Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2009
08/27/2009DE102009007102A1 Elektrische Vorrichtung und Herstellungsverfahren Electric device and manufacturing method
08/27/2009DE102009006826A1 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
08/27/2009DE102009006340A1 System und Verfahren mit einem Prealigner System and method with a pre-aligner
08/27/2009DE102008062488A1 Halbleiterbauelement und Verfahren zur Herstellung des Bauelementes Semiconductor device and process for the preparation of the component
08/27/2009DE102008055819A1 Halbleiterbauelement mit Gates eines vertikalen und eines horizontalen Typs und Verfahren zu seiner Herstellung A semiconductor device with gates of a vertical and a horizontal type and process for its preparation
08/27/2009DE102008014927A1 Verfahren zur Herstellung einer Mehrzahl von strahlungsemittierenden Bauelementen und strahlungsemittierendes Bauelement A process for producing a plurality of radiation-emitting components, and radiation-emitting component
08/27/2009DE102008007002A1 Substratkontakt für moderne SOI-Bauelemente auf der Grundlage einer tiefen Grabenkondensatorkonfiguration Substrate contact for modern SOI devices based on a deep grave capacitor configuration
08/27/2009DE102008006962A1 Halbleiterbauelement mit einem Kondensator im Metallisierungssystem und ein Verfahren zur Herstellung des Kondensators A semiconductor device with a capacitor in metallization system and a method for manufacturing the capacitor
08/27/2009DE102008006961A1 Verfahren zum Erzeugen eines verformten Kanalgebiets in einem Transistor durch eine tiefe Implantation einer verformungsinduzierenden Sorte unter das Kanalgebiet A method for producing a strained channel region in a transistor by a deep implantation of a strain-cultivar under the channel region
08/27/2009DE102006046381B4 Verfahren zur Verringerung der "Lackvergiftung" während der Strukturierung verspannter stickstoffenthaltender Schichten in einem Halbleiterbauelement A method for reducing the "paint poisoning" during the patterning strained nitrogen-containing layers in a semiconductor device
08/27/2009DE102005023891B4 Verfahren zum Herstellen einer Siliziumkarbid-Halbleitervorrichtung und Siliziumkarbid-Halbleitervorrichtung A method of manufacturing a silicon carbide semiconductor device, and silicon carbide semiconductor device
08/27/2009DE102004059122B4 Elektrostatische Haltevorrichtung sowie zugehöriges Herstellungsverfahren An electrostatic chuck and associated production method
08/27/2009DE102004034360B4 Herstellungsverfahren für eine integrierte Schaltung mit einem Floating-Gate-Speicher und Hochvolttransistoren Manufacturing process for an integrated circuit having a floating gate memory and high-voltage transistors
08/27/2009DE102004002707B4 Testeinrichtung für Halbleitervorrichtungen Test device for semiconductor devices
08/27/2009DE10146825B4 Programmierbare Impedanzsteuerschaltung Programmable impedance control circuit
08/27/2009CA2684876A1 Semiconductor device and method for manufacturing semiconductor device
08/26/2009EP2093802A1 Insulating-gate fet and its manufacturing method
08/26/2009EP2093799A2 Integrated circuit with closely coupled high-voltage output and offline transistor pair
08/26/2009EP2093796A1 Semiconductor device and method for fabricating the same
08/26/2009EP2093795A1 Suspended platform for overhead traveling carriage
08/26/2009EP2093794A2 Conductive ball mounting apparatus and conductive ball mounting method
08/26/2009EP2093793A2 Manufacturing method of semiconductor device
08/26/2009EP2093792A1 Method for power semiconductor module fabricaton, its apparatus, power semiconductor module and its junction method
08/26/2009EP2093791A2 Chip scale package with flip chip interconnect
08/26/2009EP2093790A2 Low-Stain Polishing Composition
08/26/2009EP2093789A2 Polishing copper-containing patterned wafers
08/26/2009EP2093611A2 Particle inspection apparatus, exposure apparatus, and device manufacturing method
08/26/2009EP2092568A2 Semiconductor device and method for production thereof
08/26/2009EP2092559A1 Dual liner capping layer interconnect structure
08/26/2009EP2092558A2 Symmetric blocking transient voltage suppressor (tvs) using bipolar transistor base snatch
08/26/2009EP2092557A1 Method and arrangement for heat treatment of substrates
08/26/2009EP2092556A1 Removable compartments for workpiece stocker
08/26/2009EP2092555A1 Workpiece stocker with circular configuration
08/26/2009EP2092554A1 Conveyer system
08/26/2009EP2092553A1 Process for coating a bumped semiconductor wafer
08/26/2009EP2092287A1 Apparatus for passivating a component, and method for producing the apparatus
08/26/2009EP2092035A2 Compositions and methods for cmp of low-k dielectric materials
08/26/2009EP2092034A1 Chemical mechanical polishing slurry compositions, methods of preparing the same and methods of using the same
08/26/2009EP2092031A1 Planarization composition for metal surfaces comprising an alumina hydrate abrasive
08/26/2009EP2091708A1 Device for separating a stacked structure and related method
08/26/2009EP1994134B1 Stabilized, non-aqueous cleaning compositions for microelectronics substrates
08/26/2009EP1831922B1 Method for obtaining a thin layer having a low density of holes
08/26/2009EP1773730A4 Method and apparatus for pretreatment of polymeric materials
08/26/2009EP1697975B1 Method of sealing two plates with the formation of an ohmic contact therebetween
08/26/2009EP1685581A4 Well formation
08/26/2009EP1669389B1 Crosslinkable fluoroaromatic prepolymer and use thereof
08/26/2009EP1661177B1 Method for integrating metals having different work functions to form cmos gates having a high-k gate dielectric and related structure
08/26/2009EP1651948B1 Scanning probe inspection apparatus
08/26/2009EP1563555A4 Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites
08/26/2009EP1547139A4 Large-area nanoenabled macroelectronic substrates and uses therefor
08/26/2009EP1428246A4 Wafer level underfill and interconnect process
08/26/2009EP1390984B1 Floating gate memory device using composite molecular material
08/26/2009EP1383176B1 Group iii nitride compound semiconductor light-emitting device and method of producing the same
08/26/2009EP1311190B1 Medical device for applying electrical pulses to muscle-tissue
08/26/2009EP1303876B1 Method of forming copper interconnect capping layers with improved interface and adhesion
08/26/2009EP1282902B1 Magnetic multilayer structure with improved magnetic field range
08/26/2009EP1252660B1 Bipolar transistor
08/26/2009EP1115156B1 Method of manufacturing a ferroelectric memory device
08/26/2009EP0824604B1 Apparatus for reducing arcing during sputtering
08/26/2009CN201298562Y Chain type diffusion equipment automatic piece feeding mechanism
08/26/2009CN201298548Y Fixing device of stack structure of semiconductor packaging body
08/26/2009CN201298547Y Combined type strip conveying device
08/26/2009CN201298546Y Stack type feed box feeding device
08/26/2009CN201298545Y Combined type feeding device of IC strip laser marking machine
08/26/2009CN201298544Y Wafer transportation box
08/26/2009CN201298543Y Fixing mould of lapping and packaging piece
08/26/2009CN201298542Y Wire-solder worktable of press welder
08/26/2009CN201298541Y Connection fixing seat and corresponding lead bonding equipment
08/26/2009CN201298540Y Lead wire heating device
08/26/2009CN201298539Y Clearance adjusting apparatus
08/26/2009CN201298538Y UV processing device for wafers or substrates
08/26/2009CN201298046Y A temporary encapsulation carrier for a bare chip
08/26/2009CN101517831A Anisotropic conductive adhesive composition, anisotropic conductive film, circuit member connecting structure and method for manufacturing coated particles
08/26/2009CN101517768A Magnetoresistive element manufacturing method, and multi-chamber apparatus for manufacturing the magnetoresistive element
08/26/2009CN101517759A Method for manufacturing group iii nitride compound semiconductor light-emitting device, group iii nitride compound semiconductor light-emitting device, and lamp
08/26/2009CN101517747A Solar cell module
08/26/2009CN101517744A Symmetric bipolar junction transistor design for deep sub-micron fabrication processes
08/26/2009CN101517742A Field-effect heterostructure transistors
08/26/2009CN101517737A Flip-chip interconnection through chip vias
08/26/2009CN101517734A Elastic contact and method for bonding between metal terminals using the same
08/26/2009CN101517732A Semiconductor device and method for manufacturing same
08/26/2009CN101517731A Method for forming a strained transistor by stress memorization based on a stressed implantation mask
08/26/2009CN101517730A Silicide formation on a wafer
08/26/2009CN101517729A Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane
08/26/2009CN101517728A Electronic device and method for making the same
08/26/2009CN101517727A Symmetric blocking transient voltage suppressor (TVS) using bipolar transistor base snatch
08/26/2009CN101517726A Substrate holding apparatus
08/26/2009CN101517725A Workpiece handling scan arm for ion implantation system
08/26/2009CN101517724A Adhesive sheet sticking device and sticking method
08/26/2009CN101517723A Method of controlling the trajectory of a bonding tool during the formation of a wire loop
08/26/2009CN101517722A Method and device for wetting the bumps of a semiconductor chip with soldering flux
08/26/2009CN101517721A Resin sealing device
08/26/2009CN101517720A Process for producing semiconductor device
08/26/2009CN101517719A Method of manufacturing an integrated circuit
08/26/2009CN101517718A Plastic packaged device with die interface layer
08/26/2009CN101517717A Active regions with compatible dielectric layers
08/26/2009CN101517716A Method for forming silicon oxide film, plasma processing apparatus and storage medium
08/26/2009CN101517715A Method for manufacturing semiconductor epitaxial crystal substrate
08/26/2009CN101517714A SONOS ONO stack scaling
08/26/2009CN101517713A Plasma cleaning process and plasma CVD method
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