Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2009
11/18/2009CN101582406A Wiring board, method for manufacturing the same, and semiconductor package
11/18/2009CN101582403A Semiconductor package featuring flip-chip die sandwiched between metal layers
11/18/2009CN101582398A Ball-bump bonded ribbon-wire interconnect
11/18/2009CN101582397A Semiconductor device and manufacturing method thereof
11/18/2009CN101582396A Semiconductor device and manufacturing of the same
11/18/2009CN101582393A Method of manufacturing a solid-state imaging device and method for manufacturing electronic apparatus
11/18/2009CN101582392A Wafer cutting method for contact type image sensing unit
11/18/2009CN101582391A Method for forming a pattern, method for manufacturing semiconductor apparatus, and method for manufacturing display
11/18/2009CN101582390A Method of forming integrated circuit structure
11/18/2009CN101582389A Flexible expansion link mechanism
11/18/2009CN101582388A Substrate holding apparatus
11/18/2009CN101582387A Holding device for substrate and mask and holding method using same
11/18/2009CN101582386A Method for forming metallic bump on semiconductor component and sealing semiconductor component
11/18/2009CN101582385A Light-emitting diode display and method for manufacturing the same
11/18/2009CN101582384A Semiconductor through-electrode forming method
11/18/2009CN101582383A Semiconductor layer for thin film transistor
11/18/2009CN101582382A Preparation method of thin film transistor
11/18/2009CN101582381A Preparation method of thin film transistor
11/18/2009CN101582380A High-pressure thyristor and production technique thereof
11/18/2009CN101582379A Semiconductor, field effect transistor and method for making grid electrode
11/18/2009CN101582378A Substrate processing apparatus and control method thereof
11/18/2009CN101582377A Electronic component forming apparatus and electronic component formed with the same and forming method thereof
11/18/2009CN101582376A Method of manufacturing semiconductor devices and etching device
11/18/2009CN101582375A Capacity coupling plasma reactor with temperature uniform distribution wafer supporting
11/18/2009CN101582374A Method of forming a thin film pattern for semiconductor device and apparatus for the same
11/18/2009CN101582373A Gas charging equipment and gas inlet port device
11/18/2009CN101582372A Device or method for preparing solution for processing single-chip semiconductor
11/18/2009CN101582322A Inductance coupling coil and plasma processing device adopting same
11/18/2009CN101581930A Novel methodology to realize automatic virtual metrology
11/18/2009CN101581887A Fluid handling structure, lithographic apparatus and device manufacturing method
11/18/2009CN101581885A Coating apparatus and method
11/18/2009CN101581884A Intaglio printing plate, production method for intaglio printing plate, production method for electronic substrate, and production method for display device
11/18/2009CN101581880A Semiconductor package and method for making the same
11/18/2009CN101581877A Method for stripping pellicle and stripping apparatus used therein
11/18/2009CN101581861A Liquid crystal display device and method for manufacturing the same
11/18/2009CN101581839A Thin film transistor primitive plate testing line and manufacturing method thereof
11/18/2009CN101580774A Cleaning liquid composition for a semiconductor substrate
11/18/2009CN101580519A Metal complex for doping an organic semiconducting matrix material
11/18/2009CN101579838A Grinding method, grinding pad and grinding system
11/18/2009CN101579837A Polishing pad adjusting device for chemical-mechanical polishing
11/18/2009CN100562207C Method for suppressing plasma unstability
11/18/2009CN100561757C Packing method for improving photoelectric element and its array optical coupling tolerance degree
11/18/2009CN100561753C Stack grid-source one-side electronic injection flash memory and manufacturing method thereof
11/18/2009CN100561752C Preparation method of quasi dual-gate MOS transistor
11/18/2009CN100561751C A non-negative resistant LDMOS device structure and the corresponding manufacturing method
11/18/2009CN100561750C Carbon nanotube transistor and method for forming carbon nanotube device
11/18/2009CN100561749C Thyristor and method of manufacture
11/18/2009CN100561747C Hall-effect based super-high density magnetic random memory and method for making same
11/18/2009CN100561744C Image sensor and method for fabricating thereof
11/18/2009CN100561742C Back shining type ZnO base ultraviolet imaging solid state focal plane detection array and its preparation
11/18/2009CN100561741C Thin film transistor substrate and manufacturing method
11/18/2009CN100561740C Semiconductor storage device and manufacturing method thereof
11/18/2009CN100561737C Lamina ball grid array package piece of central welding-spot chip and manufacture method thereof
11/18/2009CN100561735C Power circuit package and fabrication method
11/18/2009CN100561732C Method of forming a semiconductor package and structure thereof
11/18/2009CN100561731C Multi-speed interconnected reliability testing structure
11/18/2009CN100561729C Making method for dual enchasing structure
11/18/2009CN100561728C Semiconductor device and its manufacturing method
11/18/2009CN100561724C Semiconductor chip packaging structure and encapsulation method
11/18/2009CN100561723C 半导体器件和其制造方法 The semiconductor device and the manufacturing method thereof
11/18/2009CN100561715C Isolating ring substrate, mask plate and forming method thereof
11/18/2009CN100561714C Method of forming self-passivating interconnection and resulting devices
11/18/2009CN100561713C Method for forming passivation layer of CMOS device
11/18/2009CN100561712C Semiconductor device and its manufacturing method
11/18/2009CN100561711C Method for forming CMOS image sensor
11/18/2009CN100561710C System and method for manufacturing contact
11/18/2009CN100561709C Method for forming a 3d integrated circuit
11/18/2009CN100561708C Integration process for fabricating stressed transistor structure
11/18/2009CN100561707C Metal interconnection method and metallic layer graphic method
11/18/2009CN100561706C Method for forming double mosaic structure
11/18/2009CN100561705C Fabricating method for semiconductor device
11/18/2009CN100561704C Isolation structure of shallow plough groove and manufacturing method thereof
11/18/2009CN100561703C Single thin plate storage container
11/18/2009CN100561702C Accurate measuring method of semiconductor doping distribution
11/18/2009CN100561701C Welding head positioning accuracy detecting system and method thereof
11/18/2009CN100561700C Method for forming grid medium layer and estimating its electrical parameter
11/18/2009CN100561699C Monitoring of contact hole production
11/18/2009CN100561698C Bonder for crystal grain bonding and method for bonding crystal grain
11/18/2009CN100561697C Method for making tin solder bump
11/18/2009CN100561696C Structure embedded with semiconductor chip and its manufacturing method
11/18/2009CN100561695C Connection method for chip and bearer
11/18/2009CN100561694C Process sequence for doped silicon fill for deep trenches
11/18/2009CN100561693C Method for providing structural support for interconnect pad while allowing signal conductance
11/18/2009CN100561692C Adulation method for MOS transistor body area
11/18/2009CN100561691C Making method for low on-resistance power VDMOS transistor
11/18/2009CN100561690C Non-volatile semiconductor memory and manufacturing method thereof
11/18/2009CN100561689C Methods for forming a transistor
11/18/2009CN100561688C Monocrystalline extrinsic base and emitter heterojunction bipolar transistor and related methods
11/18/2009CN100561687C Substrate treating method and production method for semiconductor device
11/18/2009CN100561686C Plasma processing apparatus and gas permeable plate
11/18/2009CN100561685C Plasma processing method
11/18/2009CN100561684C Method for forming underlying insulation film
11/18/2009CN100561683C Chemical passivation method for measuring minority carrier lifetime of crystalline silicon
11/18/2009CN100561682C Method for altering mechanical and optical performance of thin film
11/18/2009CN100561681C Method for improving insulated dielectric defect and forming dual damascene structure
11/18/2009CN100561680C Plasma processing apparatus, process vessel for plasma processing apparatus and dielectric plate
11/18/2009CN100561679C Plasma etching apparatus and method
11/18/2009CN100561678C Processing method for silicon sheet surface
11/18/2009CN100561677C Wafer surface planarization method
11/18/2009CN100561676C Method for controlling thickness of silicon slot and silicon dioxide in ICP reactor
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