Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2009
07/15/2009EP2079102A1 Method for flattening solid surface with gas cluster ion beam, and solid surface flattening device
07/15/2009EP2079101A1 OHMIC ELECTRODE FOR SiC SEMICONDUCTOR, METHOD FOR MANUFACTURE OF OHMIC ELECTRODE FOR SiC SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICE
07/15/2009EP2079100A1 Exposure apparatus, exposure method, method for manufacturing decive
07/15/2009EP2079099A1 Method and apparatus for preventing galvanic corrosion in semiconductor processing
07/15/2009EP2078983A1 Composition for formation of upper layer film, and method for formation of photoresist pattern
07/15/2009EP2078741A1 Thermally strippable double faced adhesive sheet and method of working work piece
07/15/2009EP2078307A1 Removal of impurities from semiconductor device layers
07/15/2009EP2078306A1 High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach
07/15/2009EP2078226A1 Electronic device having a plastic substrate
07/15/2009EP2078046A1 Solution processed thin films and laminates, devices comprising such thin films and laminates, and method for their use and manufacture
07/15/2009EP2006884A9 Mobile device, exposure device, exposure method, micro-motion body, and device manufacturing method
07/15/2009EP1897126A4 Multiple fluid supplying apparatus for carrier of semiconductor wafer polishing system
07/15/2009EP1407472A4 Self contained sensing apparatus and system
07/15/2009EP1371094A4 sUPER-THIN HIGH SPEED FLIP CHIP PACKAGE
07/15/2009EP1302976B1 Single crystal wafer and solar battery cell
07/15/2009EP1285392A4 Hybrid, non linear, large signal microwave/millimeter wave model
07/15/2009EP1049928B1 Apparatus for x-ray analysis in grazing exit conditions
07/15/2009CN201274290Y Film transportation mechanism for ultrasonic pressure welding machine
07/15/2009CN201274289Y Material transferring apparatus for ultrasonic pressure welding machine and material transferring mechanism for the material transferring apparatus
07/15/2009CN201274288Y Improvement of hoisting structure
07/15/2009CN201274287Y Ultrasonic aluminum thread pressure welding machine
07/15/2009CN201274286Y Crystalline grain detecting apparatus
07/15/2009CN201274285Y Substrate bearing platform
07/15/2009CN201274284Y Vacuum chamber and substrate transferring system with the vacuum chamber
07/15/2009CN101484989A Applications of smart polymer composites to integrated circuit packaging
07/15/2009CN101484988A Method of temporarily attaching a rigid carrier to a substrate
07/15/2009CN101484987A Pick-and-place apparatus
07/15/2009CN101484986A Compound semiconductor epitaxial substrate and method for producing the same
07/15/2009CN101484985A Semiconductor devices and method of fabrication
07/15/2009CN101484984A Aftertreatment method for amorphous carbon film
07/15/2009CN101484983A Etching method, etching mask and method for manufacturing semiconductor device using the same
07/15/2009CN101484982A Polishing liquid for CMP
07/15/2009CN101484981A Method for smoothing III-N substrates
07/15/2009CN101484980A Pre-cleaning of substrates in epitaxy chambers
07/15/2009CN101484979A Method and apparatus for chemical mechanical polishing of large size wafer with capability of polishing individual die
07/15/2009CN101484978A Three-dimensional integrated circuit for analyte detection
07/15/2009CN101484977A Tio2 nanostructures, membranes and films, and applications of same
07/15/2009CN101484976A Electric device comprising an improved electrode
07/15/2009CN101484975A Automatically replaceable apparatus for collecting byproducts and the controlling method thereof in equipment producing semiconductor
07/15/2009CN101484974A Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids
07/15/2009CN101484973A Cluster tool for advanced front-end processing
07/15/2009CN101483181A Light-emitting device
07/15/2009CN101483178A Flash memory cell and the method of making separate sidewall oxidation
07/15/2009CN101483165A Tape carrier package on reel and plasma display device using the same
07/15/2009CN101483161A 半导体芯片 Semiconductor chip
07/15/2009CN101483156A Production method for thin-film transistor array substrate
07/15/2009CN101483155A Dual gate multi-bit semiconductor memory array manufacturing method
07/15/2009CN101483154A Manufacturing process for gate lateral wall of dual gate oxide device
07/15/2009CN101483153A Semi-conductor device manufacturing process capable of being optimized
07/15/2009CN101483152A Method for manufacturing integrated circuit and semiconductor construction therefor
07/15/2009CN101483151A Organic light emitting apparatus and forming method thereof
07/15/2009CN101483150A Process for treating through wafer interconnection construction
07/15/2009CN101483149A Production method for through wafer interconnection construction
07/15/2009CN101483148A Integrated circuit structure manufacturing method
07/15/2009CN101483147A Method and structure to control thermal gradients in semiconductor wafers during rapid thermal processing
07/15/2009CN101483146A Bonding structure and semiconductor device manufacturing apparatus
07/15/2009CN101483145A Elevator linear motor drive
07/15/2009CN101483144A Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
07/15/2009CN101483143A Template for forming solder bumps, method of manufacturing the template and method of inspecting solder bumps using the template
07/15/2009CN101483142A Lamination device manufacturing method
07/15/2009CN101483141A Multilayer module encapsulation method for LED and construction thereof
07/15/2009CN101483140A MOS transistor manufacturing method capable of reducing leakage current
07/15/2009CN101483139A Insulating medium production method capable of enhancing yield of devices
07/15/2009CN101483138A Plasma treatment device
07/15/2009CN101483137A Phosphorus dyeing technique in electrostatic induction device production and matched epitaxial process
07/15/2009CN101483136A Methods of selective deposition of heavily doped epitaxial SiGe
07/15/2009CN101483135A Etching method for carbon containing layer
07/15/2009CN101483134A Forming method for wire binding machine platform code
07/15/2009CN101482918A Finger print detection device
07/15/2009CN101481798A Film forming method and film forming device using plasma CVD
07/15/2009CN100514699C Organic electroluminescence display device
07/15/2009CN100514695C Programmable structure of micro-electronics
07/15/2009CN100514673C Thin-film field effect transistor and making method
07/15/2009CN100514657C Active matrix substrate and its manufacturing method
07/15/2009CN100514653C Nonvolatile semiconductor storage device and its making method
07/15/2009CN100514652C 半导体装置 Semiconductor device
07/15/2009CN100514650C Semiconductor device and its manufacture method
07/15/2009CN100514640C Thin film transistor array panel and manufacturing method thereof
07/15/2009CN100514630C Multi-chip assembly and method for driving the same
07/15/2009CN100514610C Thin film transistor array base plate and its making method
07/15/2009CN100514609C Color filter and method for manufacturing the same
07/15/2009CN100514608C Making method of the film transistor array and its structure
07/15/2009CN100514607C Method of manufacturing NAND flash memory device
07/15/2009CN100514606C Method for fabricating capacitor in semiconductor device
07/15/2009CN100514605C Method of manufacturing split gate type nonvolatile memory device
07/15/2009CN100514604C Semiconductor device
07/15/2009CN100514603C Method for realizing circuit layout
07/15/2009CN100514602C Wafer cutting method
07/15/2009CN100514601C Wafer cutting method and device thereof
07/15/2009CN100514600C Method and apparatus to form a planarized Cu interconnect layer using electroless membrane deposition
07/15/2009CN100514599C A method for forming a ruthenium metal layer on a patterned substrate
07/15/2009CN100514598C Method for manufacturing semiconductor device
07/15/2009CN100514597C Manufacturing method for IC with air interval
07/15/2009CN100514596C Manufacturing method and structure of metal interconnector
07/15/2009CN100514595C Method for forming contact in semiconductor device
07/15/2009CN100514594C Semiconductor device having a dislocation loop and a method of manufacture therefor
07/15/2009CN100514593C Method of holding an electronic component in a controlled orientation during parametric testing
07/15/2009CN100514592C Semiconductor device and semiconductor device manufacturing method
07/15/2009CN100514591C A method of manufacturing semiconductor packages and packages made
07/15/2009CN100514590C Method and structure for preventing soldering pad stripping