Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2009
11/26/2009US20090289340 Semiconductor device and method for manufacturing the same
11/26/2009US20090289339 Semiconductor package and method for manufacturing the same
11/26/2009US20090289338 Semiconductor package and method for manufacturing the same
11/26/2009US20090289336 Semiconductor device and method for manufacturing thereof
11/26/2009US20090289335 Integrated circuit package system with shield and tie bar
11/26/2009US20090289334 Metal gate structure and method of manufacturing same
11/26/2009US20090289333 Annealing a Buffer Layer for Fabricating Electronic Devices on Compliant Substrates
11/26/2009US20090289331 Semiconductor chip and semiconductor device, and method of manufacturing the same
11/26/2009US20090289330 Group iii nitride semiconductor substrate, substrate for group iii nitride semiconductor device, and methods of making same
11/26/2009US20090289329 Differential Varactor
11/26/2009US20090289326 Semiconductor device and method of fabricating the same
11/26/2009US20090289324 Mask overhang reduction or elimination after substrate etch
11/26/2009US20090289321 Thermal sensing and reset protection for an integrated circuit chip
11/26/2009US20090289320 Fast p-i-n photodetector with high responsitivity
11/26/2009US20090289318 Electronics device package and fabrication method thereof
11/26/2009US20090289317 Packaging structure and method for fabricating the same
11/26/2009US20090289315 Semiconductor sensor and manufacturing method of sensor body for semiconductor sensor
11/26/2009US20090289314 Micro-electromechanical resonance device with periodic structure
11/26/2009US20090289313 Micro electric mechanical system device and method of producing the same
11/26/2009US20090289312 Semiconductor device and method of manufacturing the same
11/26/2009US20090289310 Semiconductor device and semiconductor device manufacturing method
11/26/2009US20090289309 Method for reducing silicide defects in integrated circuits
11/26/2009US20090289306 Lateral oxidation with high-k dielectric liner
11/26/2009US20090289304 Co-integration of multi-gate fet with other fet devices in cmos technology
11/26/2009US20090289302 Semiconductor device and method of fabricating the same
11/26/2009US20090289301 Laser annealing of metal oxide semiconductoron temperature sensitive substrate formations
11/26/2009US20090289300 Semiconductor device and method for producing the same
11/26/2009US20090289298 Self-aligned impact-ionization field effect transistor
11/26/2009US20090289297 Charge trap-type non-volatile memory device and method of fabricating the same
11/26/2009US20090289296 Semiconductor Device and Method of Fabricating the same
11/26/2009US20090289295 Semiconductor Device and Method of Fabricating the same
11/26/2009US20090289293 Semiconductor device having tri-gate structure and manufacturing method thereof
11/26/2009US20090289292 Semiconductor Memory Device and Method for Forming Capacitor Thereof
11/26/2009US20090289291 Soi deep trench capacitor employing a non-conformal inner spacer
11/26/2009US20090289288 Integrated circuit including an insulating structure below a source/drain region and method
11/26/2009US20090289285 Semiconductor device and method of fabricating the same
11/26/2009US20090289284 High shrinkage stress silicon nitride (SiN) layer for NFET improvement
11/26/2009US20090289283 Wafer For Backside Illumination Type Solid Imaging Device, Production Method Thereof And Backside Illumination Solid Imaging Device
11/26/2009US20090289282 Solid state imaging device and method for manufacturing the same
11/26/2009US20090289280 Method for Making Transistors and the Device Thereof
11/26/2009US20090289279 Method and apparatus for buried-channel semiconductor device
11/26/2009US20090289278 Semiconductor device and method for manufacturing the same
11/26/2009US20090289275 Light Emitting Device, Package, Light Emitting Device Manufacturing Method, Package Manufacturing Method and Package Manufacturing Die
11/26/2009US20090289274 Package structure of light emitting diode and method of manufacturing the same
11/26/2009US20090289270 Group iii nitride semiconductor multilayer structure and production method thereof
11/26/2009US20090289267 Solid state led bridge rectifier light engine
11/26/2009US20090289264 Silicon carbide semiconductor device and method of manufacturing the same
11/26/2009US20090289263 System and Method for Emitter Layer Shaping
11/26/2009US20090289262 Junction barrier schottky diodes with current surge capability
11/26/2009US20090289260 Liquid crystal display device and method of manufacturing that
11/26/2009US20090289259 Pixel structure of display panel and method of making the same
11/26/2009US20090289258 Thin film transistor, method of fabricating the same, and organic light emitting diode display device including the same
11/26/2009US20090289257 Exposure mask using gray-tone pattern, manufacturing method of tft substrate using the same and liquid crystal display device having the tft substrate
11/26/2009US20090289256 Thin film transistor and display device including thin film transistor
11/26/2009US20090289255 Flexible display device and manufacturing method thereof
11/26/2009US20090289254 Semiconductor device and method for manufacturing the same
11/26/2009US20090289253 Semiconductor Wafer and Method of Forming Sacrificial Bump Pad for Wafer Probing During Wafer Sort Test
11/26/2009US20090289251 Nonvolatile memory device and method for manufacturing same
11/26/2009US20090289250 System And Method For Manufacturing A Thin-film Device
11/26/2009US20090289249 Oxide Semiconductor, Thin-Film Transistor and Method for Producing the Same
11/26/2009US20090289245 Faceted catalytic dots for directed nanotube growth
11/26/2009US20090289244 Semiconductor heterostructure nanowire devices
11/26/2009US20090289243 Short bridge phase change memory cells and method of making
11/26/2009US20090289099 Wire bonding method
11/26/2009US20090289050 Probe card thermal conditioning system
11/26/2009US20090289035 Plasma Processing Apparatus And Plasma Processing Method
11/26/2009US20090288805 Semiconductor package with a chip on a support plate
11/26/2009DE112008000431T5 Objektuntersuchungsplattform, implementiert mit einem Kopplungsmechanismus einer Bearbeitungsplattform Object scan platform, implemented with a coupling mechanism of a processing platform
11/26/2009DE112004002638B4 Verfahren zur Herstellung einer integrierten Schaltung mit Seitenwandabstandshaltern mit geringer Verspannung A method of fabricating an integrated circuit with sidewall spacers with a low strain
11/26/2009DE10341321B4 Verfahren zur Bildung eines Grabens in einer Schicht oder einem Schichtstapel auf einem Halbleiterwafer A method of forming a trench in a layer or a layer stack on a semiconductor wafer
11/26/2009DE10332188B4 Inline-System für einen Halbleiterpackungs-Montageprozess und Chipvereinzelungs-Folienanbringungseinheit Inline system for a semiconductor package assembly process and chip singulation film mounting unit
11/26/2009DE10291108B4 Magnetoresistives Halbleiterbauelement mit einem semimagnetischen Kontakt, sowie Speicherelement und magnetischer Sensor The magnetoresistive semiconductor device with a semi-magnetic contact, as well as memory element and magnetic sensor
11/26/2009DE10260613B4 Verfahren zum Herstellen eines Feldeffekttransistors A method of manufacturing a field effect transistor
11/26/2009DE10204621B4 Verfahren zur Herstellung einer mit einem vertikale Profil versehenen Elektrode und eine derartige Elektrode umfassendes Halbleiterbauelement A process for the preparation of a profile provided with a vertical electrode and such an electrode complete semiconductor device
11/26/2009DE102009021718A1 Halbleitervorrichtung aus Siliciumcarbid und Verfahren zu ihrer Herstellung The semiconductor device of silicon carbide and methods for their preparation
11/26/2009DE102009002813A1 Verfahren zur Herstellung eines Transistorbauelements mit einer Feldplatte A process for producing a transistor device with a field plate
11/26/2009DE102008023614B3 Supporting pin positioning method for use in assembly machine, involves moving displacement device in x-direction and y-direction, such that pin is moved to predefined position on table through displacement movement in x and y-directions
11/26/2009DE102008023456A1 Träger zur Aufnahme von Halbleiterscheiben Support for receiving the semiconductor wafers
11/26/2009DE102008022792A1 Elektrostatisches Halteelement mit Antireflexbeschichtung, Vermessungsverfahren und Verwendung des Halteelementes Electrostatic holding element with antireflection coating, measurement method and use of the retaining element
11/26/2009DE102008014166B3 Verfahren zur Herstellung einer Siliziumoberfläche mit pyramidaler Textur A process for producing a silicon surface with pyramidal texture
11/26/2009DE102008009022B3 Logical circuit's thin film transistor i.e. thin film FET, producing method for LCD, involves forming gate insulating layer on structured layer with source and drain electrodes and providing top-gate electrode on insulating layer
11/26/2009DE102008006960B4 Halbleiterbauelement mit selbstjustierter Kontaktstruktur und Verfahren zur Herstellung A semiconductor device with self-aligned contact structure and method for producing
11/26/2009DE102007063271B4 Verfahren zur Herstellung eines dielektrischen Zwischenschichtmaterials mit unterschiedlichen Abtragsraten während eines CMP-Prozesses A process for producing an interlayer dielectric material having different removal rates during a CMP process,
11/26/2009DE102007047680B4 Handhabungsvorrichtung für elektronische Bauelemente, insbesondere IC's, mit temperierbaren Umlaufeinheiten Handling apparatus for electronic components, especially ICs with temperature-bearing units
11/26/2009DE102007017963B4 Speicherzellenstruktur, nicht-flüchtiges Speicherbauelement und System sowie Verfahren zum Herstellen und Betreiben derselben Memory cell structure, non-volatile memory device and system, as well as methods of making and operating the same
11/26/2009DE102006044840B4 Integrierte Transistorvorrichtung und entsprechendes Herstellungsverfahren The integrated transistor device and method of manufacture
11/26/2009DE102006044368B4 Verfahren zum Herstellen eines Substrats mit einem Hohlraum A method for producing a substrate with a cavity
11/26/2009DE102005040325B4 Ausbesserung von Kohlenstoffverarmung in low-k dielektrischen Filmen und damit erhältliche Halbleitervorrichtungen Repair of carbon depletion in low-k dielectric films and thus available semiconductor devices
11/26/2009DE102005027234B4 Verfahren zum Bilden einer Verbindungsstruktur für eine Halbleitervorrichtung A method of forming an interconnect structure for a semiconductor device
11/26/2009DE102004052578B4 Verfahren zum Erzeugen einer unterschiedlichen mechanischen Verformung in unterschiedlichen Kanalgebieten durch Bilden eines Ätzstoppschichtstapels mit unterschiedlich modifizierter innerer Spannung A method for generating a different mechanical deformation in different channel regions by forming a Ätzstoppschichtstapels with differently modified internal stress
11/26/2009DE102004028933B4 Verfahren zur Herstellung einer vergrabenen metallischen Schicht in einem Halbleiterkörper und Halbleiterbauelement mit einer vergrabenen metallischen Schicht A process for producing a buried metallic layer in a semiconductor body and the semiconductor component with a buried metallic layer
11/26/2009DE102004024114B4 Sputter-Target aus einer Legierung auf Ag-Bi-Basis und Verfahren zur Herstellung desselben Of the same sputtering target made of an alloy Ag-Bi-based and methods for preparing
11/26/2009DE10196676B4 Substrat und Herstellungsverfahren dafür sowie Dünnschicht-Strukturkörper Substrate and manufacturing method thereof as well as thin-film structural body
11/26/2009CA2721841A1 Electroplating composition and process for coating a semiconductor substrate using said composition
11/25/2009EP2124266A1 Method for forming quantum well structure and method for manufacturing semiconductor light emitting element
11/25/2009EP2124258A2 Mos field effect transistor and manufacturing method for the same
11/25/2009EP2124253A1 High frequency package
11/25/2009EP2124252A1 Package manufacturing method, package, optical module and die for integral molding
11/25/2009EP2124251A1 Wafer for backside illumination type solid imaging device, production method thereof and backside illumination solid imaging device
11/25/2009EP2124250A1 Semiconductor device and process for producing the same
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