Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2009
08/20/2009US20090206400 Systems and devices including fin transistors and methods of using, making, and operating the same
08/20/2009US20090206399 Method of forming a recess channel trench pattern, and fabricating a recess channel transistor
08/20/2009US20090206398 Semiconductor device and manufacturing method of the semiconductor device
08/20/2009US20090206395 Trench mosfet with double epitaxial structure
08/20/2009US20090206394 Strained Channel PMOS Transistor and Corresponding Production Method
08/20/2009US20090206393 Nonvolatile memory element and method of manufacturing the same
08/20/2009US20090206392 Memory device and fabrication method thereof
08/20/2009US20090206391 Semiconductor memory device and method for manufacturing the same
08/20/2009US20090206390 Semiconductor nonvolatile memory device with inter-gate insulating film formed on the side surface of a memory cell and method for manufacturing the same
08/20/2009US20090206389 Nonvolatile memory device and method of manufacturing the same
08/20/2009US20090206388 Seperation methods for semiconductor charge accumulation layers and structures thereof
08/20/2009US20090206387 Non-volatile memory device, method of fabricating the same, and non-volatile semiconductor integrated circuit device, including the same
08/20/2009US20090206386 Decoding system capable of charging protection for flash memory devices
08/20/2009US20090206382 Flash memory device and programming and erasing methods therewith
08/20/2009US20090206381 Anti-fuse and method for forming the same, unit cell of nonvolatile memory device with the same
08/20/2009US20090206380 Apparatus and method for using a well current source to effect a dynamic threshold voltage of a mos transistor
08/20/2009US20090206379 Semiconductor device and manufacturing method thereof
08/20/2009US20090206377 Method and device for reducing crosstalk in back illuminated imagers
08/20/2009US20090206375 Reduced Leakage Current Field-Effect Transistor Having Asymmetric Doping And Fabrication Method Therefor
08/20/2009US20090206370 Method and apparatus for fabricating a heterojunction bipolar transistor
08/20/2009US20090206367 Design Structure and Method for a Silicon Controlled Rectifier (SCR) Structure for SOI Technology
08/20/2009US20090206366 Semiconductor device and method for fabricating the same
08/20/2009US20090206364 Insulated gate bipolar transistor and method of fabricating the same
08/20/2009US20090206361 Group iii nitride semiconductor light emitting device, method for producing the same, and lamp thereof
08/20/2009US20090206360 Nitride semiconductor light emitting device and method of manufacturing the same
08/20/2009US20090206359 Light-emitting diode and method for fabrication thereof
08/20/2009US20090206358 Package structure of compound semiconductor device and fabricating method thereof
08/20/2009US20090206353 Thin-light emitting diode lamp, and method of manufacturing the same
08/20/2009US20090206352 Luminescence conversion led
08/20/2009US20090206349 Semiconductor device and method of manufacturing the same
08/20/2009US20090206348 Composite Substrate, and Method for the Production of a Composite Substrate
08/20/2009US20090206346 Tft lcd array substrate and manufacturing method thereof
08/20/2009US20090206345 Semiconductor device
08/20/2009US20090206341 Solution-processed high mobility inorganic thin-film transistors
08/20/2009US20090206339 Flat display device and method for manufacturing the same
08/20/2009US20090206338 Array substrate, liquid crystal display module including the array substrate and method of fabricating the array substrate
08/20/2009US20090206336 Method to fabricate gate electrodes
08/20/2009US20090206335 Bipolar complementary semiconductor device
08/20/2009US20090206333 ZnO BASED SEMICONDUCTOR DEVICE AND ITS MANUFACTURE METHOD
08/20/2009US20090206332 Oxide semiconductor transistor and method of manufacturing the same
08/20/2009US20090206324 Dislocation removal from a group iii-v film grown on a semiconductor substrate
08/20/2009US20090206323 Light-emitting element and method for manufacturing the same
08/20/2009US20090206321 Thin film transistor comprising nanowires and fabrication method thereof
08/20/2009US20090206320 Group iii nitride white light emitting diode
08/20/2009US20090206282 Method for manufacturing semiconductor device or photomask
08/20/2009US20090206265 Electron Bombarded Image Sensor Array Device and Its Manufacturing Method
08/20/2009US20090206058 Plasma processing apparatus and method, and storage medium
08/20/2009US20090206055 Plasma processing apparatus and method, and baffle plate of the plasma processing apparatus
08/20/2009US20090206001 Substrate container
08/20/2009US20090205930 Break-away positioning conveyor mount for accommodating conveyor belt bends
08/20/2009US20090205851 Electronic circuit device and method for fabricating the same
08/20/2009US20090205783 Substrate processing apparatus
08/20/2009US20090205782 Plasma processing apparatus
08/20/2009US20090205707 Solar cell and method for producing the same
08/20/2009US20090205705 Method for Fabricating a Semiconductor Component With a Specifically Doped Surface Region Using Out-Diffusion, and Corresponding Semiconductor Component
08/20/2009US20090205677 Method and apparatus for wafer cleaning
08/20/2009US20090205567 Method of manufacturing semiconductor device and apparatus for processing substrate
08/20/2009DE112007002360T5 Niveausensor mit redundanten Beschleunigungsmessern Level sensor with redundant accelerometers
08/20/2009DE10335814B4 Gerät mit einem Überführungsroboter zur Herstellung einer integrierten Schaltungsvorrichtung und Verwendung des Gerätes Device with a transfer robot for the manufacture of an integrated circuit device and using the device
08/20/2009DE10235793B4 Verfahren zur Herstellung einer Halbleitervorrichtung (MOS-Transistor) A process for producing a semiconductor device (MOS transistor)
08/20/2009DE102009006237A1 Waferverarbeitungsverfahren zum Verarbeiten von Wafern mit darauf ausgebildeten Bondhügeln Wafer processing method of processing wafers having formed thereon bumps
08/20/2009DE102008063332A1 Verfahren zum Verringern einer Unebenheit einer Oberfläche und Verfahren zum Herstellen eines Halbleiterbauelements A method of reducing an unevenness of a surface, and method of manufacturing a semiconductor device
08/20/2009DE102007030812B4 Metallische Leitung in Halbleitervorrichtung und Verfahren zum Bilden derselben Metallic lead in the semiconductor device and method of forming same
08/20/2009DE102007017630B4 Verfahren zum Steigern der Messgenauigkeit beim Bestimmen der Koordinaten von Strukturen auf einem Substrat A method for enhancing the measurement accuracy in determining the coordinate of structures on a substrate
08/20/2009DE102006053895B4 Wafer und Waferschneid- und Teilungsverfahren Wafer and Waferschneid- and dividing method
08/20/2009DE102006048752B4 Verfahren zum Herstellen von Vorrichtungen, Dicingverfahren und Dicingvorrichtung A method for fabricating devices, and dicing Dicingvorrichtung
08/20/2009DE102005008491B4 Leistungs-Halbleitervorrichtung und Verfahren zu ihrer Herstellung Power semiconductor device and process for their preparation
08/20/2009DE102004042169B4 Technik zur Erhöhung des Füllvermögens in einem elektrochemischen Abscheideprozess durch Verrundung der Kanten und Gräben Technique for increasing the filling capacity in an electrochemical deposition process by rounding of the edges and grooves
08/20/2009DE102004042168B4 Halbleiterelement mit einem Metallisierungsschichtstapel mit kleinem ε mit erhöhter Widerstandsfähigkeit gegen Elektromigration und Verfahren zum Bilden des Halbleiterelements Semiconductor element having a metallization layer with a small ε with increased resistance to electromigration and method for forming the semiconductor element
08/20/2009DE10026319B4 Verfahren zum Herstellen einkristalliner Körper A method for producing monocrystalline body
08/20/2009CA2715344A1 Semiconductor element module and method for manufacturing the same
08/19/2009EP2091116A2 Method for manufacturing a semiconductor laser and semiconductor laser
08/19/2009EP2091083A2 Silicon carbide semiconductor device including a deep layer
08/19/2009EP2091076A2 C implants for improved SiGe bipolar yield
08/19/2009EP2091075A2 A method for recycling a surface of a substrate using local thinning
08/19/2009EP2091074A1 Method for preparing hydrophobic surfaces
08/19/2009EP2091073A1 Laser dicing sheet and method for manufacturing chip body
08/19/2009EP2091072A1 Conductive film forming method, thin film transistor, panel with thin film transistor and thin film transistor manufacturing method
08/19/2009EP2091071A1 Process for bonding two substrates
08/19/2009EP2091070A1 Semiconductor substrate surface preparation method
08/19/2009EP2090929A2 Mold, pattern forming method, and pattern forming apparatus
08/19/2009EP2090680A1 Sapphire substrate, nitride semiconductor luminescent element using the sapphire substrate, and method for manufacturing the nitride semiconductor luminescent element
08/19/2009EP2090675A1 Defect etching of germanium
08/19/2009EP2090633A1 Dicing Die-Bonding Film
08/19/2009EP2090557A2 Yttrium oxide material, member for use in semiconductor manufacturing apparatus, and method for producing yttrium oxide material
08/19/2009EP2090401A1 Chemical mechanical polishing pad
08/19/2009EP2090400A1 Cmp polishing agent, additive solution for cmp polishing agent, and method for polishing substrate by using the polishing agent and the additive solution
08/19/2009EP2089908A2 Dual stress device and method
08/19/2009EP2089900A1 Fabrication of a diffusion barrier cap on copper containing conductive elements
08/19/2009EP2089899A1 Device for positioning and/or pressing a planar component relative to a substrate and method for positioning a picking tool relative to a substrate
08/19/2009EP2089898A1 Method of manufacturing a fet gate
08/19/2009EP2089897A2 Methods for creating a densified group iv semiconductor nanoparticle thin film
08/19/2009EP2089491A1 Printable medium for etching of oxidic, transparent and conducting layers
08/19/2009EP1997133B1 Method for producing an active or passive electronic component and electronic component
08/19/2009EP1904893A4 Substrate transport apparatus with automated alignment
08/19/2009EP1706891A4 Connection assembly for promoting electrical isolation
08/19/2009EP1676319B1 Module integration integrated circuits
08/19/2009EP1676299B8 Crystal growing unit
08/19/2009EP1652236A4 Eeprom with multi-member floating gate
08/19/2009EP1604389B1 Processing system and method for thermally treating a substrate