Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2009
08/27/2009WO2009104643A1 Photocurable film-forming composition and method of forming a photocurable film
08/27/2009WO2009104621A1 Method for sr-ti-o-base film formation and recording medium
08/27/2009WO2009104620A1 Film production method and storage medium
08/27/2009WO2009104614A1 Method and apparatus for polishing outer circumferential end section of semiconductor wafer
08/27/2009WO2009104568A1 Single-axis drive aligner
08/27/2009WO2009104554A1 Semiconductor device fabrication method
08/27/2009WO2009104545A1 Method for manufacturing semiconductor pressure sensor
08/27/2009WO2009104536A1 Semiconductor chip and semiconductor device
08/27/2009WO2009104531A1 Film forming method
08/27/2009WO2009104517A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
08/27/2009WO2009104507A1 Thin film and method for manufacturing semiconductor device using the thin film
08/27/2009WO2009104506A1 Printed wiring board, electronic device and method for manufacturing electronic device
08/27/2009WO2009104465A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
08/27/2009WO2009104463A1 Vacuum processing device, method for maintaining vacuum processing device and vacuum processing factory
08/27/2009WO2009104446A1 Method for manufacturing active matrix substrate and method for manufacturing display device
08/27/2009WO2009104428A1 Magnetic random access memory
08/27/2009WO2009104427A1 Magnetic random access memory
08/27/2009WO2009104391A1 Low-loss small inductor element
08/27/2009WO2009104379A1 Atomic layer deposition apparatus and atomic layer deposition method
08/27/2009WO2009104371A1 Method for manufacturing flexible semiconductor substrate
08/27/2009WO2009104364A1 Method and apparatus for cutting substrate
08/27/2009WO2009104358A1 Ring oscillator
08/27/2009WO2009104345A1 Jig for laminate joining apparatus
08/27/2009WO2009104343A1 Semiconductor device and method for manufacturing semiconductor device
08/27/2009WO2009104334A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
08/27/2009WO2009104302A1 Tft, shift register, scanning signal line drive circuit, switch circuit, and display device
08/27/2009WO2009104299A1 Semiconductor device and method for manufacturing semiconductor device
08/27/2009WO2009104233A1 Semiconductor device and method for manufacturing the same
08/27/2009WO2009104231A1 Semiconductor device and manufacturing method for same
08/27/2009WO2009104224A1 Dresser for abrasive cloth
08/27/2009WO2009104222A1 Wire saw, and work cutting method
08/27/2009WO2009104132A1 Ultra high density capacity comprising pillar-shaped capacitors formed on both sides of a substrate
08/27/2009WO2009104068A1 Igbt and method of producing the same
08/27/2009WO2009104060A1 Oxidation after oxide dissolution
08/27/2009WO2009104049A1 Silicon substrate, method and equipment for making the silicon substrate
08/27/2009WO2009103907A2 Method for local etching of the surface of a substrate
08/27/2009WO2009103566A2 Measuring method and device for characterizing a semiconductor component
08/27/2009WO2009103277A2 Method and device for conveying and rotating impact-sensitive panels in ultra clean rooms
08/27/2009WO2009103266A2 Optoelectronic semiconductor body and method for producing an optoelectronic semiconductor body
08/27/2009WO2009086433A3 Non-volatile memory cell with charge storage layer in u-shaped groove
08/27/2009WO2009086231A3 Post-deposition cleaning methods and formulations for substrates with cap layers
08/27/2009WO2009085965A4 Removal of surface dopants from a substrate
08/27/2009WO2009085488A3 Device with asymmetric spacers
08/27/2009WO2009085337A3 Wafer fixture for wet process applications
08/27/2009WO2009085250A3 Methods of configuring a proximity head that provides uniform fluid flow relative to a wafer
08/27/2009WO2009083882A3 Memory cell suitable for dram memory
08/27/2009WO2009082431A3 Integrated circuit system with contact integration
08/27/2009WO2009081015A4 Method for localised hetero-epitaxy on a dielectric, in particular germanium on silicon oxide, and method and system for making a production base of a homogeneous or heterogeneous integrated circuit
08/27/2009WO2009080615A3 Process for the production of microelectromechanical systems
08/27/2009WO2009078975A3 Materials for particle removal by single-phase and two-phase media
08/27/2009WO2009073371A3 Systems and methods for link processing with ultrafast and nanosecond laser pulses
08/27/2009WO2009066949A3 Fabricating method of polycrystalline silicon thin film, polycrystalline silicon thin film fabricated using the same
08/27/2009WO2009065105A3 Thermal packaging of transmission controller using carbon composite printed circuit board material
08/27/2009WO2009064677A3 Cmp pad dressers
08/27/2009WO2009056235A3 Multilayer system comprising contact elements, and method for the production of a contact element for a multilayer system
08/27/2009WO2009047214A3 Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
08/27/2009WO2009046382A3 Nanoparticle coated electrode and method of manufacture
08/27/2009WO2009038817A3 Method, and extensions, to couple substrate effects and compact model circuit simulation for efficient simulation of semiconductor devices and circuit
08/27/2009WO2009038579A3 Thermoelastic self-actuation in piezoresistive resonators
08/27/2009WO2009029302A3 Shadow edge lithography for nanoscale patterning and manufacturing
08/27/2009WO2008139320A3 Antireflective coating compositions
08/27/2009WO2008091613A8 Microwave hybrid and plasma rapid thermal processing of semiconductor wafers
08/27/2009WO2007010645A8 Gallium nitride wafer
08/27/2009WO2006104100A8 Water purge agent, and method for resist pattern formation using the same
08/27/2009WO2004040620A3 Method and apparatus for implementing measurement or instrumentation on production equipment
08/27/2009US20090216450 Apparatus and method for inspecting overlapping figure, and charged particle beam writing apparatus
08/27/2009US20090216342 Method for generating and using a plasma processing control program
08/27/2009US20090215920 Silane polymer and method for forming silicon film
08/27/2009US20090215282 Processes for curing silicon based low-k dielectric materials
08/27/2009US20090215281 Hdp-cvd sion films for gap-fill
08/27/2009US20090215280 Passivation of Wide Band-Gap Based Semiconductor Devices with Hydrogen-Free Sputtered Nitrides
08/27/2009US20090215279 Organic/inorganic hybrid thin film passivation layer for blocking moisture/oxygen transmission and improving gas barrier property
08/27/2009US20090215278 Semiconductor device manufacturing method
08/27/2009US20090215277 Dual contact etch stop layer process
08/27/2009US20090215276 Photoelectrochemical cell with carbon nanotube-functionalized semiconductor electrode
08/27/2009US20090215275 Defect Etching of Germanium
08/27/2009US20090215274 Plasma processing apparatus and plasma processing method
08/27/2009US20090215273 Method of fabricating a semiconductor device
08/27/2009US20090215272 Double mask self-aligned double patterning technology (sadpt) process
08/27/2009US20090215271 Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
08/27/2009US20090215270 Polishing liquid and polishing method
08/27/2009US20090215269 Integrated chemical mechanical polishing composition and process for single platen processing
08/27/2009US20090215268 Polishing process for producing damage free surfaces on semi-insulating silicon carbide wafers
08/27/2009US20090215267 Method of manufacturing semiconductor device
08/27/2009US20090215266 Polishing Copper-Containing patterned wafers
08/27/2009US20090215265 Low-stain polishing composition
08/27/2009US20090215264 Process for selective growth of films during ecp plating
08/27/2009US20090215263 Method for increasing etch rate during deep silicon dry etch
08/27/2009US20090215262 Atomic layer deposition systems and methods including silicon-containing tantalum precursor compounds
08/27/2009US20090215261 Semiconductor device and method for manufacturing the same
08/27/2009US20090215260 Methods of forming a barrier layer in an interconnect structure
08/27/2009US20090215259 Semiconductor package and method of manufacturing the same
08/27/2009US20090215258 Semiconductor device manufacturing method
08/27/2009US20090215257 Semiconductor devices having a trench in a side portion of a conducting line pattern and methods of forming the same
08/27/2009US20090215256 Inverted T-Shaped Floating Gate Memory and Method for Fabricating the Same
08/27/2009US20090215255 Methods Of Forming Dispersions Of Nanoparticles, And Methods Of Forming Flash Memory Cells
08/27/2009US20090215254 Design support system,computer readable medium, semiconductor device designing method and semiconductor device manufacturing method
08/27/2009US20090215253 Method of Forming a Nitrogen-Enriched Region within Silicon-Oxide-Containing Masses
08/27/2009US20090215252 Methods of Depositing Materials Over Substrates, and Methods of Forming Layers over Substrates
08/27/2009US20090215251 Plasma immersion ion implantation process with chamber seasoning and seasoning layer plasma discharging for wafer dechucking
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