Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2009
11/10/2009US7615500 Method for depositing film and method for manufacturing semiconductor device
11/10/2009US7615499 Method for oxidizing a layer, and associated holding devices for a substrate
11/10/2009US7615498 Method of manufacturing a semiconductor device
11/10/2009US7615497 Forming fine pattern of semiconductor device using three mask layers and CMP of spin-on carbon layer
11/10/2009US7615496 Method of forming pad patterns using self-align double patterning method, pad pattern layout formed using the same, and method of forming contact holes using self-align double patterning method
11/10/2009US7615495 Display device and manufacturing method of the same
11/10/2009US7615494 Method for fabricating semiconductor device including plug
11/10/2009US7615493 Method for forming alignment mark
11/10/2009US7615492 Preparing method of CNT-based semiconductor sensitized solar cell
11/10/2009US7615491 Defectivity and process control of electroless deposition in microelectronics applications
11/10/2009US7615490 Method for fabricating landing plug of semiconductor device
11/10/2009US7615488 Method for forming pattern, thin film transistor, display device and method for manufacturing the same, and television device
11/10/2009US7615487 Power delivery package having through wafer vias
11/10/2009US7615486 Apparatus and method for integrated surface treatment and deposition for copper interconnect
11/10/2009US7615484 Integrated circuit manufacturing method using hard mask
11/10/2009US7615483 Printed metal mask for UV, e-beam, ion-beam and X-ray patterning
11/10/2009US7615482 Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength
11/10/2009US7615480 Methods of post-contact back end of the line through-hole via integration
11/10/2009US7615479 Assembly comprising functional block deposited therein
11/10/2009US7615478 Fabrication method for electronic system modules
11/10/2009US7615477 Method of fabricating a BGA package having decreased adhesion
11/10/2009US7615476 Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
11/10/2009US7615475 Method for fabricating landing polysilicon contact structures for semiconductor devices
11/10/2009US7615473 Method of introducing ion and method of manufacturing semiconductor device
11/10/2009US7615472 Method for manufacturing nitride semiconductor substrate
11/10/2009US7615471 Method for producing a tensioned layer on a substrate, and a layer structure
11/10/2009US7615470 Method of manufacturing gallium nitride semiconductor
11/10/2009US7615469 Edge seal for a semiconductor device and method therefor
11/10/2009US7615468 Methods for making substrates and substrates formed therefrom
11/10/2009US7615467 Method for manufacturing SOI wafer
11/10/2009US7615466 Method for producing a semiconductor-on-insulator structure
11/10/2009US7615465 Creation of high mobility channels in thin-body SOI devices
11/10/2009US7615464 Transfer method with a treatment of a surface to be bonded
11/10/2009US7615463 Method for making thin layers containing microcomponents
11/10/2009US7615462 Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack
11/10/2009US7615461 Method for forming shallow trench isolation of semiconductor device
11/10/2009US7615460 Hard mask technique in forming a plug
11/10/2009US7615459 Manufacturing method for variable resistive element
11/10/2009US7615458 Activation of CMOS source/drain extensions by ultra-high temperature anneals
11/10/2009US7615457 Method of fabricating self-aligned bipolar transistor having tapered collector
11/10/2009US7615456 Method for manufacturing SOI substrate
11/10/2009US7615455 Integrated circuit bipolar transistor
11/10/2009US7615454 Embedded stressed nitride liners for CMOS performance improvement
11/10/2009US7615453 Method of manufacturing a semiconductor integrated circuit device
11/10/2009US7615452 Method of fabrication of normally-off field-effect semiconductor device
11/10/2009US7615451 Method for forming semiconductor device
11/10/2009US7615450 Method of manufacturing flash memory device
11/10/2009US7615448 Method of forming low resistance void-free contacts
11/10/2009US7615447 Composite charge storage structure formation in non-volatile memory using etch stop technologies
11/10/2009US7615446 Charge trap flash memory device, fabrication method thereof, and write/read operation control method thereof
11/10/2009US7615445 Methods of reducing coupling between floating gates in nonvolatile memory
11/10/2009US7615444 Method for forming a capacitor structure
11/10/2009US7615443 Method of forming finFET device
11/10/2009US7615442 Method for fabricating trench metal-oxide-semiconductor field effect transistor
11/10/2009US7615441 Forming high-k dielectric layers on smooth substrates
11/10/2009US7615440 Capacitor and method of manufacturing a capacitor
11/10/2009US7615439 Damascene process for carbon memory element with MIIM diode
11/10/2009US7615438 Lanthanide yttrium aluminum oxide dielectric films
11/10/2009US7615437 Non-volatile memory device and method of manufacturing the same
11/10/2009US7615436 Two mask floating gate EEPROM and method of making
11/10/2009US7615435 Semiconductor device and method of manufacture
11/10/2009US7615434 CMOS device and fabricating method thereof
11/10/2009US7615433 Double anneal with improved reliability for dual contact etch stop liner scheme
11/10/2009US7615432 HDP/PECVD methods of fabricating stress nitride structures for field effect transistors
11/10/2009US7615431 Manufacturing method of semiconductor device
11/10/2009US7615430 Field effect transistor and method of manufacturing a field effect transistor
11/10/2009US7615429 Methods of fabricating field effect transistors having multiple stacked channels
11/10/2009US7615428 Vertical memory device and method
11/10/2009US7615427 Spacer-less low-k dielectric processes
11/10/2009US7615426 PMOS transistor with discontinuous CESL and method of fabrication
11/10/2009US7615425 Open source/drain junction field effect transistor
11/10/2009US7615424 Laser irradiation apparatus and method for manufacturing semiconductor device using the laser irradiation apparatus
11/10/2009US7615423 Method for producing insulated gate thin film semiconductor device
11/10/2009US7615422 Evaluation method of semiconductor device, manufacturing method of the semiconductor device, design management system of device comprising the semiconductor device, dose amount control program for the semiconductor device, computer-readable recording medium recording the program, and dose amount control apparatus
11/10/2009US7615421 Method for fabricating thin film transistor
11/10/2009US7615420 Method for manufacturing indium gallium aluminium nitride thin film on silicon substrate
11/10/2009US7615418 High performance stress-enhance MOSFET and method of manufacture
11/10/2009US7615417 Triggered silicon controlled rectifier for RF ESD protection
11/10/2009US7615416 Secure package with anti-tamper peripheral guard ring
11/10/2009US7615415 Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability
11/10/2009US7615414 Dental intraoral radiological image sensor with a fiber-optic plate
11/10/2009US7615413 Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component
11/10/2009US7615412 System in package (SIP) integrated circuit and packaging method thereof
11/10/2009US7615411 Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof
11/10/2009US7615410 Chip-sized flip-chip semiconductor package and method for making the same
11/10/2009US7615409 Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
11/10/2009US7615408 Method of manufacturing semiconductor device
11/10/2009US7615407 Methods and systems for packaging integrated circuits with integrated passive components
11/10/2009US7615406 Electronic device package manufacturing method and electronic device package
11/10/2009US7615405 Method for precision assembly of integrated circuit chip packages
11/10/2009US7615404 High-contrast laser mark on substrate surfaces
11/10/2009US7615401 Methods of fabricating multi-layer phase-changeable memory devices
11/10/2009US7615400 Method for producing multijunction solar cell
11/10/2009US7615399 Fabrication method of complementary metal oxide semiconductor image sensor
11/10/2009US7615398 Pyramidal photonic crystal light emitting device
11/10/2009US7615397 Micro-element package and manufacturing method thereof
11/10/2009US7615395 Method for containing a device and a corresponding device
11/10/2009US7615394 Method for fabricating MEMS device package that includes grinding MEMS device wafer to expose array pads corresponding to a cap wafer
11/10/2009US7615393 Methods of forming multi-doped junctions on a substrate
11/10/2009US7615392 Light emitting diode and method of making the same
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