Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2009
08/26/2009CN100533786C Flexible dye sensitized solar energy cell photoanode preparation method and apparatus
08/26/2009CN100533782C Image sensor pixel having photodiode with multi-dopant implantation
08/26/2009CN100533780C A damascene copper wiring image sensor
08/26/2009CN100533776C Photoelectric conversion device
08/26/2009CN100533773C Uv-blocking layer for reducing uv-induced charging of silicon-oxide-nitride-oxide-silicon dual-bit flash memory devices in beol processing
08/26/2009CN100533772C Floating gate memory cells with increased coupling ratio
08/26/2009CN100533771C Semiconductor device
08/26/2009CN100533769C Semiconductor device and method of manufacturing the same
08/26/2009CN100533768C A silicon base bar single electronic transistor manufacture method
08/26/2009CN100533767C Super trench mosfet including buried source electrode and method of fabricating the same
08/26/2009CN100533766C Semiconductor device based on Si-Ge with high stress liner for enhanced channel carrier mobility
08/26/2009CN100533765C Semiconductor device and method of manufacturing same
08/26/2009CN100533762C Non-self aligning raising externally basilar space germanium-siliconhetero-junction transistor and technique of preparing the same
08/26/2009CN100533761C A ballasting resistor structure of microwave power transistor dynamic emitter electrode
08/26/2009CN100533760C Semiconductor device with a superparaelectric gate insulator and its manufacture method
08/26/2009CN100533759C Method for forming heterojunction bipolar transistor and related structure
08/26/2009CN100533758C Planar substrate devices integrated with finFETs and method of manufacture
08/26/2009CN100533757C Flat panel display device and fabrication apparatus thereof and fabrication method thereof
08/26/2009CN100533756C Phase change memory fabricated using self-aligned processing and its manufacture method
08/26/2009CN100533753C Method and apparatus for reducing optical crosstalk in CMOS image sensors
08/26/2009CN100533750C Thin film solar module and method of fabricating the same
08/26/2009CN100533747C Pixel structure and method for repairing thereof
08/26/2009CN100533746C Display device, manufacturing method thereof, and television set
08/26/2009CN100533745C Nonvolatile semiconductor memory elememnt and manufacturing method thereof
08/26/2009CN100533743C Nonvolatile memory devices and methods of fabricating the same
08/26/2009CN100533740C Integrated circuit comprising non-volatile memory
08/26/2009CN100533739C Semiconductor component and method for manufacturing the same
08/26/2009CN100533738C Semiconductor structure forming method
08/26/2009CN100533736C Semiconductor device and fabricating method thereof
08/26/2009CN100533731C 半导体器件 Semiconductor devices
08/26/2009CN100533727C Module for optical device and manufacturing method thereof
08/26/2009CN100533725C Metal interconnection forming method of semiconductor device
08/26/2009CN100533722C 半导体器件 Semiconductor devices
08/26/2009CN100533721C Chip packaging structure and method of producing the same
08/26/2009CN100533720C Semiconductor device, mounting structure, electro-optical device and electronic member manufacture method
08/26/2009CN100533719C Semiconductor structure and forming method thereof
08/26/2009CN100533717C Lead pin, circuit, semiconductor device, and method of forming lead pin
08/26/2009CN100533712C Optoelectronic device chip and method for making same
08/26/2009CN100533711C Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device
08/26/2009CN100533710C Method of manufacturing a thin film transistor substrate and stripping composition
08/26/2009CN100533709C Dual silicide process to improve device performance
08/26/2009CN100533708C Method of forming an electrical contact in a semiconductor device using an improved self-aligned contact (SAC) process
08/26/2009CN100533707C Method of forming metal wiring of semiconductor device
08/26/2009CN100533706C SOI substrate materials and method to form Si-containing SOI and underlying substrate with different orientations
08/26/2009CN100533705C Method for fabricating semiconductor integrated circuit device
08/26/2009CN100533704C Substrate processing apparatus and substrate housing method
08/26/2009CN100533703C Technique for evaluating a fabrication of a semiconductor component and wafer
08/26/2009CN100533702C Temperature monitoring system of testing classifying machine
08/26/2009CN100533701C Method of flip chip mounting using conductive grain
08/26/2009CN100533700C Apparatus and method for mounting electronic component
08/26/2009CN100533699C Method and device for forming welding spot
08/26/2009CN100533698C Method for making embedded resistor in semiconductor wafer
08/26/2009CN100533697C Positioning method for semiconductor chip suspending arm encapsulation
08/26/2009CN100533696C Method for manufacturing semiconductor element
08/26/2009CN100533695C Encapsulation method and structure for OLED device
08/26/2009CN100533694C Intermetallic spring structure
08/26/2009CN100533693C A method for fabrication of deep junction silicon-on-insulator transistors
08/26/2009CN100533692C Method for manufacturing insulated-gate type field effect transistor
08/26/2009CN100533691C Method for forming thermal stabilization metallic silicide
08/26/2009CN100533690C Method and apparatus for mobility enhancement in a semiconductor device
08/26/2009CN100533689C Manufacture method of Schottky diode
08/26/2009CN100533688C Manufacturing method for shallow junction diode chip
08/26/2009CN100533687C Process for reducing scratches of chemical mechanical polishing of tungsten
08/26/2009CN100533686C Plating method
08/26/2009CN100533685C Method of producing an epitaxial layer on a semiconductor substrate and device produced with such a method
08/26/2009CN100533684C Plasma film forming method and apparatus therefor
08/26/2009CN100533683C Removing method for silicone oxide film
08/26/2009CN100533682C Method for forming silicon oxide film and method for manufacturing capacitor and semiconductor device
08/26/2009CN100533681C Advanced low dielectric constant organosilicon plasma chemical vapor deposition films
08/26/2009CN100533680C Bipolar transistor and method of fabricating the same
08/26/2009CN100533679C Method for making a semiconductor structure using silicon germanium
08/26/2009CN100533678C Method for reducing ICP etching SiC surface damage
08/26/2009CN100533677C A method of fault detection in manufacturing equipment
08/26/2009CN100533676C Method for the removal of airborne molecular contaminants using oxygen and/or water gas mixtures
08/26/2009CN100533675C Baffle and wafer grinding appts.
08/26/2009CN100533674C Method and abrasive slurry for chemical mechanical polishing, and semiconductor device and its manufacture method
08/26/2009CN100533673C Method for cleaning plasma processing device
08/26/2009CN100533672C A method of improving surface planarity prior to MRAM bit material deposition
08/26/2009CN100533671C Contact hole forming method
08/26/2009CN100533670C Method of forming cobalt silicide film and method of manufacturing semiconductor device having cobalt silicide film
08/26/2009CN100533669C Semiconductor chip local electronic radiation method and device
08/26/2009CN100533668C Ion injection method of semiconductor device
08/26/2009CN100533667C Preparation method for GaMnN dilution magnetic semiconductor film material and use thereof
08/26/2009CN100533666C Preparation of gallium nitride based epitaxial film
08/26/2009CN100533665C Preparation of InN/germanium or InN/silicon thin film with InN material as substrate or cushion breaker and preparation method
08/26/2009CN100533664C Film transistor and its manufacture method, active matrix device and its manufacture method
08/26/2009CN100533663C Lithographic methods to reduce stacking fault nucleation sites and structures having reduced stacking fault nucleation sites
08/26/2009CN100533662C Exposure apparatus and device producing method
08/26/2009CN100533661C Determination method of exposure conditions, exposure method, exposure device and components manufacturing method
08/26/2009CN100533660C Bonded wafer manufacturing method and apparatus for grinding outer circumference of bonded wafer
08/26/2009CN100533659C Vaccuum processing apparatus
08/26/2009CN100533658C Plasma apparatus with device for reducing polymer deposition on a substrate and method for reducing polymer deposition
08/26/2009CN100533657C Alarming device
08/26/2009CN100533656C Film formation apparatus and method of using the same
08/26/2009CN100533651C Plasma apparatus and method for processing a substrate
08/26/2009CN100533595C Memory device
08/26/2009CN100533590C Ferroelectric memory
08/26/2009CN100533276C Mask protection film removing device and its method
08/26/2009CN100533274C Exposure device
08/26/2009CN100533273C Lithographic apparatus and device manufacturing method
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