| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 09/16/2009 | CN101533803A Manufacturing method of nonvolatile semiconductor storage device and nonvolatile semiconductor storage device |
| 09/16/2009 | CN101533802A Complementary metal oxide semiconductor (CMOS) image sensor and manufacture method thereof |
| 09/16/2009 | CN101533801A Optical device manufacturing method |
| 09/16/2009 | CN101533800A A repairing method for transmission line |
| 09/16/2009 | CN101533799A Semiconductor device and method for manufacturing the same |
| 09/16/2009 | CN101533798A Electrostatic chuck |
| 09/16/2009 | CN101533797A Mounting base structure and heat processing apparatus |
| 09/16/2009 | CN101533796A Control system for silicone chip transmission and method |
| 09/16/2009 | CN101533795A Apparatus for conveying substrate |
| 09/16/2009 | CN101533794A Chip surface detecting system inside bearing tray, material inlet/outlet device of bearing tray and method thereof |
| 09/16/2009 | CN101533793A Component test apparatus and component transport method |
| 09/16/2009 | CN101533792A Wafer level ic assembly method |
| 09/16/2009 | CN101533791A Method for manufacturing luminescence module and luminescence module |
| 09/16/2009 | CN101533790A Frit sealing system |
| 09/16/2009 | CN101533789A Technology of preventing falling taint of mobile phone module |
| 09/16/2009 | CN101533788A Electrical element having transparent portion and a sealing method of the same and thermosetting resin composition for sealing |
| 09/16/2009 | CN101533787A Adhesion promotion |
| 09/16/2009 | CN101533786A Method for eliminating air bubble in chip adhesion rubber layer encapsulated by semiconductor |
| 09/16/2009 | CN101533785A Methods of forming a thin tim coreless high density bump-less package and structures formed thereby |
| 09/16/2009 | CN101533784A Light emitting diode encapsulating structure and production method thereof |
| 09/16/2009 | CN101533783A Thin quad flat no-lead package method |
| 09/16/2009 | CN101533782A Method for forming metal oxide semiconductor transistor |
| 09/16/2009 | CN101533781A Thin film transistor, manufacturing method thereof, display device, and manufacturing method thereof |
| 09/16/2009 | CN101533780A Method for manufacturing thin film transistor and method for manufacturing display device |
| 09/16/2009 | CN101533779A Manufacturing method for film transistor and image display device |
| 09/16/2009 | CN101533778A Method of forming a semiconductor |
| 09/16/2009 | CN101533777A Semiconductor device having a floating body transistor and method for manufacturing the same |
| 09/16/2009 | CN101533776A Method for fabricating semiconductor memory device |
| 09/16/2009 | CN101533775A Thin film transistor and production method thereof |
| 09/16/2009 | CN101533774A Method for enhancing mechanical strength of SiCOH film with low dielectric constant |
| 09/16/2009 | CN101533773A Method for overcoming defect of wafer polymer |
| 09/16/2009 | CN101533772A Technological method for etching tungsten gate |
| 09/16/2009 | CN101533771A A laser marking method on wafer surface |
| 09/16/2009 | CN101533770A MBE epitaxial method for positioning and growing low-intensity InAs quantum dot by strain engineering theory and pattern-underlay combining technology |
| 09/16/2009 | CN101533769A Method for manufacturing SOI substrate |
| 09/16/2009 | CN101533768A Epitaxial growth method for the active area of high-performance indium-arsenic or gallium-arsenic quantum dot materials |
| 09/16/2009 | CN101533767A Semiconductor device, metal-insulator-metal capacitor and method for manufacturing same |
| 09/16/2009 | CN101533766A High-voltage capacitor structure and manufacturing method thereof |
| 09/16/2009 | CN101533765A Vacuum processing system being able to carry process object into and out of vacuum chamber |
| 09/16/2009 | CN101533764A Shower head and substrate processing apparatus |
| 09/16/2009 | CN101533763A Method for manufacturing shower plate, shower plate manufactured, and plasma processing apparatus |
| 09/16/2009 | CN101533762A 闸阀和半导体制造装置 Gate and semiconductor manufacturing equipment |
| 09/16/2009 | CN101533761A Processing apparatus |
| 09/16/2009 | CN101533760A Cleaning equipment of semiconductor silicon chip and cleaning method thereof |
| 09/16/2009 | CN101533759A Device to coat metallic coating onto wafer |
| 09/16/2009 | CN101533482A Method and apparatus for using laser to join chip in groove of substrate |
| 09/16/2009 | CN101533427A Pattern matching processing system and computer readable medium |
| 09/16/2009 | CN101533426A Power supply noise analysis method, system and program for electronic circuit board |
| 09/16/2009 | CN101533425A Power supply noise analysis apparatus, method and program for electronic circuit board |
| 09/16/2009 | CN101533279A System to support testing of electronic devices, temperature control unit for the system, and method for controlling internal temperature of chamber of the system |
| 09/16/2009 | CN101533229A Reticle for projection exposure apparatus and exposure method using the same |
| 09/16/2009 | CN101533218A Method of lithography patterning |
| 09/16/2009 | CN101533216A Manufacturing method of a semiconductor device |
| 09/16/2009 | CN101533191A TFT-LCD array substrate structure and preparation method thereof |
| 09/16/2009 | CN101532179A Method for manufacturing silicon wafer on insulator |
| 09/16/2009 | CN101531950A Semi-aqueous stripping and cleaning composition containing aminobenzenesulfonic acid |
| 09/16/2009 | CN101531675A Chelating agent and preparation method and application thereof |
| 09/16/2009 | CN101531333A Sensor self-powered circuit based on MEMS, and manufacturing process thereof |
| 09/16/2009 | CN101531036A A pulley bracket and a fretsaw device making use of the pulley bracket |
| 09/16/2009 | CN101530988A Polishing pad |
| 09/16/2009 | CN101530983A Polishing state monitoring apparatus and polishing apparatus and method |
| 09/16/2009 | CN101530982A Grinding clamp for changing wafer orientation |
| 09/16/2009 | CN100542375C Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module |
| 09/16/2009 | CN100541817C Insulated gate power semiconductor devices and its manufacture method |
| 09/16/2009 | CN100541816C Semiconductor device and forming method thereof |
| 09/16/2009 | CN100541815C Semiconductor device and making method and substrate for making same |
| 09/16/2009 | CN100541801C Semiconductor integrated circuit with laminated node contacting structure and manufacture method |
| 09/16/2009 | CN100541797C Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication |
| 09/16/2009 | CN100541783C LSI package provided with interface module, and transmission line header employed in the package |
| 09/16/2009 | CN100541779C Semiconductor device and producing method thereof |
| 09/16/2009 | CN100541770C Elastic electroconductive resin and electronic device |
| 09/16/2009 | CN100541765C Semiconductor device and manufacturing method thereof |
| 09/16/2009 | CN100541764C Method of manufacturing NAND flash memory device |
| 09/16/2009 | CN100541763C Method of forming metal line in semiconductor device |
| 09/16/2009 | CN100541762C Methods of forming trench and contact in memory cells |
| 09/16/2009 | CN100541761C Technique for forming interconnecting structures with reduced electro and stress migration and/or resistivity |
| 09/16/2009 | CN100541760C Controlling lateral distribution of air gaps in interconnection |
| 09/16/2009 | CN100541759C Method for manufacturing compound material wafers and method for recycling a used donor substrate |
| 09/16/2009 | CN100541758C Shallow trench isolation forming method, method for manufacturing integrated circuit and method for forming liner |
| 09/16/2009 | CN100541757C Device for preventing collision of chip ejector |
| 09/16/2009 | CN100541756C Repair method for electrostatic adsorption electrode |
| 09/16/2009 | CN100541755C Wafer back part positioning device and method of use thereof |
| 09/16/2009 | CN100541754C Method for combining two objects using four cameras |
| 09/16/2009 | CN100541753C Electronic device and method of manufacturing thereof |
| 09/16/2009 | CN100541752C Handler for testing of packed chip |
| 09/16/2009 | CN100541751C Wafer structure and forming method thereof |
| 09/16/2009 | CN100541750C Heating device, reflow device, heating method, and bump forming method |
| 09/16/2009 | CN100541749C Semiconductor apparatus and method of fabricating the apparatus |
| 09/16/2009 | CN100541748C Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package |
| 09/16/2009 | CN100541747C Method for making packaging structure by cutting wafer back |
| 09/16/2009 | CN100541746C Electropolishing metal layers on wafers having trenches or vias with dummy structures |
| 09/16/2009 | CN100541745C Fabrication of single or multiple gate field plates |
| 09/16/2009 | CN100541744C Method for producing film transistor, film transistor and display unit |
| 09/16/2009 | CN100541743C Thin film transistor, method for fabricating the same and display device |
| 09/16/2009 | CN100541742C Thin film transistor, method for fabricating thin film transistor and display member |
| 09/16/2009 | CN100541741C Fully silicided extrinsic base transistor and its manufacture method |
| 09/16/2009 | CN100541740C Semiconductor device having nitridated oxide layer and method therefor |
| 09/16/2009 | CN100541739C Method for quickly heating and annealing multi-layer crystal chip with edges |
| 09/16/2009 | CN100541738C Method for forming a semiconductor device having a silicide layer |
| 09/16/2009 | CN100541737C Method of forming film and film forming apparatus |