Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2009
09/10/2009US20090227106 Method for fabricating semiconductor memory device
09/10/2009US20090227105 Methods of forming a layer for barrier applications in an interconnect structure
09/10/2009US20090227104 Film Deposition Method and Film Deposition Apparatus of Metal Film
09/10/2009US20090227103 Method and structure for copper gap fill plating of interconnect structures for semiconductor integrated circuits
09/10/2009US20090227102 Semiconductor device having trench-type gate and its manufacturing method capable of simplifying manufacturing steps
09/10/2009US20090227101 Method of forming wiring layer of semiconductor device
09/10/2009US20090227100 Method for fabricating semiconductor device
09/10/2009US20090227099 Method of forming a semiconductor device having a stressed electrode and silicide regions
09/10/2009US20090227098 Semiconductor device fabricating method
09/10/2009US20090227097 Use of dopants with different diffusivities for solar cell manufacture
09/10/2009US20090227096 Method Of Forming A Retrograde Material Profile Using Ion Implantation
09/10/2009US20090227095 Counterdoping for solar cells
09/10/2009US20090227094 Use of chained implants in solar cells
09/10/2009US20090227093 Patterning During Film Growth
09/10/2009US20090227091 Method of manufacturing a semiconductor device
09/10/2009US20090227090 Annealing method of zinc oxide thin film
09/10/2009US20090227089 Dicing tape and die attach adhesive with patterned backing
09/10/2009US20090227088 Semiconductor wafer and manufacturing process for semiconductor device
09/10/2009US20090227087 Method to improve uniformity of chemical mechanical polishing planarization
09/10/2009US20090227086 Threshold Voltage Consistency and Effective Width in Same-Substrate Device Groups
09/10/2009US20090227085 Manufacturing method of semiconductor device
09/10/2009US20090227084 Novel Method to Enhance Channel Stress in CMOS Processes
09/10/2009US20090227083 Field-effect transistor with local source/drain insulation and associated method of production
09/10/2009US20090227082 Methods of manufcturing a semiconductor device
09/10/2009US20090227081 SEMICONDUCTOR DEVICE DOPED WITH Sb, Ga, OR Bi AND METHOD OF MANUFACTURING THE SAME
09/10/2009US20090227080 Method of Fabricating Semiconductor Device
09/10/2009US20090227079 Semiconductor device and manufacturing method thereof
09/10/2009US20090227078 CMOS Devices having Dual High-Mobility Channels
09/10/2009US20090227077 Low-Capacitance Contact For Long Gate-Length Devices with Small Contacted Pitch
09/10/2009US20090227076 Thin film transistor, manufacturing method thereof, display device, and manufacturing method thereof
09/10/2009US20090227075 Etchant composition, patterning conductive layer and manufacturing flat panel, display device using the same
09/10/2009US20090227074 Method of manufacturing display device
09/10/2009US20090227073 Method for manufacturing semiconductor package having improved bump structures
09/10/2009US20090227072 Packaging Structure and Method
09/10/2009US20090227071 Semiconductor module
09/10/2009US20090227070 Semiconductor device and method of manufacturing the same
09/10/2009US20090227069 Method and device for fabricating an assembly of at least two microelectronic chips
09/10/2009US20090227068 Method and Apparatus for Packaging Circuit Devices
09/10/2009US20090227067 Methods for Forming Resistive Switching Memory Elements by Heating Deposited Layers
09/10/2009US20090227066 Method of forming ring electrode
09/10/2009US20090227064 X-y address type solid state image pickup device and method of producing the same
09/10/2009US20090227063 Integrated method and system for manufacturing monolithic panels of crystalline solar cells
09/10/2009US20090227060 Method for Fabricating a Sealed Cavity Microstructure
09/10/2009US20090227059 Chemical sensor
09/10/2009US20090227058 Photoresist composition and method of manufacturing array substrate using the same
09/10/2009US20090227057 Electronic component and display device and a method of manufacturing the same
09/10/2009US20090227056 Method of fabricating nitride semiconductor laser
09/10/2009US20090227055 Method of manufacturing semiconductor optical element
09/10/2009US20090227054 Pixel structure for flat panel display
09/10/2009US20090227053 Method of fabricating array substrate having double-layered patterns
09/10/2009US20090227052 Optical device
09/10/2009US20090227051 Thin film transistor, manufacturing method thereof, display device, and manufacturing method thereof
09/10/2009US20090227050 Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
09/10/2009US20090227049 Methods for discretized processing of regions of a substrate
09/10/2009US20090227048 Method for die bonding having pick-and-probing feature
09/10/2009US20090227047 Method and apparatus for thinning a substrate
09/10/2009US20090227046 Method of fabricating semiconductor device
09/10/2009US20090226847 Method of reducing photoresist defects during fabrication of a semiconductor device
09/10/2009US20090226826 Photomask blank, photomask, and photomask manufacturing method
09/10/2009US20090226825 Method for fabricating EUVL mask
09/10/2009US20090226737 Silicon substrate and manufacturing method of the same
09/10/2009US20090226736 Method of manufacturing silicon substrate
09/10/2009US20090226717 Method for forming copper indium gallium chalcogenide layer with shaped gallium profile
09/10/2009US20090226697 Polishing sheet and manufacturing method of elastic plastic foam sheet
09/10/2009US20090226695 Method for treating a dielectric film with infrared radiation
09/10/2009US20090226680 Process for modifying the properties of a thin layer and substrate applying said process
09/10/2009US20090226672 Dual-layer light-sensitive developer-soluble bottom anti-reflective coatings for 193-nm lithography
09/10/2009US20090226633 Reduced Maintenance Chemical Oxide Removal (COR) Processing System
09/10/2009US20090226294 Processing System and Method for Operating the Same
09/10/2009US20090226293 Method and Apparatus for Manufacturing Semiconductor Wafer
09/10/2009US20090226286 Wafer lift-out apparatus and semiconductor apparatus manufacturing method
09/10/2009US20090226283 Method For Separating Wafers From A Stack Of Wafers
09/10/2009US20090226076 Pattern inspection method and its apparatus
09/10/2009US20090225804 Semiconductor laser and method for manufacturing the same
09/10/2009US20090225592 Suspended structures
09/10/2009US20090225588 Memory Device
09/10/2009US20090225580 Integrated Circuit, Memory Module, and Method of Manufacturing an Integrated Circuit
09/10/2009US20090225477 Magnetoresistance effect element, magnetic head, magnetic reproducing apparatus, and magnetic memory
09/10/2009US20090225294 Reticle for projection exposure apparatus and exposure method using the same
09/10/2009US20090225286 Exposure apparatus, method for cleaning member thereof , maintenance method for exposure apparatus, maintenance device, and method for producing device
09/10/2009US20090225251 Liquid Crystal Display Device
09/10/2009US20090225249 Thin film transistor array substrate and manufacturing method thereof
09/10/2009US20090224823 Internal voltage generating circuit and semiconductor integrated circuit device
09/10/2009US20090224820 Molecular controlled semiconductor device
09/10/2009US20090224800 Pld architecture for flexible placement of ip function blocks
09/10/2009US20090224783 Membrane probing system with local contact scrub
09/10/2009US20090224739 Heavily doped region in double-diffused source mosfet (ldmos) transistor and a method of fabricating the same
09/10/2009US20090224422 Methods of fabricating a composite carbon nanotube thermal interface device
09/10/2009US20090224412 Non-planar substrate strip and semiconductor packaging method utilizing the substrate strip
09/10/2009US20090224411 Multi-Chips Module Package Structure and the Method thereof
09/10/2009US20090224410 Wafer translator having a silicon core fabricated with printed circuit board manufacturing techniques
09/10/2009US20090224405 Through via process
09/10/2009US20090224404 Method And System For Fabricating Semiconductor Components With Through Interconnects
09/10/2009US20090224403 Semiconductor device and method of manufacturing the same
09/10/2009US20090224402 Semiconductor Package Having Semiconductor Die with Internal Vertical Interconnect Structure and Method Therefor
09/10/2009US20090224401 Semiconductor device and manufacturing method thereof
09/10/2009US20090224400 Semiconductor assembly having reduced thermal spreading resistance and methods of making same
09/10/2009US20090224398 Semiconductor module and method of manufacturing the same
09/10/2009US20090224393 Semiconductor device and fabricating method thereof
09/10/2009US20090224392 Semiconductor package having side walls and method for manufacturing the same