Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2009
08/20/2009WO2009101958A1 Illumination optical system, exposure device, device manufacturing method, correction filter, and exposure optical system
08/20/2009WO2009101949A1 Silica-titania glass, process for production thereof, and method for measuring coefficient of linear thermal expansion
08/20/2009WO2009101944A1 Method for manufacturing semiconductor element and fine structure arranging substrate, and display element
08/20/2009WO2009101938A1 Coating composition for semiconductor device protection film
08/20/2009WO2009101927A1 Top board of microwave plasma processing device, plasma processing device and plasma processing method
08/20/2009WO2009101913A1 Curable composition for nanoimprint and pattern-forming method
08/20/2009WO2009101904A1 Semiconductor device and method for manufacturing the same
08/20/2009WO2009101884A1 Gate valve
08/20/2009WO2009101878A1 Pattern forming method, semiconductor manufacturing apparatus and storage medium
08/20/2009WO2009101870A1 Semiconductor device
08/20/2009WO2009101869A1 Applying/developing apparatus, and applying/developing method
08/20/2009WO2009101868A1 Driving method for reverse conducting semiconductor element, semiconductor device, and feeding device
08/20/2009WO2009101866A1 Plasma measuring method, plasma measuring device, and storage medium
08/20/2009WO2009101862A1 Method for forming film for organic semiconductor layer and method for manufacturing organic thin film transistor
08/20/2009WO2009101853A1 Liquid processing system, liquid processing method and storage medium
08/20/2009WO2009101827A1 Magnetic domain wall motion device and magnetic random access memory
08/20/2009WO2009101824A1 Mis field effect transistor and method for manufacturing the same, and semiconductor device and method for manufacturing the same
08/20/2009WO2009101805A1 Semiconductor device and method for manufacturing the same
08/20/2009WO2009101766A1 Work duplex-head grinding apparatus, and work duplex-head grinding method
08/20/2009WO2009101763A1 Semiconductor device and manufacturing method thereof
08/20/2009WO2009101761A1 Cylindrical grinding equipment and grinding method
08/20/2009WO2009101760A1 Blade fixing jig set and fixing method
08/20/2009WO2009101758A1 Curable resin composition for nanoimprint
08/20/2009WO2009101704A1 Method for manufacturing semiconductor device
08/20/2009WO2009101685A1 Semiconductor element module and method for manufacturing the same
08/20/2009WO2009101664A1 Method for manufacturing semiconductor device
08/20/2009WO2009101662A1 Semiconductor device manufacturing method, semiconductor device and display apparatus
08/20/2009WO2009101568A1 An integrated circuit with a memory matrix with a delay monitoring column
08/20/2009WO2009101564A1 Finfet with separate gates and method for fabricating a finfet with separate gates
08/20/2009WO2009101495A1 Processing for bonding two substrates
08/20/2009WO2009101494A1 Semiconductor substrate surface preparation method
08/20/2009WO2009101249A1 A method for improving electrical conductivity and adhesion of an electrical coupling formed in a metal foil conductor, a component binding adhesive, an electrically conductive paste and an electrically conductive coating
08/20/2009WO2009101093A1 Cmos integration scheme employing a silicide electrode and a silicide-germanide alloy electrode
08/20/2009WO2009101040A2 Microstructure modification in copper interconnect structure
08/20/2009WO2009100603A1 A led and its manufacturing method
08/20/2009WO2009100483A1 Control and readout of electron or hole spin
08/20/2009WO2009082763A3 Method and apparatus for controlling plasma uniformity
08/20/2009WO2009075810A8 Avoiding floating diffusion contamination
08/20/2009WO2009072861A3 Packaging method for micromechanical device
08/20/2009WO2009072860A3 Insulation method for micromechanical device
08/20/2009WO2009061704A3 Atomic layer deposition encapsulation
08/20/2009WO2009061670A3 Workpiece support with fluid zones for temperature control
08/20/2009WO2009055862A8 Method of component assembly on a substrate
08/20/2009WO2009036215A8 Etching processes used in mems production
08/20/2009WO2009023396A3 Methods of forming a plurality of capacitors
08/20/2009WO2009017700A9 Polymer electronic devices by all-solution process
08/20/2009WO2009014804A3 Nanotube dual gate transistor and method of operating the same
08/20/2009WO2007078148A3 Flip chip mount type of bump, manufacturing method thereof, and bonding method for flip chip using non conductive adhesive
08/20/2009US20090210851 Lithography simulation method and computer program product
08/20/2009US20090210166 Method for predicting precipitation behavior of oxygen in silicon single crystal, method for determining production parameter of silicon single crystal, and storage medium for storing program for predicting precipitation behavior of oxygen in silicon single crystal
08/20/2009US20090209185 Chemical mechanical polishing pad
08/20/2009US20090209176 Method and apparatus for polishing object
08/20/2009US20090209175 Polishing apparatus and substrate processing method
08/20/2009US20090209113 Substrate processing apparatus, method of manufacturing semiconductor device, and ceiling insulating part
08/20/2009US20090209112 Millisecond annealing (dsa) edge protection
08/20/2009US20090209111 Method for fabricating semiconductor device
08/20/2009US20090209110 Spin etching method for semiconductor wafer
08/20/2009US20090209109 Pattern forming method, semiconductor device manufacturing method and semiconductor device manufacturing apparatus
08/20/2009US20090209108 Substrate processing method
08/20/2009US20090209107 Method of forming an electronic device including forming features within a mask and a selective removal process
08/20/2009US20090209106 In Situ Cu Seed Layer Formation for Improving Sidewall Coverage
08/20/2009US20090209105 Pattern forming method, semiconductor device manufacturing method and semiconductor device manufacturing apparatus
08/20/2009US20090209104 Polishing slurry for cmp, and polishing method
08/20/2009US20090209103 Barrier slurry compositions and barrier cmp methods
08/20/2009US20090209102 Use of CMP to contact a MTJ structure without forming a via
08/20/2009US20090209101 Ruthenium alloy film for copper interconnects
08/20/2009US20090209100 Fabrication method for memory device
08/20/2009US20090209099 Forming Diffusion Barriers by Annealing Copper Alloy Layers
08/20/2009US20090209098 Multi-Step Cu Seed Layer Formation for Improving Sidewall Coverage
08/20/2009US20090209097 Method of forming interconnects
08/20/2009US20090209096 Method for manufacturing semiconductor device having decreased contact resistance
08/20/2009US20090209095 Manufacturing Method for Semiconductor Devices and Substrate Processing Apparatus
08/20/2009US20090209094 Semiconductor Element Manufacturing Method
08/20/2009US20090209093 Plasma deposition apparatus and method for making polycrystalline silicon
08/20/2009US20090209092 Seimiconductor devices and methods of manufacture thereof
08/20/2009US20090209091 Method of Manufacturing Group III Nitride Crystal
08/20/2009US20090209090 Manufacturing method of semiconductor device
08/20/2009US20090209089 Dicing die-bonding film
08/20/2009US20090209088 Semiconductor chip fabrication method
08/20/2009US20090209087 Manufacturing method of semiconductor devices
08/20/2009US20090209086 Method for manufacturing semiconductor device
08/20/2009US20090209085 Method for reusing delaminated wafer
08/20/2009US20090209084 Cleave initiation using varying ion implant dose
08/20/2009US20090209083 Hybrid Gap-fill Approach for STI Formation
08/20/2009US20090209082 Semiconductor Device and Method for Fabricating the Same
08/20/2009US20090209081 Silicon Dioxide Thin Films by ALD
08/20/2009US20090209079 Method for manufacturing semiconductor device
08/20/2009US20090209078 Semiconductor Integrated Circuit Device and Method of Manufacturing the Same
08/20/2009US20090209077 Semiconductor device channel termination
08/20/2009US20090209076 Method for manufacturing sonos flash memory
08/20/2009US20090209075 Laterally double-diffused metal oxide semiconductor transistor and method for fabricating the same
08/20/2009US20090209074 Method of forming a multi-fin multi-gate field effect transistor with tailored drive current
08/20/2009US20090209073 Gate Structure in a Trench Region of a Semiconductor Device and Method for Manufacturing the Same
08/20/2009US20090209072 Methods Of Forming Transistor Gates, Methods Of Forming Memory Cells, And Methods Of Forming DRAM Arrays
08/20/2009US20090209071 Methods of manufacturing semiconductor devices
08/20/2009US20090209070 Method for manufacturing a thin film transistor having a micro-crystalline silicon hydrogen feeding layer formed between a metal gate and a gate insulating film.
08/20/2009US20090209069 Organic semiconductor device and method for manufacturing the same
08/20/2009US20090209068 Method of manufacturing thin film transistor substrate
08/20/2009US20090209067 Semiconductor device method of manfacturing a quantum well structure and a semiconductor device comprising such a quantum well structure
08/20/2009US20090209066 Die bonding method and die bonder
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