Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2014
07/15/2014US8778701 Method for producing spin injection electrode
07/15/2014US8778700 Hydrogen barrier for ferroelectric capacitors
07/15/2014US8778513 Perovskite manganese oxide thin film
07/15/2014US8778211 GST CMP slurries
07/15/2014US8778206 Substrate processing method and storage medium
07/15/2014US8778205 Processing method and processing system
07/15/2014US8778204 Methods for reducing photoresist interference when monitoring a target layer in a plasma process
07/15/2014US8778201 Method for manufacturing porous structure and method for forming pattern
07/15/2014US8778194 Component having a through-connection
07/15/2014US8778118 Manufacturing method of laser processed parts, and pressure-sensitive adhesive sheet for laser processing used for the same
07/15/2014US8778112 Method for bonding thin film piece
07/15/2014US8778081 Process and hardware for deposition of complex thin-film alloys over large areas
07/15/2014US8778079 Chemical vapor deposition reactor
07/15/2014US8778066 Vacuum pump exhaust pipe of chemical vapor deposition apparatus and relevant vacuum pump
07/15/2014US8777694 Polishing endpoint detection method
07/15/2014US8777547 Systems, apparatus and methods for transporting substrates
07/15/2014US8777540 Apparatus for storing contamination-sensitive flat articles, in particular for storing semiconductor wafers
07/15/2014US8777198 Substrate holding apparatus, substrate holding method, and substrate processing apparatus
07/15/2014US8776841 System for purging reticle storage
07/15/2014US8776720 Linear-type microwave-excited plasma source using a slotted rectangular waveguide as the plasma exciter
07/15/2014US8776719 Microwave plasma reactor
07/15/2014US8776356 Electrostatic chuck and manufacturing method thereof
07/15/2014CA2587774C Component for detecting especially infrared electromagnetic radiation
07/15/2014CA2563085C The surface treatment of nanoparticles to control interfacial properties and method of manufacture
07/10/2014WO2014107704A1 Combined electrochemical and chemical etching processes for generation of porous silicon particulates
07/10/2014WO2014107665A1 High temperature sensor wafer for in-situ measurements in active plasma
07/10/2014WO2014107649A1 Buried hard mask for embedded semicon-ductor device patterning
07/10/2014WO2014107563A1 Detecting tsv defects in 3d packaging
07/10/2014WO2014107534A1 Color tuning of a multi-color led based illumination device
07/10/2014WO2014107522A1 Detecting defects on a wafer
07/10/2014WO2014107504A1 Silicon photonics photodetector integration
07/10/2014WO2014107459A1 Engineered substrate assemblies with epitaxial templates and relates systems, methods, and devices
07/10/2014WO2014107456A1 Engineered substrates having epitaxial formation structures with enhanced shear strength and associates systems and methods
07/10/2014WO2014107351A1 Edge grip substrate handler
07/10/2014WO2014107290A1 Silicon nitride gapfill implementing high density plasma
07/10/2014WO2014107108A1 Through-polymer via (tpv) and method to manufacture such a via
07/10/2014WO2014107040A1 Silver alloy bonding wire
07/10/2014WO2014106985A1 Metal core solder ball and heat dissipation structure for semiconductor device using the same
07/10/2014WO2014106978A1 Vacuum plate of large-scale thin film coating apparatus and processing method therefor
07/10/2014WO2014106955A1 Composition, laminate, method for producing laminate, transistor, and method for producing transistor
07/10/2014WO2014106938A1 Transparent organic thin-film transistor and method for producing same
07/10/2014WO2014106914A1 Industrial robot
07/10/2014WO2014106875A1 Group-iii nitride epitaxial substrate and method for producing same
07/10/2014WO2014106844A1 Method for finding non-essential flip flops in a vlsi design that do not require retention in standby mode
07/10/2014WO2014106557A1 Chuck, in particular for use in a mask aligner
07/10/2014WO2014106376A1 Semiconductor structure and method for manufacturing same
07/10/2014WO2014081817A8 Fabrication and passivation of silicon surfaces
07/10/2014WO2014078134A3 Semiconductor package with a die to die first bond
07/10/2014WO2014066881A8 Method to improve reliability of high-k metal gate stacks
07/10/2014WO2014014114A9 Composition for forming passivation layer, semiconductor substrate with passivation layer, method for manufacturing semiconductor substrate with passivation layer, solar cell element, method for manufacturing solar cell element, and solar cell
07/10/2014WO2014014110A9 Composition for forming passivation layer, semiconductor substrate having passivation layer, production method for semiconductor substrate having passivation layer, solar cell element, production method for solar cell element, and solar cell
07/10/2014WO2013090529A8 Near-infrared absorbing film composition for lithographic application
07/10/2014US20140194719 Long-Term Implantable Silicon Carbide Neural Interface Device Using the Electrical Field Effect
07/10/2014US20140193984 Apparatus and method for reducing residual stress of semiconductor
07/10/2014US20140193983 APPARATUSES AND METHODS FOR DEPOSITING SiC/SiCN FILMS VIA CROSS-METATHESIS REACTIONS WITH ORGANOMETALLIC CO-REACTANTS
07/10/2014US20140193982 Low thermal conductivity matrices with embedded nanostructures and methods thereof
07/10/2014US20140193981 Photo resist trimmed line end space
07/10/2014US20140193980 Patterned line end space
07/10/2014US20140193979 Directional sio2 etch using plasma pre-treatment and high-temperature etchant deposition
07/10/2014US20140193978 Method of plasma processing and apparatuses using the method
07/10/2014US20140193977 Plasma etching method and plasma etching apparatus
07/10/2014US20140193976 Methods of forming contact holes
07/10/2014US20140193975 Composition for forming titanium-containing resist underlayer film and patterning process
07/10/2014US20140193974 Multi-patterning method and device formed by the method
07/10/2014US20140193973 Method for forming interlayer connectors to a stack of conductive layers
07/10/2014US20140193972 Buried Hard Mask for Embedded Semiconductor Device Patterning
07/10/2014US20140193970 Isolated wire structures with reduced stress, methods of manufacturing and design structures
07/10/2014US20140193968 Semiconductor Device and Manufacturing Method of the Same
07/10/2014US20140193967 Method of forming an epitaxial layer on a substrate, and apparatus and system for performing the same
07/10/2014US20140193966 Methods of manufacturing vertical semiconductor devices
07/10/2014US20140193965 REDUCTION OF BASAL PLANE DISLOCATIONS IN EPITAXIAL SiC USING AN IN-SITU ETCH PROCESS
07/10/2014US20140193964 Method of manufacturing semiconductor device
07/10/2014US20140193963 Techniques For Forming 3D Structures
07/10/2014US20140193962 Semiconductor devices and methods of forming the same
07/10/2014US20140193957 Reducing gate height variance during semiconductor device formation
07/10/2014US20140193956 Transistor and fabriation method
07/10/2014US20140193953 Method of manufacturing semiconductor device mounting structure
07/10/2014US20140193950 Electronic device package and fabrication method thereof
07/10/2014US20140193947 Method for manufacturing semiconductor device
07/10/2014US20140193945 Solution for etching a thin film transistor and method of manufacturing the same
07/10/2014US20140193928 Current application device and manufacturing method of semiconductor element
07/10/2014US20140193232 Apparatus for flipping semiconductor device
07/10/2014US20140192464 Masking substrates for application of protective coatings
07/10/2014US20140191618 Poling treatment method, plasma poling device, piezoelectric body and manufacturing method thereof, film forming device and etching device, and lamp annealing device
07/10/2014US20140191478 Device for holding a planar substrate
07/10/2014US20140191420 Embedded package in pcb build up
07/10/2014US20140191415 Methods for etching through-wafer vias in a wafer
07/10/2014US20140191413 Method for producing a semiconductor device comprising a conductor layer in the semiconductor body and semiconductor body
07/10/2014US20140191412 Interconnection structures and fabrication method thereof
07/10/2014US20140191411 Interconnection structures and fabrication method thereof
07/10/2014US20140191410 Damage monitor structure for through-silicon via (tsv) arrays
07/10/2014US20140191409 Forming vias and trenches for self-aligned contacts in a semiconductor structure
07/10/2014US20140191408 Backside metal ground plane with improved metal adhesion and design structures
07/10/2014US20140191406 Manufacturing method for semiconductor package, semiconductor package, and semiconductor device
07/10/2014US20140191404 Local interconnect structure and fabrication method
07/10/2014US20140191403 Multi-die semiconductor package and method of manufacturing thereof
07/10/2014US20140191401 Airgap interconnect with hood layer and method of formiing
07/10/2014US20140191400 Semiconductor Devices and Methods of Manufacture Thereof
07/10/2014US20140191392 Post-Passivation Interconnect Structure and Methods for Forming the Same
07/10/2014US20140191388 3d stacking semiconductor device and manufacturing method thereof
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