| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/17/2009 | WO2009113373A1 Semiconductor device |
| 09/17/2009 | WO2009113372A1 Semiconductor device |
| 09/17/2009 | WO2009113357A1 Optical imprint method, mold duplicating method, and mold duplicate |
| 09/17/2009 | WO2009113317A1 Substrate holder, substrate holder unit, substrate transfer apparatus and substrate bonding apparatus |
| 09/17/2009 | WO2009113312A1 Semiconductor device design system, semiconductor device manufacturing method, semiconductor device, and substrate bonding device |
| 09/17/2009 | WO2009113296A1 Resin varnish for semiconductor element bonding film formation, semiconductor element bonding film, and semiconductor device |
| 09/17/2009 | WO2009113262A1 Semiconductor device and semiconductor device manufacturing method |
| 09/17/2009 | WO2009113241A1 Semiconductor device and method for manufacturing the same |
| 09/17/2009 | WO2009113236A1 Method and apparatus for cutting substrate |
| 09/17/2009 | WO2009113228A1 Monomer having lactone skeleton, polymer compound and photoresist composition |
| 09/17/2009 | WO2009113227A1 Semiconductor device and manufacturing method thereof |
| 09/17/2009 | WO2009113216A1 Pressure-sensitive adhesive tape for electronic component fabrication |
| 09/17/2009 | WO2009113213A1 Plasma processing apparatus |
| 09/17/2009 | WO2009113212A1 Plasma processing apparatus |
| 09/17/2009 | WO2009113169A1 Multi-column electron beam photolithography system |
| 09/17/2009 | WO2009112821A1 Semiconductor wafer monitoring apparatus and method |
| 09/17/2009 | WO2009112644A1 Assembly including a wire member and a microelectronic chip with a notch, including at least one stud for holding the wire member |
| 09/17/2009 | WO2009112456A1 Test structures for checking the positional precision in microelectronic circuits |
| 09/17/2009 | WO2009112306A1 Method for fabricating a semiconductor on insulator type substrate |
| 09/17/2009 | WO2009112272A1 Method for the production of a semiconductor-based circuit, and semiconductor-based circuit comprising a three-dimensional circuit topology |
| 09/17/2009 | WO2009112261A1 Method for manufacturing a silicon surface with pyramidal structure |
| 09/17/2009 | WO2009111890A1 A method of stabilizing thermal resistors |
| 09/17/2009 | WO2009111874A1 Low-temperature wafer level processing for mems devices |
| 09/17/2009 | WO2009111818A1 Method of adhering wire bond loops to reduce loop height |
| 09/17/2009 | WO2009111817A1 Electronic device with wire bonds secured to the adhesive surface |
| 09/17/2009 | WO2009094276A3 Vertical outgassing channels |
| 09/17/2009 | WO2009093992A3 Trench memory structures and operation |
| 09/17/2009 | WO2009091195A3 Plasma processing apparatus and method |
| 09/17/2009 | WO2009090349A3 Method for making an electrically conducting mechanical interconnection member |
| 09/17/2009 | WO2009088890A3 Memory cell with planarized carbon nanotube layer and methods of forming the same |
| 09/17/2009 | WO2009088888A3 Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element and methods of forming the same |
| 09/17/2009 | WO2009088588A3 Methods for fabricating pmos metal gate structures |
| 09/17/2009 | WO2009086109A3 Systems and methods for dynamic alignment beam calibration |
| 09/17/2009 | WO2009085520A3 Transistor having raised source/drain self-aligned contacts and method of forming same |
| 09/17/2009 | WO2009085240A3 Self-powered lithography method and apparatus using radioactive thin films |
| 09/17/2009 | WO2009085117A3 Erosion resistant yttrium comprising metal with oxidized coating for plasma chamber components |
| 09/17/2009 | WO2009079159A3 Systems and methods to increase uniaxial compressive stress in tri-gate transistors |
| 09/17/2009 | WO2009078923A3 Film adhesive for semiconductor vacuum processing apparatus |
| 09/17/2009 | WO2009078289A3 Cooling fin and manufacturing method of the cooling fin |
| 09/17/2009 | WO2009076657A3 Modular flow cell and adjustment system |
| 09/17/2009 | WO2009076346A3 Lift pin for substrate processing |
| 09/17/2009 | WO2009030494A3 Mounting device for disk-shaped substrates such as solar wafers |
| 09/17/2009 | WO2008129423A3 Conductive via formation |
| 09/17/2009 | WO2008120094A9 Electronic device with improved ohmic contact |
| 09/17/2009 | US20090233525 Method for Detecting Polishing End in CMP Polishing Device, CMP Polishing Device, and Semiconductor Device Manufacturing Method |
| 09/17/2009 | US20090233463 Integrated circuit test socket having elastic contact support and methods for use therewith |
| 09/17/2009 | US20090233456 Irradiation optical system, irradiation apparatus and fabrication method for semiconductor device |
| 09/17/2009 | US20090233455 Semiconductor devices having tensile and/or compressive stress and methods of manufacturing |
| 09/17/2009 | US20090233454 Film formation apparatus for semiconductor process and method for using same |
| 09/17/2009 | US20090233453 Methods for oxidation of a semiconductor device |
| 09/17/2009 | US20090233452 Producing method of semiconductor device and substrate processing apparatus |
| 09/17/2009 | US20090233451 Semiconductor device having a gate insulating film structure including an insulating film containing metal, silicon and oxygen and manufacturing method thereof |
| 09/17/2009 | US20090233450 Plasma etchimg method and plasma etching apparatus |
| 09/17/2009 | US20090233449 Etching chamber with subchamber |
| 09/17/2009 | US20090233448 Lithography resolution improving method |
| 09/17/2009 | US20090233447 Control wafer reclamation process |
| 09/17/2009 | US20090233446 Plasma etching method |
| 09/17/2009 | US20090233445 Method of making diamond nanopillars |
| 09/17/2009 | US20090233444 Polishing method with inert gas injection |
| 09/17/2009 | US20090233443 Substrate mounting table, substrate processing apparatus and temperature control method |
| 09/17/2009 | US20090233442 Method and apparatus for production of metal film or the like |
| 09/17/2009 | US20090233441 Interconnections for integrated circuits |
| 09/17/2009 | US20090233440 Seed Layers for Metallic Interconnects |
| 09/17/2009 | US20090233439 Method of forming an ohmic layer and method of forming a metal wiring of a semiconductor device using the same |
| 09/17/2009 | US20090233438 Self-ionized and inductively-coupled plasma for sputtering and resputtering |
| 09/17/2009 | US20090233437 Method of manufacturing semiconductor device and semiconductor device manufactured thereby |
| 09/17/2009 | US20090233436 Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP Coating |
| 09/17/2009 | US20090233435 Semiconductor devices and manufacturing method thereof |
| 09/17/2009 | US20090233434 Method of manufacturing semiconductor devices |
| 09/17/2009 | US20090233433 Semiconductor device having silicon layer in a gate electrode |
| 09/17/2009 | US20090233432 Methods for fabricating flash memory devices |
| 09/17/2009 | US20090233431 Semiconductor integrated circuit device and a method of manufacturing the same |
| 09/17/2009 | US20090233430 Semiconductor device manufacturing method, semiconductor device manufacturing apparatus, and semiconductor device manufacturing system |
| 09/17/2009 | US20090233429 Semiconductor device manufacturing method and substrate processing apparatus |
| 09/17/2009 | US20090233428 Methods for preparing a semiconductor wafer with high thermal conductivity |
| 09/17/2009 | US20090233427 Plasma doping method |
| 09/17/2009 | US20090233426 Method of forming a passivated densified nanoparticle thin film on a substrate |
| 09/17/2009 | US20090233425 Plasma processing apparatus and method for manufacturing semiconductor device |
| 09/17/2009 | US20090233424 Thin film metal oxynitride semiconductors |
| 09/17/2009 | US20090233423 Method of manufacturing nitride semiconductor substrate |
| 09/17/2009 | US20090233422 Switchable memory diode - a new memory device |
| 09/17/2009 | US20090233421 Methods of Fabricating Semiconductor Device Including Phase Change Layer |
| 09/17/2009 | US20090233420 P-type silicon wafer and method for heat-treating the same |
| 09/17/2009 | US20090233419 Optical device manufacturing method |
| 09/17/2009 | US20090233418 Methods of Processing Semiconductor Wafers Having Silicon Carbide Power Devices Thereon |
| 09/17/2009 | US20090233417 Method for manufacturing semiconductor device |
| 09/17/2009 | US20090233416 Flash memory devices comprising pillar patterns and methods of fabricating the same |
| 09/17/2009 | US20090233415 Semiconductor Devices with Sealed, Unlined Trenches and Methods of Forming Same |
| 09/17/2009 | US20090233414 Method for fabricating group III-nitride high electron mobility transistors (HEMTs) |
| 09/17/2009 | US20090233413 Method for fabricating semiconductor device |
| 09/17/2009 | US20090233412 Method for angular doping of source and drain regions for odd and even nand blocks |
| 09/17/2009 | US20090233411 Semiconductor device and method of manufacturing semiconductor device |
| 09/17/2009 | US20090233410 Self-Aligned Halo/Pocket Implantation for Reducing Leakage and Source/Drain Resistance in MOS Devices |
| 09/17/2009 | US20090233409 Method for production of semiconductor device |
| 09/17/2009 | US20090233408 Semiconductor device manufacturing method |
| 09/17/2009 | US20090233407 Method of fabricating a high-voltage transistor with an extended drain structure |
| 09/17/2009 | US20090233406 Method for fabricating semiconductor memory device |
| 09/17/2009 | US20090233405 Methods of forming nand-type nonvolatile memory devices |
| 09/17/2009 | US20090233404 Fabrication method of multi-domain vertical alignment pixel structure |
| 09/17/2009 | US20090233403 Dual flat non-leaded semiconductor package |