Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2009
11/19/2009WO2009139828A2 Detection of arcing events in wafer plasma processing through monitoring of trace gas concentrations
11/19/2009WO2009139816A1 Process for treatment of semiconductor wafer using water vapor containing environment
11/19/2009WO2009139793A1 Methods for improving the quality of group iii-nitride materials and structures produced by the methods
11/19/2009WO2009139654A1 METHOD OF MANUFACTURING OF MAGNESIUM DOPED InxAlyGa1-x-yN EPITAXIAL LAYER OF p-TYPE CONDUCTIVITY AND MANUFACTURING OF MULTILAYER SEMICONDUCTOR STRUCTURES COMPRISING SUCH LAYER
11/19/2009WO2009139540A2 Non-contact type of vacuum pad
11/19/2009WO2009139485A1 Film forming method of silicon oxide film, silicon oxide film, semiconductor device, and manufacturing method of semicomductor device
11/19/2009WO2009139483A1 Semiconductor device and display apparatus
11/19/2009WO2009139482A1 Method for controlling threshold voltage of semiconductor element
11/19/2009WO2009139457A1 Semiconductor device
11/19/2009WO2009139448A1 Pattern forming method
11/19/2009WO2009139434A1 Sputtering system for depositing thin film and method for depositing thin film
11/19/2009WO2009139429A1 Nonvolatile semiconductor memory device and manufacturing method thereof
11/19/2009WO2009139428A1 Method for manufacturing semiconductor device or apparatus, and apparatus for manufacturing the same
11/19/2009WO2009139417A1 Semiconductor device and method for manufacturing the same
11/19/2009WO2009139401A1 Polishing pad
11/19/2009WO2009139394A1 Optical inspection device
11/19/2009WO2009139372A1 Inductor element, integrated circuit device, and three-dimensionally packaged circuit device
11/19/2009WO2009139366A1 Substrate
11/19/2009WO2009139357A1 Method for protection of surface of material to be processed, and temporary fixing method
11/19/2009WO2009139335A1 Photosensitive resin composition
11/19/2009WO2009139282A1 Semiconductor device and method for manufacturing semiconductor device
11/19/2009WO2009139264A1 Contact forming method, semiconductor device manufacturing method and semiconductor device
11/19/2009WO2009139204A1 Thin film transistor, optical sensor circuit provided with thin film transistor, and display device
11/19/2009WO2009139190A1 Position detector and substrate overlapping apparatus
11/19/2009WO2009139189A1 Position detecting device, substrate overlapping apparatus, and optical axis aligning method
11/19/2009WO2009139155A1 Defect inspection device and method for inspecting defect
11/19/2009WO2009139153A1 Semiconductor component fabrication method and semiconductor component
11/19/2009WO2009139140A1 Semiconductor element
11/19/2009WO2009139126A1 Pressure-sensitive adhesive sheet, method of processing adherend with the pressure-sensitive adhesive sheet, and apparatus for stripping pressure-sensitive adhesive sheet
11/19/2009WO2009139116A1 Apparatus for vapor-phase growth and a method for the vapor-phase growth of a thin film
11/19/2009WO2009139098A1 Semiconductor device and method for manufacturing the same
11/19/2009WO2009139070A1 Manufacturing method and wafer unit for testing
11/19/2009WO2009139060A1 Process for producing light matrix device and apparatus for producing light matrix device
11/19/2009WO2009139056A1 Method of cleaning object and object cleaning system
11/19/2009WO2009138951A1 Method of fabrication of low value resistors in a semiconductor material
11/19/2009WO2009138739A2 Source controlled sram
11/19/2009WO2009138637A1 Station and method for measuring the contamination of an enclosure used for transporting semiconductor substrates
11/19/2009WO2009138560A1 Circuit module and method of manufacturing the same
11/19/2009WO2009138318A1 Method for the thermal curing and electrical activation of implanted silicon carbide semiconductor
11/19/2009WO2009138185A1 Support for accommodating semiconductor wafers
11/19/2009WO2009138048A1 Contact structure and method for producing a contact structure
11/19/2009WO2009137955A1 A curable composition and use thereof
11/19/2009WO2009137954A1 A curable composition and use thereof
11/19/2009WO2009137940A1 Workpiece breakage prevention method and apparatus
11/19/2009WO2009120727A3 Processes and solutions for substrate cleaning and electroless deposition
11/19/2009WO2009120552A3 Integrated process system and process sequence for production of thin film transistor arrays using doped or compounded metal oxide semiconductor
11/19/2009WO2009117693A8 Method of reclaiming and storing a valuable process gas
11/19/2009WO2009117642A3 Anti-reflection etching of silicon surfaces catalyzed with ionic metal solutions
11/19/2009WO2009117476A3 Method of fabricating a semiconductor package or circuit assembly using a fluxing underfill composition applied to solder contact points in a dip process
11/19/2009WO2009117438A3 Process to make metal oxide thin film transistor array with etch stopping layer
11/19/2009WO2009114675A3 Memory array with a pair of memory-cell strings to a single conductive pillar
11/19/2009WO2009104919A3 Apparatus and method for processing substrate
11/19/2009WO2009104918A3 Apparatus and method for processing substrate
11/19/2009WO2009104917A3 Apparatus and method for processing substrate
11/19/2009WO2009104899A3 Method of etching asymmetric wafer, solar cell including the asymmetrically etched wafer, and method of manufacturing the same
11/19/2009WO2009095474A9 Laser labeling device comprising a feed unit with a conveyor belt that has a low friction coefficient
11/19/2009WO2009092799A3 Object comprising a graphics element transferred onto a support wafer and method of producing such an object
11/19/2009WO2009092506A3 A method of fabricating a composite structure with a stable bonding layer of oxide
11/19/2009WO2009085866A4 Gas transport delay resolution for short etch recipes
11/19/2009WO2009078980A3 Electrode tuning method and apparatus for a layered heater structure
11/19/2009WO2008133593A3 Cleaning process and apparatus
11/19/2009US20090287341 Pre-aligner search
11/19/2009US20090286407 Baking apparatus, baking mehod and method of reducing gap width
11/19/2009US20090286406 Process and apparatus for treating wafers
11/19/2009US20090286405 Shower plate, and plasma processing apparatus, plasma processing method and electronic device manufacturing method using the shower plate
11/19/2009US20090286404 Method of forming minute patterns in semiconductor device using double patterning
11/19/2009US20090286403 Method of forming thin film pattern for semiconductor device and apparatus for the same
11/19/2009US20090286402 Method for critical dimension shrink using conformal pecvd films
11/19/2009US20090286401 Method of fabricating semiconductor device
11/19/2009US20090286400 Plasma process with photoresist mask pretreatment
11/19/2009US20090286399 Substrate Processing Method and Storage Medium
11/19/2009US20090286398 Chemical vapor deposition apparatus, film forming method, and method of manufacturing semiconductor device
11/19/2009US20090286397 Selective inductive double patterning
11/19/2009US20090286396 Method for manufacturing a semiconductor device having a stepped through-hole
11/19/2009US20090286395 Butted Source Contact and Well Strap
11/19/2009US20090286394 Method for Forming Self-Assembled Mono-Layer Liner for Cu/Porous Low-k Interconnections
11/19/2009US20090286393 Method of forming an electronic device using a separation technique
11/19/2009US20090286392 Manufacturing method for semiconductor integrated circuit device
11/19/2009US20090286391 Semiconductor device fabrication method
11/19/2009US20090286390 Method of packaging a semiconductor device and a prefabricated connector
11/19/2009US20090286389 Method of optimizing sidewall spacer size for silicide proximity with in-situ clean
11/19/2009US20090286388 Method of forming micro pattern in semiconductor device
11/19/2009US20090286387 Modulation of Tantalum-Based Electrode Workfunction
11/19/2009US20090286386 Wire structure, method of forming wire, thin film transistor substrate, and method of manufacturing thin film transistor substrate
11/19/2009US20090286385 Methods for removing a photoresist from a metal-comprising material
11/19/2009US20090286384 Dishing-free gap-filling with multiple CMPs
11/19/2009US20090286383 Treatment of whiskers
11/19/2009US20090286382 Low-temperature wafer bonding of semiconductor substrates to metal substrates
11/19/2009US20090286381 Protective Layer To Enable Damage Free Gap Fill
11/19/2009US20090286380 Method for Manufacturing Semiconductor Device
11/19/2009US20090286379 Method of manufacturing imprint substrate and imprinting method
11/19/2009US20090286378 Semiconductor device and method of manufacturing the same
11/19/2009US20090286377 Methods of Forming Integrated Circuit Devices
11/19/2009US20090286376 Manufacturing method of semiconductor device
11/19/2009US20090286375 Method of forming sidewall spacers to reduce formation of recesses in the substrate and increase dopant retention in a semiconductor device
11/19/2009US20090286374 Semiconductor device and method for manufacturing same
11/19/2009US20090286373 Method for fabricating semiconductor devices with shallow diffusion regions
11/19/2009US20090286372 Superjunction trench device formation methods
11/19/2009US20090286371 Formation of a MOSFET Using an Angled Implant
11/19/2009US20090286370 Multi-State Non-Volatile Integrated Circuit Memory Systems that Employ Dielectric Storage Elements
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