| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/17/2009 | US20090233402 Wafer level ic assembly method |
| 09/17/2009 | US20090233401 Thin quad flat package with no leads (qfn) fabrication methods |
| 09/17/2009 | US20090233400 Rigid-flexible printed circuit board manufacturing method for package on package |
| 09/17/2009 | US20090233398 Methods for forming particles from single source precursors, methods of forming semiconductor devices, and devices formed using such methods |
| 09/17/2009 | US20090233397 Method and apparatus for forming the separating lines of a photovoltaic module with series-connected cells |
| 09/17/2009 | US20090233395 Package of MEMS device and method for fabricating the same |
| 09/17/2009 | US20090233394 Led with substrate modifications for enhanced light extraction and method of making same |
| 09/17/2009 | US20090233393 Liquid crystal display with wide viewing angle with overlapping coupling electrodes forming capacitor interconnecting sub-pixel electrodes |
| 09/17/2009 | US20090233392 Liquid crystal display device and fabrication method thereof |
| 09/17/2009 | US20090233391 Liquid crystal display device and method of fabricating the same |
| 09/17/2009 | US20090233390 Light emitting device and manufacturing method thereof |
| 09/17/2009 | US20090233389 Method for manufacturing thin film transistor and method for manufacturing display device |
| 09/17/2009 | US20090233388 Manufacturing method of electro line for liquid crystal display device |
| 09/17/2009 | US20090233386 Method for forming an ink jetting device |
| 09/17/2009 | US20090233385 Plasma Doping Method and Plasma Doping Apparatus |
| 09/17/2009 | US20090233384 Method for measuring dopant concentration during plasma ion implantation |
| 09/17/2009 | US20090233383 Plasma Doping Method and Apparatus |
| 09/17/2009 | US20090233382 High Polarization Ferroelectric Capacitors for Integrated Circuits |
| 09/17/2009 | US20090233381 Interconnect For a GMR Memory Cells And An Underlying Conductive Layer |
| 09/17/2009 | US20090233349 Metal Nanowires With An Oxide Sheath And Production Method For Same |
| 09/17/2009 | US20090233333 Methods for preventing gluconoylation of proteins |
| 09/17/2009 | US20090233239 Reticle for Use in a Semiconductor Lithographic System and Method for Modifying the Same |
| 09/17/2009 | US20090233193 Pattern prediction method, pattern correction method, method of fabricating semiconductor device, and recording medium |
| 09/17/2009 | US20090233189 Device and method for obtaining exposure correction information, and manufacturing method of semiconductor device |
| 09/17/2009 | US20090233188 Reflective mask blank, reflective mask, method of inspecting reflective mask, and method for manufacturing the same |
| 09/17/2009 | US20090233186 Scattering bar opc application method for sub-half wavelength lithography patterning field of the invention |
| 09/17/2009 | US20090233109 Method for Producing Bonded Wafer, Bonded Wafer, and Surface Grinding Machine |
| 09/17/2009 | US20090233079 Techniques for Layer Transfer Processing |
| 09/17/2009 | US20090232971 Self-encapsulated silver alloys for interconnects |
| 09/17/2009 | US20090232925 Cutting mold for rigid-flexible circuit board and method for forming the same |
| 09/17/2009 | US20090232631 Substrate holding apparatus, substrate transferring robot equipped with the same, and semiconductor production apparatus |
| 09/17/2009 | US20090232627 Device and method for positioning and blocking thin substrates on a cut substrate block |
| 09/17/2009 | US20090232336 Component Comprising a MEMS Microphone and Method for the Production of Said Component |
| 09/17/2009 | US20090232177 Method for Producing a Semiconductor Laser, and Semiconductor Laser |
| 09/17/2009 | US20090231943 Multi-Bank Memory Device Method and Apparatus |
| 09/17/2009 | US20090231921 Manufacturing method of nonvolatile semiconductor storage device and nonvolatile semiconductor storage device |
| 09/17/2009 | US20090231915 Reading array cell with matched reference cell |
| 09/17/2009 | US20090231911 Phase change memory cell with constriction structure |
| 09/17/2009 | US20090231910 Non-volatile memory with resistive access component |
| 09/17/2009 | US20090231899 Phase change random access memory and layout method of the same |
| 09/17/2009 | US20090231810 Direct dipping cooled power module and packaging |
| 09/17/2009 | US20090231766 Eletrostatic discharge (esd) device and method of fabricating |
| 09/17/2009 | US20090231584 Periodic patterns and technique to control misaligment between two layers |
| 09/17/2009 | US20090231558 Monitoring apparatus and method particularly useful in photolithographically processing substrates |
| 09/17/2009 | US20090231533 Semiconductor Device and Manufacturing Method Thereof |
| 09/17/2009 | US20090231477 Solid-state image pickup apparatus and method for manufacturing the same |
| 09/17/2009 | US20090231310 Gate driver-on-array and method of making the same |
| 09/17/2009 | US20090231304 Display panel and method of manufacturing the same |
| 09/17/2009 | US20090231034 Inverse mode SiGe HBT cascode device and fabrication method |
| 09/17/2009 | US20090230954 Ferromagnetic semiconductor, method for the production thereof, components incorporating the same, and corresponding uses of said semiconductor |
| 09/17/2009 | US20090230878 GaN-BASED SEMICONDUCTOR LIGHT-EMITTING ELEMENT, LIGHT-EMITTING ELEMENT ASSEMBLY, LIGHT-EMITTING APPARATUS, METHOD OF MANUFACTURING GaN-BASED SEMICONDUCTOR LIGHT-EMITTING ELEMENT, METHOD OF DRIVING GaN-BASED SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND IMAGE DISPLAY APPARATUS |
| 09/17/2009 | US20090230821 Ceramic and method of manufacturing the same, dielectric capacitor, semiconductor device, and element |
| 09/17/2009 | US20090230636 Electrostatic chuck |
| 09/17/2009 | US20090230569 Device comprising a semiconductor cmponent, and a manufacturing method |
| 09/17/2009 | US20090230567 Method of post-mold grinding a semiconductor package |
| 09/17/2009 | US20090230565 Semiconductor package and method for manufacturing the same |
| 09/17/2009 | US20090230564 Chip structure and stacked chip package as well as method for manufacturing chip structures |
| 09/17/2009 | US20090230561 Semiconductor device |
| 09/17/2009 | US20090230560 Semiconductor device and manufacturing method thereof |
| 09/17/2009 | US20090230558 Semiconductor device and method for manufacturing the same |
| 09/17/2009 | US20090230557 Semiconductor Device and Method for Making Same |
| 09/17/2009 | US20090230556 Nonvolatile semiconductor memory apparatus and manufacturing method thereof |
| 09/17/2009 | US20090230555 Tungsten liner for aluminum-based electromigration resistant interconnect structure |
| 09/17/2009 | US20090230554 Wafer-level redistribution packaging with die-containing openings |
| 09/17/2009 | US20090230553 Semiconductor device including adhesive covered element |
| 09/17/2009 | US20090230552 Bump-on-Lead Flip Chip Interconnection |
| 09/17/2009 | US20090230547 Design structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof |
| 09/17/2009 | US20090230544 Heat sink structure and semiconductor package as well as method for configuring heat sinks on a semiconductor package |
| 09/17/2009 | US20090230542 Semiconductor Device With Integrated Passive Circuit and Method of Making the Same Using Sacrificial Substrate |
| 09/17/2009 | US20090230541 Semiconductor device and manufacturing method of the same |
| 09/17/2009 | US20090230540 High performance multi-chip flip chip package |
| 09/17/2009 | US20090230538 Semiconductor chip package structure for achieving face-up electrical connection without using a wire-bonding process and method for making the same |
| 09/17/2009 | US20090230537 Semiconductor die package including embedded flip chip |
| 09/17/2009 | US20090230536 Semiconductor die package including multiple semiconductor dice |
| 09/17/2009 | US20090230535 Semiconductor module |
| 09/17/2009 | US20090230533 Manufacturing stacked semiconductor device |
| 09/17/2009 | US20090230532 System for solder ball inner stacking module connection |
| 09/17/2009 | US20090230531 Semiconductor Package with Penetrable Encapsulant Joining Semiconductor Die and Method Thereof |
| 09/17/2009 | US20090230530 Semiconductor device and method for producing semiconductor device |
| 09/17/2009 | US20090230529 Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof |
| 09/17/2009 | US20090230528 Support Mounted Electrically Interconnected Die Assembly |
| 09/17/2009 | US20090230527 Multi-chips package structure and the method thereof |
| 09/17/2009 | US20090230526 Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof |
| 09/17/2009 | US20090230525 Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof |
| 09/17/2009 | US20090230524 Semiconductor chip package having ground and power regions and manufacturing methods thereof |
| 09/17/2009 | US20090230523 Advanced quad flat no lead chip package having a cavity structure and manufacturing methods thereof |
| 09/17/2009 | US20090230522 Method for producing a semiconductor device and the semiconductor device |
| 09/17/2009 | US20090230519 Semiconductor Device |
| 09/17/2009 | US20090230518 Semiconductor die package including ic driver and bridge |
| 09/17/2009 | US20090230517 Integrated circuit package system with integration port |
| 09/17/2009 | US20090230515 Insulated gate semiconductor device and method for manufacturing the same |
| 09/17/2009 | US20090230514 Method of manufacturing nitride semiconductor device |
| 09/17/2009 | US20090230513 Compound semiconductor substrate and control for electrical property thereof |
| 09/17/2009 | US20090230511 Method for forming capacitor in a semiconductor device |
| 09/17/2009 | US20090230510 Semiconductor storage device and method of manufacturing the same |
| 09/17/2009 | US20090230508 Soi protection for buried plate implant and dt bottle etch |
| 09/17/2009 | US20090230507 MIM Capacitors in Semiconductor Components |
| 09/17/2009 | US20090230506 Semiconductor device and method for fabricating the same |
| 09/17/2009 | US20090230505 Self-aligned memory cells and method for forming |
| 09/17/2009 | US20090230504 HOT process STI in SRAM device and method of manufacturing |