Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2009
09/03/2009US20090221146 Nonvolatile memory device and manufacturing method for the same
09/03/2009US20090221145 Metal polishing slurry and chemical mechanical polishing method
09/03/2009US20090221144 Manufacturing method for nano scale Ge metal structure
09/03/2009US20090221143 Method of cleaning and process for producing semiconductor device
09/03/2009US20090221142 Method of forming a metal bump on a semiconductor device
09/03/2009US20090221141 Method for patterning crystalline indium tin oxide using femtosecond laser
09/03/2009US20090221140 Method of fabricating non-volatile memory device having separate charge trap patterns
09/03/2009US20090221139 Method of producing semiconductor device
09/03/2009US20090221138 Method of manufacturing semiconductor device
09/03/2009US20090221137 Semiconductor device and manufacturing method therefor
09/03/2009US20090221136 Method of implanting ion species into microstructure products by concurrently cleaning the implanter
09/03/2009US20090221135 Rapid Heating With Nanoenergetic Materials
09/03/2009US20090221134 Semiconductor Device and Method of Manufacturing Semiconductor Device
09/03/2009US20090221133 Methods of Fabricating Silicon on Insulator (SOI) Wafers
09/03/2009US20090221132 Method for manufacturing semiconductor apparatus and method for manufacturing electro-optical apparatus
09/03/2009US20090221131 Method for preparing substrate having monocrystalline film
09/03/2009US20090221130 N-type semiconductor carbon nanomaterial, method for producing n-type semiconductor carbon nanomaterial, and method for manufacturing semiconductor device
09/03/2009US20090221129 Semiconductor seal ring and method of manufacture thereof
09/03/2009US20090221128 Nonvolatile semiconductor memory device having element isolating region of trench type
09/03/2009US20090221127 Method of manufacturing a semiconductor device having a stacked capacitor
09/03/2009US20090221126 Method of Fabricating Capacitor of Semiconductor Device
09/03/2009US20090221125 Bipolar Junction Transistor and Manufacturing Method Thereof
09/03/2009US20090221124 Manufacturing method of semiconductor device
09/03/2009US20090221123 Method for increasing penetration depth of drain and source implantation species for a given gate height
09/03/2009US20090221122 MOS Field Effect Transistor and Manufacture Method Therefor
09/03/2009US20090221121 Method of Forming a Salicide Layer for a Semiconductor Device
09/03/2009US20090221120 Method of forming a gate dielectric
09/03/2009US20090221119 Fabrication of a semiconductor device with stressor
09/03/2009US20090221118 High Voltage Semiconductor Devices
09/03/2009US20090221117 Integrated circuit system employing resistance altering techniques
09/03/2009US20090221116 Method for Manufacturing Semiconductor Device
09/03/2009US20090221115 Reduction of memory instability by local adaptation of re-crystallization conditions in a cache area of a semiconductor device
09/03/2009US20090221114 Packaging an integrated circuit die using compression molding
09/03/2009US20090221112 Method for Metallizing Semiconductor Elements and Use Thereof
09/03/2009US20090221110 Vertical light emitting diode and method of manufacturing the same
09/03/2009US20090221109 Organic light emitting display and method of fabricating the same
09/03/2009US20090221108 Miniature optical element for wireless bonding in an electronic instrument
09/03/2009US20090221107 Deposition Method and Manufacturing Method of Light-Emitting Device
09/03/2009US20090221106 Article and method for color and intensity balanced solid state light sources
09/03/2009US20090221105 Manufacturing method for semiconductor integrated circuit device
09/03/2009US20090221104 Method of manufacturing a semiconductor device
09/03/2009US20090221103 Fabrication method of semiconductor integrated circuit device
09/03/2009US20090220897 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide
09/03/2009US20090220894 Semiconductor device manufacturing method
09/03/2009US20090220888 Dyed photoresists and methods and articles of manufacture comprising same
09/03/2009US20090220869 Reflection-type mask and method of making the reflection-type mask
09/03/2009US20090220868 Mask and design method thereof
09/03/2009US20090220822 Ferroelectric recording medium and method of manufacturing the same
09/03/2009US20090220783 Adhesive Sheet for Dicing and Die Bonding
09/03/2009US20090220782 Method of Forming Gallium Arsenide-On-Insulator
09/03/2009US20090220710 Process of making a microtube and microfluidic devices formed therewith
09/03/2009US20090220322 Vacuum Processing Apparatus And Semiconductor Manufacturing Line Using The Same
09/03/2009US20090219969 Substrate surface temperature measurement method, substrate processing apparatus using the same, and semiconductor device manufacturing method
09/03/2009US20090219777 Multi-chip assembly and method for driving the same
09/03/2009US20090219772 Three dimensional structure memory
09/03/2009US20090219755 Integrated circuit including an electrode having an outer portion with greater resistivity
09/03/2009US20090219744 Three dimensional structure memory
09/03/2009US20090219743 Three dimensional structure memory
09/03/2009US20090219742 Three dimensional structure memory
09/03/2009US20090219504 Substrate conveyor apparatus, substrate conveyance method and exposure apparatus
09/03/2009US20090219104 Mems resonator, a method of manufacturing thereof, and a mems oscillator
09/03/2009US20090219069 Semiconductor integrated circuit device
09/03/2009US20090218743 Substrate holding apparatus, exposure apparatus, exposing method, device fabricating method, plate member, and wall
09/03/2009US20090218701 Inductively coupled integrated circuit with magnetic communication path and methods for use therewith
09/03/2009US20090218700 Three dimensional structure memory
09/03/2009US20090218699 Metal interconnects in a dielectric material
09/03/2009US20090218698 Wafer-Level Integrated Circuit Package with Top and Bottom Side Electrical Connections
09/03/2009US20090218697 Electronic device, method of manufacture of the same, and sputtering target
09/03/2009US20090218694 Semiconductor device, manufacturing method of semiconductor device, semiconductor manufacturing and inspecting apparatus, and inspecting apparatus
09/03/2009US20090218693 Low resistance high reliability contact via and metal line structure for semiconductor device
09/03/2009US20090218692 Barrier for Copper Integration in the FEOL
09/03/2009US20090218691 Bilayer metal capping layer for interconnect applications
09/03/2009US20090218690 Reduced-Stress Through-Chip Feature and Method of Making the Same
09/03/2009US20090218689 Flip chip semiconductor assembly with variable volume solder bumps
09/03/2009US20090218686 Semiconductor, semiconductor module, method for manufacturing the semiconductor module, and mobile apparatus
09/03/2009US20090218685 Semiconductor module and method of producing the same
09/03/2009US20090218683 Semiconductor Device
09/03/2009US20090218681 Carbon nanotube and metal thermal interface material, process of making same, packages containing same, and systems containing same
09/03/2009US20090218680 Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive
09/03/2009US20090218677 Board-on-chip type substrates with conductive traces in multiple planes, semiconductor device packages including such substrates, and associated methods
09/03/2009US20090218675 Multipackage module having stacked packages with asymmetrically arranged die and molding
09/03/2009US20090218671 Semiconductor device and method of fabricating the same
09/03/2009US20090218669 Multi-chip package structure and method of fabricating the same
09/03/2009US20090218668 Double-side mountable MEMS package
09/03/2009US20090218667 Smart cards and methods for producing a smart card
09/03/2009US20090218666 Power device package and method of fabricating the same
09/03/2009US20090218665 Power device package and method of fabricating the same
09/03/2009US20090218663 Lead frame based semiconductor package and a method of manufacturing the same
09/03/2009US20090218661 Silicon substrate and manufacturing method thereof
09/03/2009US20090218660 Semiconductor substrate, semiconductor device and method of manufacturing the same
09/03/2009US20090218659 Chamfered freestanding nitride semiconductor wafer and method of chamfering nitride semiconductor wafer
09/03/2009US20090218658 Semiconductor device, electronic device, and manufacturing method of the same
09/03/2009US20090218656 Methods of making semiconductor structures including vertical diode structures
09/03/2009US20090218655 Integrated passive devices
09/03/2009US20090218652 Device comprising electrode pad
09/03/2009US20090218649 Highly efficient silicon detector with wide spectral range
09/03/2009US20090218644 Integrated Circuit, Memory Device, and Method of Manufacturing an Integrated Circuit
09/03/2009US20090218642 Microelectromechanical systems component and method of making same
09/03/2009US20090218640 Self Aligned Silicided Contacts
09/03/2009US20090218639 Semiconductor device comprising a metal gate stack of reduced height and method of forming the same