconductor device
07/16/2009US20090181546 Single-Wafer Etching Method for Wafer and Etching Apparatus Thereof
07/16/2009US20090181545 Dry-etching method and apparatus
07/16/2009US20090181544 Method for preventing backside defects in dielectric layers formed on semiconductor substrates
07/16/2009US20090181543 Method of forming a pattern of a semiconductor device
07/16/2009US20090181542 Method of forming bonding pad opening
07/16/2009US20090181541 Polishing process of a semiconductor substrate
07/16/2009US20090181540 Chemical mechanical polishing method
07/16/2009US20090181539 Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device
07/16/2009US20090181538 Film forming method, film forming apparatus and storage medium
07/16/2009US20090181537 Semiconductor structure comprising an electrical connection and method of forming the same
07/16/2009US20090181536 Method of manufacturing semiconductor device
07/16/2009US20090181535 Method of manufacturing a semiconductor device
07/16/2009US20090181534 Charging-free electron beam cure of dielectric material
07/16/2009US20090181533 Alignment verification for c4np solder transfer
07/16/2009US20090181532 Integration scheme for extension of via opening depth
07/16/2009US20090181531 Methods of manufacturing non-volatile memory devices having insulating layers treated using neutral beam irradiation
07/16/2009US20090181530 High-K Dielectric Stack And Method Of Fabricating Same
07/16/2009US20090181529 Method of forming a contact hole and method of manufacturing a semiconductor device having the same
07/16/2009US20090181528 Method of Forming Gate Electrode
07/16/2009US20090181527 Graphite Member for Beam-Line Internal Member of Ion Implantation Apparatus
07/16/2009US20090181526 Plasma Doping Method and Apparatus
07/16/2009US20090181525 Wafer structure and epitaxial growth method for growing the same
07/16/2009US20090181524 Method of manufacturing semiconductor device and apparatus for processing substrate
07/16/2009US20090181523 Method of manufacturing semiconductor device and apparatus for processing substrate
07/16/2009US20090181522 Method for producing semiconductor optical device
07/16/2009US20090181521 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
07/16/2009US20090181520 Method and Structure for Dividing a Substrate into Individual Devices
07/16/2009US20090181519 Lamination device manufacturing method
07/16/2009US20090181518 Manufacturing method and manufacturing apparatus of semiconductor substrate
07/16/2009US20090181517 Method of forming flash memory device
07/16/2009US20090181516 Method of Forming Isolation Layer of Semiconductor Device
07/16/2009US20090181515 Selective germanium deposition for pillar devices
07/16/2009US20090181514 Heat treatment apparatus and method for manufacturing soi substrate using the heat treatment apparatus
07/16/2009US20090181513 Vertical organic transistor