Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2009
07/22/2009CN100517689C Static electricity damage preventor
07/22/2009CN100517683C Semi-conductor apparatus and its pattern wiring method
07/22/2009CN100517682C Semiconductor device and its producing method
07/22/2009CN100517657C SONOS Flash memory manufacture method
07/22/2009CN100517656C Method of manufacturing non-volatile memory device
07/22/2009CN100517655C SONOS flash memory and production method thereof
07/22/2009CN100517654C Method of manufacturing NAND flash memory device
07/22/2009CN100517653C Method used for DRAM unit and periphery transistor and its structure produced by the same
07/22/2009CN100517652C CMOS device stress membrane forming method and CMOS device
07/22/2009CN100517651C Forming method of pixel unit of CMOS image sensor
07/22/2009CN100517650C Making method for memory capacitor
07/22/2009CN100517649C IC structure and its making method
07/22/2009CN100517648C System and method for etching
07/22/2009CN100517647C Method for fabricating semiconductor device
07/22/2009CN100517646C Manufacturing method for semiconductor chips
07/22/2009CN100517645C Manufacturing method for semiconductor chips, and semiconductor chip
07/22/2009CN100517644C Method for manufacturing of semiconductor device metal connecting hole and semiconductor device
07/22/2009CN100517643C Method for manufacturing inlaid structure
07/22/2009CN100517642C Method for forming through hole
07/22/2009CN100517641C Navigation method in semiconductor chip conducting wire mending course
07/22/2009CN100517640C Semiconductor device manufacturing method and semiconductor device
07/22/2009CN100517639C Production method of metal wiring structure in semiconductor element
07/22/2009CN100517638C Semiconductor laminated structure and method of producing the same
07/22/2009CN100517637C Method of forming isolation structure of semiconductor device
07/22/2009CN100517636C Shallow plough groove isolation structure forming method
07/22/2009CN100517635C Method of forming buried isolation regions in semiconductor substrates and semiconductor devices with buried isolation regions
07/22/2009CN100517634C Method for manufacturing groove and its method for manufacturing image sensor
07/22/2009CN100517633C Spin head and substrate treating method using the same
07/22/2009CN100517632C Chuck workbench moving arrangement
07/22/2009CN100517631C Method for uplifting device and adjusting plane degree of lifting device
07/22/2009CN100517630C Substrate transportation method and substrate transportation device
07/22/2009CN100517629C Process system and device for transporting substrates
07/22/2009CN100517628C Carrying tool and transfer interface system
07/22/2009CN100517627C Method for checking contact hole etching defect
07/22/2009CN100517626C Vacuum apparatus, method for measuring a leak rate thereof, program used in measuring the leak rate and storage medium storing the program
07/22/2009CN100517625C Electronic component, semiconductor device, methods of manufacturing the same
07/22/2009CN100517624C Component mounting apparatus and substrate transfer method
07/22/2009CN100517623C Wafer press welding and bonding method and structure thereof
07/22/2009CN100517622C Wafer grade chip packaging process
07/22/2009CN100517621C Interconnect structures with encasing cap and methods of making thereof
07/22/2009CN100517620C PMOS device and method of forming compressive channel layer thereof
07/22/2009CN100517619C Structure and method of fabricating finfet with buried channel
07/22/2009CN100517618C Semiconductor device and its making method
07/22/2009CN100517617C Non-volatile semiconductor memory and manufacturing method thereof
07/22/2009CN100517616C Fabrication method of thin film transistor
07/22/2009CN100517615C Transistor structure including a metal silicide gate and channel implants and method of manufacturing the same
07/22/2009CN100517614C Uhigh electron mobility layer structure and manufacturing method thereof
07/22/2009CN100517613C Rapid thermal processing system
07/22/2009CN100517612C Heat treatment jig for semiconductor wafer
07/22/2009CN100517611C Aluminum cushion layer etching method and bump formation method
07/22/2009CN100517610C Method of processing semiconductor component and forming method of semiconductor component
07/22/2009CN100517609C Method for forming silicon compound on substrate containing SiGe
07/22/2009CN100517608C Amorphous dielectric thin film and manufacturing method thereof
07/22/2009CN100517607C Method of fabricating oxide layer on silicon carbide layer utilizing anneal hydrogen environment
07/22/2009CN100517606C Method for etching throughhole
07/22/2009CN100517605C Method for manufacturing inlaid structure
07/22/2009CN100517604C Through hole etching method
07/22/2009CN100517603C Substrate processing method
07/22/2009CN100517602C Method of processing substrate, method of and program for manufacturing an electronic device
07/22/2009CN100517601C Method of forming dielectric layer with high dielectric constant, semiconductor device and manufacturing method thereof
07/22/2009CN100517600C Method for forming medium layer
07/22/2009CN100517599C Substrate treating apparatus and semiconductor device manufacturing method
07/22/2009CN100517598C Shower head and film-forming device using the same
07/22/2009CN100517597C Method for etching polysilicon
07/22/2009CN100517596C Method and apparatus for reducing aspect ratio dependent etching in time division multiplexed etch processes
07/22/2009CN100517595C Etching method and system
07/22/2009CN100517594C Method for removing particles from a semiconductor surface
07/22/2009CN100517593C Silicon chip etching method
07/22/2009CN100517592C Method for improving shallow groove isolating space stuffing techniques
07/22/2009CN100517591C Chemical and mechanical grinding method
07/22/2009CN100517590C Semiconductor device and its manufacturing method
07/22/2009CN100517589C Teater
07/22/2009CN100517588C Method for making patterned embedded capacitance layer
07/22/2009CN100517587C Apparatus and method for utilizing a meniscus in substrate processing
07/22/2009CN100517586C Substrate processing method and device
07/22/2009CN100517585C Substrate processing method and device
07/22/2009CN100517584C Methods for fabricating isolated micro- and nano- structures using soft or imprint lithography
07/22/2009CN100517583C Production method of compound semiconductor device wafer, wafer produced thereby and device
07/22/2009CN100517582C Mesoporous thin-membrane and process for producing the same
07/22/2009CN100517581C Method for manufacturing flash memory cell
07/22/2009CN100517580C Method for preparing and regulating semiconductor element grids
07/22/2009CN100517579C Metal oxide semiconductor device grid preparation method
07/22/2009CN100517578C Semiconductor device grids preparation method
07/22/2009CN100517577C Manufacturing method for grid of semiconductor device
07/22/2009CN100517576C Fabricating method for semiconductor device
07/22/2009CN100517575C Manufacturing method of semiconductor device grids
07/22/2009CN100517574C Silicon-rich nickel-silicide ohmic contacts for SiC semiconductor devices
07/22/2009CN100517573C Impurity introducing method and electronic element using it
07/22/2009CN100517572C Polycrystalline silicon thin film and preparation method of component thereof
07/22/2009CN100517571C 3-5 group compound semiconductor and method for preparation thereof
07/22/2009CN100517570C Vacuum drying device and drying method for substrate
07/22/2009CN100517569C Optical characteristic measuring device and measuring method, exposure device and method, and device manufacturing method
07/22/2009CN100517568C Low doped layer for nitride-based semiconductor device
07/22/2009CN100517567C Remote maintenance system and remote maintenance method for semiconductor manufacturing apparatus
07/22/2009CN100517566C Electronic rack
07/22/2009CN100517565C Method for configuring radiation sources and system for irradiate a substrate in turn
07/22/2009CN100517564C Fabrication method of semiconductor circuit device
07/22/2009CN100517563C Plasma processing apparatus and plasma processing method
07/22/2009CN100517562C Method for forming fine pattern of semiconductor device
07/22/2009CN100517561C Method for clearing pollutant on standard wafer surface and emendation method for depth-measuring device