Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2009
08/20/2009US20090209065 Method of manufacturing semiconductor device and ultrasonic bonding apparatus
08/20/2009US20090209064 Lead frame land grid array
08/20/2009US20090209063 Chipstack package and manufacturing method thereof
08/20/2009US20090209062 Method of manufacturing semiconductor device and the semiconductor device
08/20/2009US20090209061 Method of manufacturing semiconductor package
08/20/2009US20090209060 Photoelectric converting film stack type solid-state image pickup device, and method of producing the same
08/20/2009US20090209058 Method of fabricating image sensor
08/20/2009US20090209055 Method to fabricate semiconductor optical device
08/20/2009US20090209054 Method for manufacturing a liquid crystal display
08/20/2009US20090209053 Connection device and test system
08/20/2009US20090209052 Process for the collective fabrication of 3d electronic modules
08/20/2009US20090209051 NONVOLATILE FERROELECTRIC PERPENDICULAR ELECTRODE CELL, FeRAM HAVING THE CELL AND METHOD FOR MANUFACTURING THE CELL
08/20/2009US20090209050 In-Situ Formed Capping Layer in MTJ Devices
08/20/2009US20090208966 Method for removing a fluid substance from a closed system
08/20/2009US20090208922 Fet based sensor for detecting biomolecule, method for preparing the same, and method for detecting biomolecule using the fet based sensor
08/20/2009US20090208852 Pattern forming method, semiconductor device manufacturing method and semiconductor device manufacturing apparatus
08/20/2009US20090208851 Photomask, Fabrication Method for the Same and Pattern Formation Method Using the Same
08/20/2009US20090208753 Methods and articles including nanomaterial
08/20/2009US20090208737 Lamella structured thin films with ultralow dielectric constants and high hardness and method for manufacturing the same
08/20/2009US20090207681 Systems and devices including local data lines and methods of using, making, and operating the same
08/20/2009US20090207667 Nand flash memory array with cut-off gate line and methods for operating and fabricating the same
08/20/2009US20090207662 Multi-Transistor Non-Volatile Memory Element
08/20/2009US20090207654 Semiconductor device including plurality of parallel input/output lines and methods of fabricating and using the same
08/20/2009US20090207653 Memory storage device with heating element
08/20/2009US20090207473 Device having power generating black mask and method of fabricating the same
08/20/2009US20090207406 Particle inspection apparatus, exposure apparatus, and device manufacturing method
08/20/2009US20090207398 Near Field Exposure That Reduces Scatter of a Surface Plasmon Polariton Wave Going Around a Light Blocking Member
08/20/2009US20090207397 Lithographic apparatus and device manufacturing method
08/20/2009US20090207332 Integral-type liquid crystal panel with image sensor function
08/20/2009US20090206946 Apparatus and method for reducing propagation delay in a conductor
08/20/2009US20090206863 System and Method for Testing a Plurality of Circuits
08/20/2009US20090206740 Organic light emitting diode and method of fabricating the same
08/20/2009US20090206739 Organic light-emitting diode display device and method of manufacturing the same
08/20/2009US20090206728 Light-emitting device, method for manufacturing light-emitting device, and substrate processing apparatus
08/20/2009US20090206494 Wiring over substrate, semiconductor device, and methods for manufacturing thereof
08/20/2009US20090206493 Flip Chip Interconnection Pad Layout
08/20/2009US20090206490 semiconductor device and a method of manufacturing the sae
08/20/2009US20090206489 Dual damascene metal interconnect structure having a self-aligned via
08/20/2009US20090206488 Through substrate annular via including plug filler
08/20/2009US20090206487 Wire bonding substrate and fabrication thereof
08/20/2009US20090206484 Microstructure modification in copper interconnect structure
08/20/2009US20090206483 Nanotube and metal composite interconnects
08/20/2009US20090206482 Tooling method for fabricating a semiconductor device and semiconductor devices fabricated thereof
08/20/2009US20090206481 Stacking of transfer carriers with aperture arrays as interconnection joints
08/20/2009US20090206480 Fabricating low cost solder bumps on integrated circuit wafers
08/20/2009US20090206479 Solder interconnect pads with current spreading layers
08/20/2009US20090206478 Flip chip device and manufacturing method thereof
08/20/2009US20090206477 Semiconductor device and method of manufacturing semiconductor device
08/20/2009US20090206475 Method of manufacturing semiconductor device, and semiconductor device
08/20/2009US20090206474 Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film
08/20/2009US20090206473 System and Method for Integrated Waveguide Packaging
08/20/2009US20090206472 Cof packaging structure, method of manufacturing the cof packaging structure, and method for assembling a driver ic and the cof packaging structure thereof
08/20/2009US20090206471 Electronic parts packaging structure and method of manufacturing the same
08/20/2009US20090206470 Semiconductor device manufacturing method, semiconductor device, and wiring board
08/20/2009US20090206469 Semiconductor device and method of manufacturing semiconductor device
08/20/2009US20090206468 Board on chip package and manufacturing method thereof
08/20/2009US20090206465 Semiconductor chip package structure for achieving electrical connection without using a wire-bonding process and method for making the same
08/20/2009US20090206463 Semiconductor device, method of manufacturing the same, and electronic equipment using the same
08/20/2009US20090206462 Semiconductor device and method for manufacturing thereof
08/20/2009US20090206461 Integrated circuit and method
08/20/2009US20090206460 Intermediate Bond Pad for Stacked Semiconductor Chip Package
08/20/2009US20090206457 Resin molding part and manufacturing method thereof
08/20/2009US20090206456 Module including a sintered joint bonding a semiconductor chip to a copper surface
08/20/2009US20090206455 Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom
08/20/2009US20090206454 Semiconductor device and method for fabricating the same
08/20/2009US20090206450 Method of manufacturing a semiconductor device, semiconductor device obtained herewith, and slurry suitable for use in such a method
08/20/2009US20090206449 Stress-modified device structures, methods of fabricating such stress-modified device structures, and design structures for an integrated circuit
08/20/2009US20090206448 Semiconductor device and method for manufacturing the same
08/20/2009US20090206447 Anti-fuse device structure and electroplating circuit structure and method
08/20/2009US20090206446 Electrical Device and Fabrication Method
08/20/2009US20090206445 Semiconductor device and method of forming the same
08/20/2009US20090206443 Devices including fin transistors robust to gate shorts and methods of making the same
08/20/2009US20090206442 Method and structure for relieving transistor performance degradation due to shallow trench isolation induced stress
08/20/2009US20090206441 Method of forming coplanar active and isolation regions and structures thereof
08/20/2009US20090206438 Semiconductor component
08/20/2009US20090206432 Image sensor and method of manufacturing the same
08/20/2009US20090206431 Imager wafer level module and method of fabrication and use
08/20/2009US20090206430 Solid-state imaging device and method for manufacturing the same
08/20/2009US20090206429 Angled implant for trench isolation
08/20/2009US20090206425 Semiconductor device and method of manufacturing semiconductor device
08/20/2009US20090206424 Hall-effect device with merged and/or non-merged complementary structure
08/20/2009US20090206423 Method for manufacturing micromechanical components
08/20/2009US20090206422 Micromechanical diaphragm sensor having a double diaphragm
08/20/2009US20090206421 Organic light emitting display and manufacturing method thereof
08/20/2009US20090206420 Semiconductor device and method
08/20/2009US20090206419 Monolithically integrated semiconductor assembly having a power component and method for producing a monolithically intergrated semiconductor assembly
08/20/2009US20090206417 Semiconductor device and method for fabricating the same
08/20/2009US20090206416 Dual metal gate structures and methods
08/20/2009US20090206415 Semiconductor element structure and method for making the same
08/20/2009US20090206414 Contact Configuration and Method in Dual-Stress Liner Semiconductor Device
08/20/2009US20090206413 Cmos integration scheme employing a silicide electrode and a silicide-germanide alloy electrode
08/20/2009US20090206412 Hybrid orientation scheme for standard orthogonal circuits
08/20/2009US20090206411 Semiconductor device and a method of manufacturing the same
08/20/2009US20090206410 Semiconductor device and method for manufacturing the same
08/20/2009US20090206408 Nested and isolated transistors with reduced impedance difference
08/20/2009US20090206407 Semiconductor devices having tensile and/or compressive stress and methods of manufacturing
08/20/2009US20090206406 Multi-gate device having a t-shaped gate structure
08/20/2009US20090206405 Fin field effect transistor structures having two dielectric thicknesses
08/20/2009US20090206404 Reducing external resistance of a multi-gate device by silicidation
08/20/2009US20090206401 Trench transistor and method for fabricating a trench transistor
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