| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/10/2009 | US20090223564 Solar cell and method for making same |
| 09/10/2009 | US20090223561 Method of etching asymmetric wafer, solar cell including the asymmetrically etched wafer, and method of manufacturing the same |
| 09/10/2009 | US20090223559 Laminate For Dye-Sensitized Solar Cell, Electrode For Dye-Sensitized Solar Cell and Method For Producing It |
| 09/10/2009 | US20090223548 Thermionic/Thermotunneling Thermo-Electrical Converter |
| 09/10/2009 | US20090223538 Method for Cleaning a Workpiece With the Aid of Halogen Ions |
| 09/10/2009 | US20090223136 Polishing compound for semiconductor wafer polishing and polishing method |
| 09/10/2009 | DE4447977B4 Vorrichtung und Verfahren zur Plasmabehandlung von flachen Werkstücken, insbesondere flachen, aktiven Bildschirmen, sowie Verwendung der Vorrichtung Apparatus and method for plasma treatment of flat workpieces, in particular flat active screens, as well as using the apparatus |
| 09/10/2009 | DE4428992B4 CVD-Beschichtungsvorrichtung und deren Verwendung CVD coating apparatus and the use thereof |
| 09/10/2009 | DE19905568B4 Polymergemisch für ein Photoresist und dieses Gemisch enthaltende Photoresistzusammensetzung Polymer mixture containing a photoresist and this mixture photoresist composition |
| 09/10/2009 | DE19734879B4 Verfahren zum Ätzen eines Siliciumwafers, Ätzvorrichtung und Ätzmittel A method of etching a silicon wafer, etching and the etchant |
| 09/10/2009 | DE19724245B4 Flüssigkristallanzeige und Herstellungsverfahren dafür Liquid crystal display and manufacturing method thereof |
| 09/10/2009 | DE112008000047T5 Veraschungsvorrichtung Ashing device |
| 09/10/2009 | DE112007002587T5 Systeme und Verfahren zum Passivieren von Umverteilungsverbindungen auf dem Chip Systems and methods for passivating redistribution connections on the chip |
| 09/10/2009 | DE112007002539T5 ZnO-Schicht und lichtemittierende Halbleitervorrichtung ZnO layer and semiconductor light emitting device |
| 09/10/2009 | DE112007002488T5 Trench-Fet mit verbesserter Body/Gate-Ausrichtung Trench-FET with improved body / gate alignment |
| 09/10/2009 | DE112007002287T5 Verfahren und Einspannvorrichtung zum Halten eines Siliciumwafers A method and jig for holding a silicon wafer |
| 09/10/2009 | DE112006004099T5 Elektronisches Bauelement und Verfahren zu dessen Herstellung An electronic device and method for its production |
| 09/10/2009 | DE112006003439B4 Verfahren zur Herstellung eines n-Kanal-Transistors und n-Kanal-Transistor Process for the preparation of an n-channel transistor and n-channel transistor |
| 09/10/2009 | DE102009011371A1 Vorrichtung zum Ätzen eines Substrats sowie Verfahren zum Ätzen eines Substrats unter Verwendung derselben An apparatus for etching a substrate and to methods for etching a substrate using the same |
| 09/10/2009 | DE102009011304A1 Integriertes Schaltungsbauelement mit abstimmbaren Substratkondensatoren The integrated circuit device with tunable capacitors substrate |
| 09/10/2009 | DE102009010199A1 Systemträger mit Formschlossentlüftung Carrier system with shape lock vent |
| 09/10/2009 | DE102009000135A1 Halbleiterbauelement mit Schottkyzonen in einer Driftzone Semiconductor component with Schottkyzonen in a drift region |
| 09/10/2009 | DE102008050010A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof |
| 09/10/2009 | DE102008045260B3 Apparatus for galvanizing substrate, e.g. wafer or solar cell, has component with anode support, central space and electrolyte flow adjusting operating device to give even layer thickness |
| 09/10/2009 | DE102008033852B3 Power semiconductor module arrangement, has power semiconductor module with two fixing elements e.g. locking-centering-fasteners, formed such that fixing elements limit movement of substrate towards lower side of housing |
| 09/10/2009 | DE102008016437B3 Verfahren zur Einkapselung eines Gatestapels mit großem ε durch Bilden einer Beschichtung bei zwei unterschiedlichen Prozesstemperaturen Method of encapsulating a gate stack with large ε by forming a coating at two different process temperatures |
| 09/10/2009 | DE102008013559A1 Integrierte Schaltung, Speichermodul sowie Verfahren zum Herstellen einer integrierten Schaltung An integrated circuit memory module and method for manufacturing an integrated circuit |
| 09/10/2009 | DE102008012333A1 Vorrichtung zum thermischen Behandeln von scheibenförmigen Substraten An apparatus for the thermal treatment of disk-shaped substrates |
| 09/10/2009 | DE102008011932A1 Verfahren zur Erhöhung der Eindringtiefe von Drain- und Sourceimplantationssorten für eine gegebene Gatehöhe A method for increasing the penetration depth of the drain and source implantation species for a given gate height |
| 09/10/2009 | DE102008011931A1 Verringerung der Speicherinstabilität durch lokale Anpassung der Rekristallisierungsbedingungen in einem Cache-Bereich eines Halbleiterbauelements Reduction of the storage instability by local adjustment of the Rekristallisierungsbedingungen in a cache area of a semiconductor device |
| 09/10/2009 | DE102008011929A1 Verfahren zum Implantieren einer Ionensorte in einer Mikrostruktur durch gleichzeitiges Reinigen der Implantationsanlage A method of implanting an ion species in a microstructure by simultaneously cleaning the implanter |
| 09/10/2009 | DE102008011928A1 Ätzstoppschicht mit geringerer Dicke zum Strukturieren eines dielektrischen Materials in einer Kontaktebene dichtliegender Transistoren Etch stop layer with reduced thickness for patterning a dielectric material in a contact plane lying close transistors |
| 09/10/2009 | DE102008011926A1 Semiconductor device i.e. integrated circuit, manufacturing method for e.g. microprocessor, involves removing part of deformation inducing layer from above transistor under application of dielectric layer as etch-stopping material |
| 09/10/2009 | DE102008011814A1 CMOS-Bauelement mit einem NMOS-Transistor mit abgesenkten Drain- und Sourcebereichen und einem PMOS-Transistor mit einem Si/Ge-Material in den Drain- und Sourcebereichen CMOS device with an NMOS transistor having drain and source areas lowered and a PMOS transistor having a Si / Ge material in the drain and source regions |
| 09/10/2009 | DE102008011813A1 Halbleiterbauelement mit einem Metallgatestapel mit reduzierter Höhe und Verfahren zur Herstellung des Bauelements A semiconductor device having a metal gate stack with reduced height and method for manufacturing the component |
| 09/10/2009 | DE102008011757A1 Verfahren zur Aufrechterhaltung niedrigster Dotierlevel in der Halbleiterfertigung A method for maintaining lowest Dotierlevel in semiconductor manufacturing |
| 09/10/2009 | DE102008011531A1 Method for processing object e.g. quartz substrate with miniaturized molybdenum structure, involves integrating detected interaction products of electron beam to form total signal to detect whether to continue or terminate process |
| 09/10/2009 | DE102008011530A1 Method for processing object e.g. quartz substrate with miniaturized molybdenum structure, involves integrating detected interaction products of electron beam to form total signal to detect whether to continue or terminate process |
| 09/10/2009 | DE102008011444A1 Thermochrom beschichtete Substrate und Verfahren zu deren Herstellung Thermochromic coated substrates and processes for their preparation |
| 09/10/2009 | DE102008010854A1 Semiconductor device arrangement, has switchable element e.g. depletion MOSFET, provided between connection point and source of power transistor, and maintaining connection of connection point with source of transistor |
| 09/10/2009 | DE102008010323A1 Verfahren zur Herstellung einer elektronischen Vorrichtung, die einen bipolaren PNP-Transistor umfasst A method of manufacturing an electronic device comprising a bipolar PNP transistor |
| 09/10/2009 | DE102008004682A1 Integrated switching arrangement, has protection structure, whose one of semiconductor zones of conducting type is arranged in semiconductor substrate and attached at connecting zone in electrical conducting manner |
| 09/10/2009 | DE102008002794A1 Method for determining parameter by application of wafers, involves removing wafers from reservoir with arm of robot, and wafer is positioned at part in image field of camera and lies on arm of robot |
| 09/10/2009 | DE102008002780A1 Mask structure position determining method for use during semiconductor manufacturing, involves indicating structure on detector, and calculating position of structure from image of structure on detector |
| 09/10/2009 | DE102007051312B4 Verfahren zur Herstellung einer CMOS-Einrichtung mit Peltier-Element und Fotodiode A method of manufacturing a CMOS device with Peltier element and photodiode |
| 09/10/2009 | DE102007050483A1 Mischung aus einem thixotropen Dispersionsmedium sowie abrasiv wirkenden Körnern als Schleifmittel Mixture of a thixotropic dispersion medium and abrasive grains as an abrasive |
| 09/10/2009 | DE102007028920B4 Feldeffekttransistor mit einem in einer Siliziumnitridschicht gebildeten Hohlraum und Verfahren zur Herstellung desselben Field effect transistor of the same with a cavity formed in a silicon nitride layer and processes for preparing |
| 09/10/2009 | DE102007015500B4 Verfahren zum Erzeugen einer Zugverspannung bei einem Halbleiterbauelement durch wiederholtes Anwenden von "Verspannungsgedächtnisverfahren" und Halbleiterbauelement A method of generating a tensile stress in a semiconductor device by repeatedly applying "stress memorization process" and semiconductor component |
| 09/10/2009 | DE102005061304B4 Verfahren zum Herstellen einer Kontaktfleckelektrode und Verfahren zum Herstellen eines Flüssigkristalldisplays A method for manufacturing a pad electrode and method for manufacturing a liquid crystal display |
| 09/10/2009 | DE102005045080B4 Vorrichtung und Verfahren zum Temperieren eines Substrats Apparatus and method for controlling the temperature of a substrate |
| 09/10/2009 | DE102005010944B4 Verfahren zur Herstellung eines Trägerscheibenkontaktes in integrierten Schaltungen mit Hochspannungsbauelementen auf der Basis der SOI-Technologie und integrierte Schaltungen mit entsprechenden Grabenstrukturen Process for the preparation of a carrier disc contact in integrated circuits with high-voltage components on the basis of the SOI technology and integrated circuits with corresponding structures grave |
| 09/10/2009 | DE102005009073B4 Verfahren zur Nachbehandlung einer Halbleiterstruktur A process for the aftertreatment of a semiconductor structure |
| 09/10/2009 | DE102004060689B4 Verfahren zur Herstellung eines Flashspeicherbauelements A process for producing a flash memory device |
| 09/10/2009 | DE102004026010B4 IPS-Flüssigkristallanzeigevorrichtung und Herstellungsverfahren derselben IPS liquid crystal display device and production method thereof |
| 09/10/2009 | DE10064041B4 Verfahren zur Herstellung einer Kupferverdrahtung in einem Halbleiterbauelement A process for producing a copper wiring in a semiconductor device |
| 09/10/2009 | DE10030183B4 Schneidmaschine Cutting machine |
| 09/09/2009 | EP2099083A1 Thin film laminated body, thin film magnetic sensor using the thin film laminated body and method for manufacturing the thin film laminated body |
| 09/09/2009 | EP2099078A1 Method of manufacturing group iii nitride semiconductor light-emitting device, group iii nitride semiconductor light-emitting device, and lamp |
| 09/09/2009 | EP2099074A1 Thin film transistor, manufacturing method thereof and flat panel display including the same thin film transistor |
| 09/09/2009 | EP2099067A1 Process for adjusting the friction coefficient between surfaces of two solid objects |
| 09/09/2009 | EP2099066A1 Method for modulating shapes of substrates |
| 09/09/2009 | EP2099065A1 Semiconductor device |
| 09/09/2009 | EP2099064A1 Method for manufacturing a semiconductor device |
| 09/09/2009 | EP2099063A1 Film forming apparatus and method of forming film |
| 09/09/2009 | EP2099062A1 Film deposition apparatus and film deposition method |
| 09/09/2009 | EP2099061A2 Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing |
| 09/09/2009 | EP2099060A1 Method and device for manufacturing an assembly with at least two microelectronic chips |
| 09/09/2009 | EP2098490A1 Method for finishing surface of preliminary polished glass substrate |
| 09/09/2009 | EP2098351A1 Multicolor molded item, method of multicolor molding and substrate accommodation container |
| 09/09/2009 | EP2097924A2 Front-end processed wafer having through-chip connections |
| 09/09/2009 | EP2097923A1 Methods for producing smooth wafers |
| 09/09/2009 | EP2097790A2 Substrate processing apparatus and method |
| 09/09/2009 | EP2097349A2 Switches for shorting during mems etch release |
| 09/09/2009 | EP2097342A1 Transfer device for an overhead conveying system |
| 09/09/2009 | EP2097209A1 Laser machining |
| 09/09/2009 | EP2020029A4 Improved cmos diodes with dual gate conductors, and methods for forming the same |
| 09/09/2009 | EP1839340A4 Method for forming a one mask hyperabrupt junction varactor using a compensated cathode contact |
| 09/09/2009 | EP1833640B1 Substrate holding device and polishing apparatus |
| 09/09/2009 | EP1792346A4 High-mobility bulk silicon pfet |
| 09/09/2009 | EP1761951A4 Lead solder indicator and method |
| 09/09/2009 | EP1723667A4 Methods of forming doped and un-doped strained semiconductor and semiconductor films by gas-cluster ion irradiation |
| 09/09/2009 | EP1586113B1 Method for producing a defined doping region in a semiconductor material |
| 09/09/2009 | EP1533833B1 Vapor phase epitaxy device |
| 09/09/2009 | EP1502295B1 Method of making transistors |
| 09/09/2009 | EP1397528B8 Cvd reactor with exhaust ring made of graphite |
| 09/09/2009 | EP1366514B1 Method of bonding a semiconductor device to an electrically conductive plate |
| 09/09/2009 | EP1352429B1 Integrated circuit provided with overvoltage protection and method for manufacture thereof |
| 09/09/2009 | EP1232677B1 Flip chip package, circuit board thereof and packaging method thereof |
| 09/09/2009 | EP1194951B1 Method for making a thin film using pressurisation |
| 09/09/2009 | EP1145326B1 Cellular trench-gate field-effect transistors |
| 09/09/2009 | EP1123562B1 Layer processing |
| 09/09/2009 | EP1112674B1 Laminates for encapsulating oled devices |
| 09/09/2009 | EP1107306B1 Semiconductor package and manufacturing method thereof |
| 09/09/2009 | EP1103075B1 Method of making a thin-film opto-electronic device |
| 09/09/2009 | EP1062689B1 Solar cell arrangement and method of making a solar cell arrangement |
| 09/09/2009 | CN201307587Y An edge washing machine and a fixing device thereof |
| 09/09/2009 | CN201307586Y Wafer positioning carrier |
| 09/09/2009 | CN201307585Y Full automatic material combing conversion die |
| 09/09/2009 | CN201307584Y Fast transfer mold for diodes |
| 09/09/2009 | CN201307583Y Multiple-grain reversed-cover air-suction die |