| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/16/2009 | EP2101350A1 Method and wire bonder for producing a gold wire bond connection |
| 09/16/2009 | EP2101349A2 Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers and a method of making the same |
| 09/16/2009 | EP2101348A1 Method for removing moisture from substrate coated with transparent electrode |
| 09/16/2009 | EP2101347A1 Annealing method of zinc oxide thin film |
| 09/16/2009 | EP2101346A1 Method for forming wiring film, transistor, and electronic device |
| 09/16/2009 | EP2101345A1 Film deposition apparatus and film deposition method |
| 09/16/2009 | EP2101164A1 Method for repairing a sample intended for analysis by electron microscopy |
| 09/16/2009 | EP2100934A1 Pressure sensitive adhesive sheet for semiconductor substrate processing |
| 09/16/2009 | EP2100870A1 Compound and radiation-sensitive composition |
| 09/16/2009 | EP2100666A1 Method for purifying chemical added with chelating agent |
| 09/16/2009 | EP2100330A1 Complementary bipolar semiconductor device |
| 09/16/2009 | EP2100329A1 Media selection |
| 09/16/2009 | EP2100327A1 Electronic, in particular microelectronic, functional group and method for its production |
| 09/16/2009 | EP2100326A2 Etching amorphous semiconductor oxides with alkaline etchant solution |
| 09/16/2009 | EP2100325A1 Water-based polishing slurry for polishing silicon carbide single crystal substrate, and polishing method for the same |
| 09/16/2009 | EP2100324A1 Method of construction of cte matching structure with wafer processing and resulting structure |
| 09/16/2009 | EP2100323A2 Plastic electronic component package |
| 09/16/2009 | EP2100319A1 Formation of vertical devices by electroplating |
| 09/16/2009 | EP2099877A1 Etching paste containing particles for silicon surfaces and layers |
| 09/16/2009 | EP2099580A1 Soldering filler metal, assembly method for semiconductor device using same, and semiconductor device |
| 09/16/2009 | EP1644984B1 Semiconductor device including superlattice |
| 09/16/2009 | EP1634333B1 STACKED 1T-n MEMORY CELL STRUCTURE |
| 09/16/2009 | EP1292990B1 Trench mosfet with double-diffused body profile |
| 09/16/2009 | EP1273039B1 Process for semiconductor wafer-level chip scale packages |
| 09/16/2009 | EP1186006B1 Method and system for cleaning a semiconductor wafer |
| 09/16/2009 | EP0950257B1 Method for making a thin film on a support |
| 09/16/2009 | EP0917189B1 Method for mounting encapsulated body on mounting board and optical converter |
| 09/16/2009 | EP0835336B2 A device and a method for epitaxially growing objects by cvd |
| 09/16/2009 | EP0807964B1 Device for treating planar elements with a plasma jet |
| 09/16/2009 | CN201311928Y Suction head device for thimble of die bonder |
| 09/16/2009 | CN201311927Y Combination and assembly mechanism for tube core automatic welding machine |
| 09/16/2009 | CN201311926Y Copper feet assembly mechanism for tube core automatic welding machine |
| 09/16/2009 | CN201311925Y Pole plate propelling, positioning and lifting mechanism |
| 09/16/2009 | CN201311924Y Calibrating device for base plate dimension positioning mechanism |
| 09/16/2009 | CN201311923Y Temporary stocking device of silicon wafers |
| 09/16/2009 | CN201311922Y Multistation pipe core assembling mechanism |
| 09/16/2009 | CN201311921Y Wafer carrying device |
| 09/16/2009 | CN201311920Y Wafer surface oxide film removing device |
| 09/16/2009 | CN101536178A 内容可寻址存储器 Content Addressable Memory |
| 09/16/2009 | CN101536177A Semiconductor wafer suitable for forming a semiconductor junction diode device and method of forming same |
| 09/16/2009 | CN101536176A A transistor having a locally provided metal silicide region in contact areas and a method of forming the transistor |
| 09/16/2009 | CN101536175A A semiconductor device comprising isolation trenches inducing different types of strain |
| 09/16/2009 | CN101536174A Substrate container |
| 09/16/2009 | CN101536173A Systems and methods to passivate on-die redistribution interconnects |
| 09/16/2009 | CN101536172A Liquid resin composition, semiconductor wafer with adhesive layer, semiconductor element with adhesive layer, semiconductor package, method for manufacturing semiconductor element, and method for manu |
| 09/16/2009 | CN101536171A Chemical mechanical polishing of moisture sensitive surfaces and compositions therefor |
| 09/16/2009 | CN101536170A Interconnect structure having enhanced electromigration reliability and a method of fabricating same |
| 09/16/2009 | CN101536169A Method and structure for thick layer transfer using a linear accelerator |
| 09/16/2009 | CN101536168A Micropipe-free silicon carbide and related method of manufacture |
| 09/16/2009 | CN101536167A Sb-based CMOS devices |
| 09/16/2009 | CN101536166A Methods of forming field effect transistors, pluralities of field effect transistors, and dram circuitry comprising a plurality of individual memory cells |
| 09/16/2009 | CN101536165A Trench gate FET with self-aligned features |
| 09/16/2009 | CN101536164A Power MOSFET with recessed field plate |
| 09/16/2009 | CN101536163A Charge balance field effect transistor |
| 09/16/2009 | CN101536162A Method for manufacturing silicon carbide semiconductor device |
| 09/16/2009 | CN101536161A Temperature controlled multi-gas distribution assembly |
| 09/16/2009 | CN101536160A Methods of etching a pattern layer to form staggered heights therein and intermediate semiconductor device structures |
| 09/16/2009 | CN101536159A Methods for performing actual flow verification |
| 09/16/2009 | CN101536158A Method for cleaning a substrate |
| 09/16/2009 | CN101536157A Method for producing silicon carbide substrate and silicon carbide substrate |
| 09/16/2009 | CN101536156A System and method for providing a nanoscale, highly selective, and thermally resilient silicon, germanium, or silicon-germanium etch-stop |
| 09/16/2009 | CN101536155A Plasma dielectric etch process including in-situ backside polymer removal for low-dielectric constant material |
| 09/16/2009 | CN101536154A Barrier film forming method |
| 09/16/2009 | CN101536153A Method of manufacturing a FET gate |
| 09/16/2009 | CN101536152A Ohmic electrode for SIC semiconductor, method for manufacture of ohmic electrode for SIC semiconductor, semiconductor device, and method for manufacture of semiconductor device |
| 09/16/2009 | CN101536151A 衬底处理方法和衬底处理系统 The substrate processing method and substrate processing system |
| 09/16/2009 | CN101536150A Server device, information processing method, and program |
| 09/16/2009 | CN101536149A Technique for low-temperature ion implantation |
| 09/16/2009 | CN101536148A Apparatus and methods for managing the temperature of a substrate in a high vacuum processing system |
| 09/16/2009 | CN101536147A Arrangement for tool equipment |
| 09/16/2009 | CN101533972A Press-fit-connection |
| 09/16/2009 | CN101533886A A luminous module encapsulation method |
| 09/16/2009 | CN101533880A Light emitting diode (LED) encapsulation module |
| 09/16/2009 | CN101533876A Method for passivating amorphous InGaAs thin-film material |
| 09/16/2009 | CN101533860A Semiconductor device and method for manufacturing the same |
| 09/16/2009 | CN101533858A Film transistor, manufacturing method thereof and image display device |
| 09/16/2009 | CN101533857A 薄膜晶体管和显示器 Thin film transistor and display |
| 09/16/2009 | CN101533855A Insulated gate semiconductor device and method for manufacturing the same |
| 09/16/2009 | CN101533852A Organic light-emitting display apparatus and method of manufacturing the same |
| 09/16/2009 | CN101533849A Resistive memory devices and method of forming the same |
| 09/16/2009 | CN101533846A Photoluminescent dosimeter element used for radiant metering and method for preparing same |
| 09/16/2009 | CN101533845A Photoelectric detector based on double control gate MOSFET structure |
| 09/16/2009 | CN101533844A Thin film transistor array substrate and maintenance method thereof |
| 09/16/2009 | CN101533841A Semiconductor device and manufacturing method thereof |
| 09/16/2009 | CN101533839A Inductance device and manufacturing method thereof |
| 09/16/2009 | CN101533836A Large-array CMOS image sensor and manufacturing method thereof |
| 09/16/2009 | CN101533834A Thin compact semiconductor die packages suitable for smart-power modules, methods of making the same, and systems using the same |
| 09/16/2009 | CN101533832A Integrated chips of Micro-electro-mechanism system device and integrated circuit, and integration method |
| 09/16/2009 | CN101533831A Solar energy collecting/storing module and manufacturing method thereof |
| 09/16/2009 | CN101533829A Semiconductor device, manufacturing method of semiconductor device, semiconductor manufacturing and inspecting apparatus, and inspecting apparatus |
| 09/16/2009 | CN101533828A Semiconductor device and method for fabricating the same |
| 09/16/2009 | CN101533826A Semiconductor device and production method thereof |
| 09/16/2009 | CN101533824A Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same |
| 09/16/2009 | CN101533823A Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same |
| 09/16/2009 | CN101533818A Encapsulation structure of integrated circuit element and method for manufacturing same |
| 09/16/2009 | CN101533815A Semiconductor device and method of manufacturing the same |
| 09/16/2009 | CN101533813A Contact bonding pad for reducing parasitic capacitance and manufacturing method thereof |
| 09/16/2009 | CN101533807A Frit sealing system and method of manufacturing organic light emitting display device |
| 09/16/2009 | CN101533805A Pixel structure and manufacturing method thereof |
| 09/16/2009 | CN101533804A A metal oxide semiconductor P-N junction schootky diode structure and the production method thereof |