| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/08/2009 | US7584537 Method for making a microcircuit card |
| 09/08/2009 | US7584536 Process for precise alignment of packaging caps on a substrate |
| 09/08/2009 | CA2492557C Process for preparing fine metal oxide particles |
| 09/08/2009 | CA2475966C Crystal production method |
| 09/08/2009 | CA2403730C Method and composition for removing sodium-containing material from microcircuit substrates |
| 09/08/2009 | CA2333579C Self-aligned methods of fabricating silicon carbide power devices by implantation and lateral diffusions |
| 09/08/2009 | CA2281788C Method of producing silicon oxide film, method of manufacturing semiconductor device, semiconductor device, display, and infrared irradiating device |
| 09/07/2009 | CA2625251A1 High performance micro-fabricated electrostatic quadrupole lens |
| 09/03/2009 | WO2009108860A2 Microrna-based methods and compositions for the diagnosis, pronosis and treatment of prostate related disorders |
| 09/03/2009 | WO2009108781A2 Method of forming an embedded silicon carbon epitaxial layer |
| 09/03/2009 | WO2009108771A2 Methods of patterning a conductor on a substrate |
| 09/03/2009 | WO2009108568A2 Gas flow equalizer plate suitable for use in a substrate process chamber |
| 09/03/2009 | WO2009108543A2 Multi-photon exposure system |
| 09/03/2009 | WO2009108488A1 A process for selective growth of films during ecp plating |
| 09/03/2009 | WO2009108446A1 Memory device with local data lines and method of making and operating the same |
| 09/03/2009 | WO2009108438A2 Semiconductor constructions, and methods of forming semiconductor constructions |
| 09/03/2009 | WO2009108404A2 Bottom-up assembly of structures on a substrate |
| 09/03/2009 | WO2009108370A1 An etch stop layer of reduced thickness for patterning a dielectric material in a contact level of closely spaced transistors |
| 09/03/2009 | WO2009108366A2 A semiconductor device comprising a metal gate stack of reduced height and method of forming the same |
| 09/03/2009 | WO2009108365A1 A cmos device comprising an nmos transistor with recessed drain and source areas and a pmos transistor having a silicon/germanium material in the drain and source areas |
| 09/03/2009 | WO2009108358A1 Methods of making an unsupported article of pure or doped semiconducting material |
| 09/03/2009 | WO2009108311A2 Isolated transistors and diodes and isolation and termination structures for semiconductor die |
| 09/03/2009 | WO2009108266A1 Plasma immersion ion implantation process with chamber seasoning and seasoning layer plasma discharging for wafer dechucking |
| 09/03/2009 | WO2009108226A2 Protection of carbon nanotubes |
| 09/03/2009 | WO2009108202A1 Methods of teaching bonding locations and inspecting wire loops on a wire bonding machine, and apparatuses for performing the same |
| 09/03/2009 | WO2009108201A1 Semiconductor substrate contact via |
| 09/03/2009 | WO2009108173A2 Methods for formation of substrate elements |
| 09/03/2009 | WO2009108101A1 Deposition and selective removal of conducting helplayer for nanostructure processing |
| 09/03/2009 | WO2009107986A1 An aqueous slurry composition for chemical mechanical polishing and chemical mechanical polishing method |
| 09/03/2009 | WO2009107780A1 Magnetoresistive memory device and operation method thereof |
| 09/03/2009 | WO2009107768A1 Method for formation of siliceous film and siliceous film formed by the method |
| 09/03/2009 | WO2009107747A1 Wiring board and probe card |
| 09/03/2009 | WO2009107742A1 Semiconductor device |
| 09/03/2009 | WO2009107741A1 Semiconductor inspection apparatus, semiconductor wafer positioning method, and semiconductor wafer inspection method |
| 09/03/2009 | WO2009107728A1 Transfer apparatus, vacuum processing apparatus and transfer method |
| 09/03/2009 | WO2009107718A1 Plasma etching apparatus and plasma etching method |
| 09/03/2009 | WO2009107701A1 Wafer-supporting member, method for producing the same, and electrostatic chuck using the same |
| 09/03/2009 | WO2009107699A1 Curable epoxy composition, anisotropic conductive material and connection structure |
| 09/03/2009 | WO2009107664A1 Load lock apparatus and substrate cooling method |
| 09/03/2009 | WO2009107567A1 Method for machining nitride semiconductor wafer, nitride semiconductor wafer, process for producing nitride semiconductor device, and nitride semiconductor device |
| 09/03/2009 | WO2009107562A1 Semiconductor device and method for manufacturing the same |
| 09/03/2009 | WO2009107558A1 Probe inspecting method and curable resin composition |
| 09/03/2009 | WO2009107550A1 Conveying robot |
| 09/03/2009 | WO2009107510A1 Projection optical system, exposure apparatus and device manufacturing method |
| 09/03/2009 | WO2009107485A1 Method and apparatus for manufacturing magnetoresistance effect element |
| 09/03/2009 | WO2009107472A1 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method using the same, and method for regenerating aqueous dispersion for chemical mechanical polishing |
| 09/03/2009 | WO2009107333A1 Carrier for double-side polishing device, and double-side polishing device and double-side polishing method that use same |
| 09/03/2009 | WO2009107327A1 Monomer having electron-withdrawing substituent and lactone skeleton, polymeric compound, and photoresist composition |
| 09/03/2009 | WO2009107319A1 Ultrasonic washing apparatus, and ultrasonic washing method |
| 09/03/2009 | WO2009107294A1 Roller type nano-imprint device, mold roll for the roller type nano-imprint device, fixed roll for the roller type nano-imprint device, and nano-imprint sheet manufacturing method |
| 09/03/2009 | WO2009107289A1 Iridium alloy excellent in hardness, processability and stain proofness |
| 09/03/2009 | WO2009107254A1 Wafer storage container with back supporting structure |
| 09/03/2009 | WO2009107250A1 Cold joining device |
| 09/03/2009 | WO2009107241A1 Multidot flash memory |
| 09/03/2009 | WO2009107239A1 Semiconductor producing apparatus and method of pipe purging therefor |
| 09/03/2009 | WO2009107231A1 Electronic component transfer apparatus, and electronic component test equipment equipped with the same |
| 09/03/2009 | WO2009107229A1 Sheet structure, semiconductor device and method of growing carbon structure |
| 09/03/2009 | WO2009107205A1 Semiconductor device and method for manufacturing the same |
| 09/03/2009 | WO2009107196A1 Method for plasma deposition and plasma cvd system |
| 09/03/2009 | WO2009107182A1 Semiconductor device having electrode pad and radio circuit apparatus comprising the semiconductor device |
| 09/03/2009 | WO2009107171A1 Method for manufacturing thin film multilayer device, method for manufacturing display device, and thin film multilayer device |
| 09/03/2009 | WO2009107087A1 Semiconductor device and method of manufacture thereof |
| 09/03/2009 | WO2009107086A1 Semiconductor device and method of manufacture thereof |
| 09/03/2009 | WO2009107031A1 Method for manufacturing semiconductor device and semiconductor device |
| 09/03/2009 | WO2009106915A1 Method for reducing the amount or eliminating the crystalline defects, in a semiconductor layer of a composite structure |
| 09/03/2009 | WO2009106810A1 Semiconductor nanoparticle capping agents |
| 09/03/2009 | WO2009106654A1 Method for obtaining films of semiconductor materials including an intermediate band |
| 09/03/2009 | WO2009106520A1 Bilayer metal capping layer for interconnect applications |
| 09/03/2009 | WO2009106400A1 Method for maintaining lowest doping levels in semicondcutor production |
| 09/03/2009 | WO2009106384A1 Wire bonder |
| 09/03/2009 | WO2009106177A1 Method of transferring a thin layer onto a support substrate |
| 09/03/2009 | WO2009106028A1 Optoelectronic component and method for producing an optoelectronic component |
| 09/03/2009 | WO2009105885A1 Method and apparatus for interrogating electronic components |
| 09/03/2009 | WO2009105807A1 A sub-assembly for use in fabricating photo- electrochemical devices and a method of producing a sub-assembly |
| 09/03/2009 | WO2009090454A3 Method for treating germanium surfaces and solutions to be employed therein |
| 09/03/2009 | WO2009088659A3 Micropad formation for a semiconductor |
| 09/03/2009 | WO2009086020A3 Method and apparatus for managing test result data generated by a semiconductor test system |
| 09/03/2009 | WO2009085958A3 Passivation layer formation by plasma clean process to reduce native oxide growth |
| 09/03/2009 | WO2009085672A3 Fabrication of a silicon structure and deep silicon etch with profile control |
| 09/03/2009 | WO2009085609A3 3-d semiconductor die structure with containing feature and method |
| 09/03/2009 | WO2009082109A3 Process monitoring apparatus and method |
| 09/03/2009 | WO2009042997A4 Wafer bow metrology arrangements and methods thereof |
| 09/03/2009 | WO2009037673A3 An integrated wafer transfer mechanism |
| 09/03/2009 | WO2008153245A3 Semiconductor package module using anodized oxide layer and manufacturing method thereof |
| 09/03/2009 | WO2008084085A9 Method of fabricating a transistor with semiconductor gate combined locally with a metal |
| 09/03/2009 | WO2008039916A8 Organometallic precursor compounds |
| 09/03/2009 | WO2007018959A3 Hexachloroplatinic acid assisted silicon nanoparticle formation method |
| 09/03/2009 | WO2006028693A3 Stacked integrated circuit cascade signaling system and method |
| 09/03/2009 | US20090222135 Method for teaching carrier means, storage medium and substrate processing apparatus |
| 09/03/2009 | US20090222132 Paste dispenser and method for controlling the same |
| 09/03/2009 | US20090221223 Multilayer retaining ring for chemical mechanical polishing |
| 09/03/2009 | US20090221216 Pad dresser, polishing device, and pad dressing method |
| 09/03/2009 | US20090221215 Adhesive sheet for grinding back surface of semiconductor wafer and method for grinding back surface of semiconductor wafer using the same |
| 09/03/2009 | US20090221213 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device |
| 09/03/2009 | US20090221152 Etching Solution And Method For Structuring A UBM Layer System |
| 09/03/2009 | US20090221151 Electrode for plasma processing apparatus, plasma processing apparatus, plasma processing method and storage medium |
| 09/03/2009 | US20090221150 Etch rate and critical dimension uniformity by selection of focus ring material |
| 09/03/2009 | US20090221149 Multiple port gas injection system utilized in a semiconductor processing system |
| 09/03/2009 | US20090221148 Plasma etching method, plasma etching apparatus and computer-readable storage medium |
| 09/03/2009 | US20090221147 Method of fabricating semiconductor device |