Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2009
11/19/2009US20090286369 Method of manufacturing a semiconductor device
11/19/2009US20090286368 process for pcm integration with poly-emitter bjt as access device
11/19/2009US20090286367 System and method for the manufacture of semiconductor devices by the implantation of carbon clusters
11/19/2009US20090286366 Formation of standard voltage threshold and low voltage threshold mosfet devices
11/19/2009US20090286365 Modulation of Stress in Stress Film through Ion Implantation and Its Application in Stress Memorization Technique
11/19/2009US20090286364 Methods of low temperature oxidation
11/19/2009US20090286363 Method for making a transistor with metallic source and drain
11/19/2009US20090286362 Method for making thin film transistor
11/19/2009US20090286361 Method for forming pattern, method for manufacturing semiconductor apparatus, and method for manufacturing display
11/19/2009US20090286360 Etchant and method for fabricating electric device including thin film transistor using the same
11/19/2009US20090286359 Optimized lid attach process for thermal management and multi-surface compliant heat removal
11/19/2009US20090286358 Method of fabricating integrated circuits, integrated circuit component mask layout set, and component photomask set
11/19/2009US20090286357 Method of manufacturing a semiconductor structure
11/19/2009US20090286356 Stacked mass storage flash memory package
11/19/2009US20090286355 Flip-chip process by photo-curing adhesive
11/19/2009US20090286354 Semiconductor chip having gettering layer, and method for manufacturing the same
11/19/2009US20090286353 Apparatus and Methods for Packaging Electronic Devices for Optical Testing
11/19/2009US20090286352 Diamond Bodies Grown on SIC Substrates and Associated Methods
11/19/2009US20090286351 Manufacturing method of semiconductor device including active layer of zinc oxide with controlled crystal lattice spacing
11/19/2009US20090286350 Nonvolatile Memory Cell Comprising a Chalcogenide and a Transition Metal Oxide
11/19/2009US20090286349 Solar cell spin-on based process for simultaneous diffusion and passivation
11/19/2009US20090286345 Image sensor and method for fabricating the same
11/19/2009US20090286344 Sensor And Method For Making The Same
11/19/2009US20090286343 Double-Sided Monolithically Integrated Optoelectronic Module with Temperature Compensation
11/19/2009US20090286342 Semiconductor light-emitting device, surface-emission laser diode, and production apparatus thereof, production method, optical module and optical telecommunication system
11/19/2009US20090286341 Pixel circuit substrate, liquid crystal display apparatus, method of manufacturing the same and projection display apparatus
11/19/2009US20090286340 Process for producing a liquid crystal cell substrate having a tft driver element, a liquid crystal cell substrate, and liquid crystal display device
11/19/2009US20090286339 Light emitting diode and method of manufacturing the same
11/19/2009US20090286338 Methods for depositing nanomaterial, methods for fabricating a device, methods for fabricating an array of devices and compositions
11/19/2009US20090286336 Manufacturing method of thin film transistor array substrate and liquid crystal display panel
11/19/2009US20090286335 Methods of fabricating light emitting devices by selective deposition of light conversion materials based on measured emission characteristics
11/19/2009US20090286334 Process for treatment of semiconductor wafer using water vapor containing environment
11/19/2009US20090286333 Etching method and etching apparatus of semiconductor wafer
11/19/2009US20090286332 Polishing method
11/19/2009US20090286331 Method for simulatenously producing multiple wafers during a single epitaxial growth run and semiconductor structure grown thereby
11/19/2009US20090286174 Manufacturing method and manufacturing system of semiconductor device
11/19/2009US20090286172 Surface shape measurement apparatus and exposure apparatus
11/19/2009US20090286171 Lithographic mask and manufacturing method thereof
11/19/2009US20090285998 Plasma processing apparatus, electrode plate for plasma processing apparatus, and electrode plate manufacturing method
11/19/2009US20090285981 Method in the fabrication of a ferroelectric memory device
11/19/2009US20090285665 Substrate processing module exchange unit, vacuum coating installation, method of exchanging a substrate processing module for a vacuum coating installation, and use of a substrate processing module exchange unit
11/19/2009US20090285542 Silica-on-silicon waveguides and related fabrication methods
11/19/2009US20090285082 Electric field read/write head, method of manufacturing the electric field read/write head, and information storage device including the electric field read/write head
11/19/2009US20090285018 Gated Diode Memory Cells
11/19/2009US20090284894 Electrostatic chuck
11/19/2009US20090284893 Electrostatic chuck
11/19/2009US20090284881 Package level esd protection and method therefor
11/19/2009US20090284830 Optical amplifying medium, method of manufacturing the optical amplifying medium, and optical device comprising the optical amplifying medium
11/19/2009US20090284729 Illumination optical apparatus and projection exposure apparatus
11/19/2009US20090284720 Lithographic Apparatus and Device Manufacturing Method
11/19/2009US20090284700 Substrate for display panel, liquid crystal display panel having the substrate, and method of manufacturing the same
11/19/2009US20090284677 Liquid crystal display device and method for fabricating the same
11/19/2009US20090284591 Reticle defect inspection apparatus and reticle defect inspection method
11/19/2009US20090284310 Semiconductor device
11/19/2009US20090284172 Multiple-Cell LED Arrangement, Related Cell and Manufacturing Process
11/19/2009US20090284141 Organic electroluminescence element and manufacturing method thereof
11/19/2009US20090284136 Organic light-emission device
11/19/2009US20090283922 Integrating high stress cap layer in high-k metal gate transistor
11/19/2009US20090283919 Semiconductor package featuring flip-chip die sandwiched between metal layers
11/19/2009US20090283917 Systems and methods for vertical stacked semiconductor devices
11/19/2009US20090283916 Chip structure and method of reworking chip
11/19/2009US20090283914 Silicon interposer and method for manufacturing the same
11/19/2009US20090283913 Semiconductor device and method for fabricating semiconductor device
11/19/2009US20090283910 Semiconductor device and fabrication method thereof
11/19/2009US20090283909 Semiconductor device and manufacturing method thereof
11/19/2009US20090283908 Metal line of semiconductor device and method for forming the same
11/19/2009US20090283907 Low-resistance interconnects and methods of making same
11/19/2009US20090283906 Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device
11/19/2009US20090283903 Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the same
11/19/2009US20090283900 Semiconductor device and manufacturing method for semiconductor device
11/19/2009US20090283898 Disabling electrical connections using pass-through 3d interconnects and associated systems and methods
11/19/2009US20090283897 Semiconductor package, method for manufacturing a semiconductor package, an electronic device, method for manufacturing an electronic device
11/19/2009US20090283896 Package structure and method
11/19/2009US20090283895 Semiconductor device and method for manufacturing the same
11/19/2009US20090283893 Integrated circuit package system with slotted die paddle and method of manufacture thereof
11/19/2009US20090283892 Design method of semiconductor package substrate
11/19/2009US20090283891 Elastically deformable integrated-circuit device
11/19/2009US20090283890 Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package
11/19/2009US20090283889 Integrated circuit package system
11/19/2009US20090283888 Package system incorporating a flip-chip assembly
11/19/2009US20090283884 Lead frame, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor package
11/19/2009US20090283882 Qfn semiconductor package and fabrication method thereof
11/19/2009US20090283881 Semiconductor chip package structure for achieving face-down electrical connection without using a wire-bonding process and method for making the same
11/19/2009US20090283880 Semiconductor Chip Package Assembly with Deflection- Resistant Leadfingers
11/19/2009US20090283879 Semiconductor device and method
11/19/2009US20090283877 Semiconductor device and manufacturing method thereof
11/19/2009US20090283876 Electromagnetic interference shield for semiconductors using a continuous or near-continuous peripheral conducting seal and a conducting lid
11/19/2009US20090283875 Self-supported film and silicon wafer obtained by sintering
11/19/2009US20090283874 Semiconductor device manufacturing method and semiconductor device
11/19/2009US20090283873 Method for forming self-alignment insulation structure
11/19/2009US20090283872 Package structure of three-dimensional stacking dice and method for manufacturing the same
11/19/2009US20090283871 System, Structure, and Method of Manufacturing a Semiconductor Substrate Stack
11/19/2009US20090283870 Semiconductor Device and Method of Conforming Conductive Vias Between Insulating Layers in Saw Streets
11/19/2009US20090283869 Scribe line structure for wafer dicing and method of making the same
11/19/2009US20090283868 Structure Replication Through Ultra Thin Layer Transfer
11/19/2009US20090283867 Integration structure of semiconductor circuit and microprobe sensing elements and method for fabricating the same
11/19/2009US20090283866 Semiconductor Substrate and a Method of Manufacturing the Same
11/19/2009US20090283865 Electrochemical method to make high quality doped crystalline compound semiconductors
11/19/2009US20090283863 Semiconductor device having insulated gate bipolar transistor
11/19/2009US20090283862 Semiconductor device having insulated gate bipolar transistor
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