Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2009
11/26/2009US20090291568 Semiconductor devices and method of forming the same
11/26/2009US20090291567 Nitride-based compound semiconductor, method of cleaning a compound semiconductor, method of producing the same, and substrate
11/26/2009US20090291566 Substrate Processing Apparatus, Coolant Gas Supply Nozzle and Semiconductor Device Manufacturing Method
11/26/2009US20090291565 Method for stripping photoresist
11/26/2009US20090291564 Apparatus and method for plasma processing
11/26/2009US20090291563 Plasma processing apparatus and plasma processing method
11/26/2009US20090291562 Helium descumming
11/26/2009US20090291561 Method of forming pattern
11/26/2009US20090291560 Forming method of etching mask, control program and program storage medium
11/26/2009US20090291559 Stable, high rate silicon slurry
11/26/2009US20090291558 Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturing
11/26/2009US20090291557 Microreactor for solution deposition and method of use
11/26/2009US20090291556 Method of selectively depositing materials on a substrate using a supercritical fluid
11/26/2009US20090291555 Method and Apparatus for Using Flex Circuit Technology to Create a Reference Electrode Channel
11/26/2009US20090291554 Semiconductor chip and method for fabricating the same
11/26/2009US20090291553 Threshold Adjustment for High-K Gate Dielectric CMOS
11/26/2009US20090291552 Substrate having film pattern and manufacturing method of the same, manufacturing method of semiconductor device, liquid crystal television, and el television
11/26/2009US20090291551 Method for forming vertical channel transistor of semiconductor device
11/26/2009US20090291550 Poly gate etch method and device for sonos-based flash memory
11/26/2009US20090291549 Metal film decarbonizing method, film forming method and semiconductor device manufacturing method
11/26/2009US20090291548 Method for preparing p-type polysilicon gate structure
11/26/2009US20090291547 Method for Reducing Plasma Discharge Damage During Processing
11/26/2009US20090291545 Process for enhancing solubility and reaction rates in supercritical fluids
11/26/2009US20090291544 Wafer laser processing method and apparatus
11/26/2009US20090291543 Method for Manufacturing a Field Plate in a Trench of a Power Transistor
11/26/2009US20090291542 Method for fabricating semiconductor device
11/26/2009US20090291541 Methods of manufacturing semiconductor devices with local recess channel transistors
11/26/2009US20090291540 CMOS Process with Optimized PMOS and NMOS Transistor Devices
11/26/2009US20090291539 Method for manufacturing and lcd driver ic
11/26/2009US20090291538 Manufacturing method of semiconductor device
11/26/2009US20090291537 Method of manufacturing a semiconductor device
11/26/2009US20090291536 Semiconductor device and manufacturing method thereof
11/26/2009US20090291534 Method for making thin film transistor
11/26/2009US20090291533 System-On-Chip (SOC), Design Structure and Method
11/26/2009US20090291532 Method of resin encapsulation molding for electronic part
11/26/2009US20090291531 Method of manufacturing a semiconductor device and molding die
11/26/2009US20090291530 Semiconductor package and manufacturing method thereof
11/26/2009US20090291529 Method of manufacturing a semiconductor device
11/26/2009US20090291528 Semiconductor Package Having Through-Hole Vias on Saw Streets Formed with Partial Saw
11/26/2009US20090291527 Semiconductor Package Having Through-Hole Vias on Saw Streets Formed with Partial Saw
11/26/2009US20090291526 Semiconductor Package Having Through-Hole Vias on Saw Streets Formed with Partial Saw
11/26/2009US20090291525 Method for fabricating electronic device having first substrate with first resin layer and second substrate with second resin layer adhered to the first resin layer
11/26/2009US20090291524 Combined metallic bonding and molding for electronic assemblies including void-reduced underfill
11/26/2009US20090291523 Method of Manufacturing High Quality ZnO Monocrystal Film on Silicon(111) Substrate
11/26/2009US20090291522 Layout structure in semiconductor memory device comprising global word lines, local word lines, global bit lines and local bit lines
11/26/2009US20090291520 Method for manufacturing semiconductor apparatus
11/26/2009US20090291518 Light emitting element, a light emitting device, a method of manufacturing a light emitting element and a method of manufacturing a light emitting device
11/26/2009US20090291517 Liquid crystal display device and fabricating method thereof
11/26/2009US20090291516 Peeling Method and Method of Manufacturing Semiconductor Device
11/26/2009US20090291515 Semiconductor device and a semiconductor device manufacturing method
11/26/2009US20090291514 Process management method and process management data for semiconductor device
11/26/2009US20090291513 Overlay marks, methods of overlay mark design and methods of overlay measurements
11/26/2009US20090291512 Semiconductor device pattern verification method, semiconductor device pattern verification program, and semiconductor device manufacturing method
11/26/2009US20090291511 Method of forming semiconductor thin film and semiconductor thin film inspection apparatus
11/26/2009US20090291510 Method for creating wafer test pattern
11/26/2009US20090291367 Lithium secondary battery and method of manufacturing same
11/26/2009US20090291311 Method of forming a nanostructure
11/26/2009US20090291207 Gas-purged vacuum valve
11/26/2009US20090290960 Apparatus for moving and securing a substrate
11/26/2009US20090290680 High resolution imaging system
11/26/2009US20090290611 Semiconductor laser and manufacturing method therefor
11/26/2009US20090290610 Method for Laterally Cutting Through a Semiconductor Wafer and Optoelectronic Component
11/26/2009US20090290437 Circuit for and an electronic device including a nonvolatile memory cell and a process of forming the electronic device
11/26/2009US20090290412 Memory Devices, Memory Device Constructions, Constructions, Memory Device Forming Methods, Current Conducting Devices, and Memory Cell Programming Methods
11/26/2009US20090290406 Low loading pad design for STT MRAM or other short pulse signal transmission
11/26/2009US20090290337 Mounting method, mounted structure, manufactureing method for electronic equipment, electronic equipment, manufacturing method for light-emitting diode display, and light-emitting diode display
11/26/2009US20090290273 Light-emitting diode package having electrostatic discharge protection function and method of fabricating the same
11/26/2009US20090290271 Multi-chip module package including external and internal electrostatic discharge protection circuits, and/or method of making the same
11/26/2009US20090290266 Spin Valve Magnetoresistive Device With Conductive-Magnetic Material Bridges In A Dielectric Or Semiconductor Layer Alternatively Of Magnetic Material
11/26/2009US20090290135 Lithographic apparatus and device manufacturing method
11/26/2009US20090290083 Liquid crystal display device and fabrication method thereof
11/26/2009US20090290082 Semiconductor Device and Fabrication Method Thereof
11/26/2009US20090290062 Optical device and production method thereof
11/26/2009US20090290058 Solid-state imaging device
11/26/2009US20090290054 Solid-state imaging device
11/26/2009US20090289379 Methods of Manufacturing Semiconductor Devices and Structures Thereof
11/26/2009US20090289376 Light-proof chip packaging structure and method for its manufacture
11/26/2009US20090289374 Semiconductor device, semiconductor device module, and method for manufacturing the semiconductor device module
11/26/2009US20090289371 Switching element and method of manufacturing the same
11/26/2009US20090289370 Low contact resistance semiconductor devices and methods for fabricating the same
11/26/2009US20090289369 Memory device peripheral interconnects and method of manufacturing
11/26/2009US20090289368 Interconnect structure having enhanced electromigration reliabilty and a method of fabricating same
11/26/2009US20090289367 Semiconductor device and method of manufacturing the same
11/26/2009US20090289366 Semiconductor device and manufacturing method of semiconductor device
11/26/2009US20090289365 Structure and process for conductive contact integration
11/26/2009US20090289364 Semiconductor device and a method for manufacturing the same
11/26/2009US20090289363 Fine-Pitch Ball Grid Array Package Design
11/26/2009US20090289362 Low Inductance Ball Grid Array Device Having Chip Bumps on Substrate Vias
11/26/2009US20090289361 Semiconductor device and method of manufacturing a semiconductor device
11/26/2009US20090289360 Workpiece contact pads with elevated ring for restricting horizontal movement of terminals of ic during pressing
11/26/2009US20090289358 Semiconductor device, method of manufacturing the same, and substrate
11/26/2009US20090289356 Wirebondless Wafer Level Package with Plated Bumps and Interconnects
11/26/2009US20090289352 Semiconductor device and a method for manufacturing the semiconductor device
11/26/2009US20090289351 Semiconductor apparatus having both-side heat radiation structure and method for manufacturing the same
11/26/2009US20090289350 Semiconductor package, substrate, electronic device using such semiconductor package or substrate, and method for correcting warping of semiconductor package
11/26/2009US20090289349 Hermetic sealing of micro devices
11/26/2009US20090289347 Circuit board, lead frame, semiconductor device, and method for fabricating the same
11/26/2009US20090289346 Structure and manufacturing method of chip scale package
11/26/2009US20090289345 Electronic device package and fabrication method thereof
11/26/2009US20090289342 Semiconductor Device and Semiconductor Device Manufacturing Method
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