Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2009
11/12/2009WO2009117565A3 Method and apparatus of a substrate etching system and process
11/12/2009WO2009117229A3 Coaxial microwave assisted deposition and etch systems
11/12/2009WO2009117173A4 Tunable ground planes in plasma chambers
11/12/2009WO2009114569A3 Cooled cleaving implant
11/12/2009WO2009114120A3 Control of bevel etch film profile using plasma exclusion zone rings larger than the wafer diameter
11/12/2009WO2009112011A3 Method for producing a 3-dimensional molded body comprising polymer-containing material and method for producing an adhesive bond between a polymer-containing material and a 3-dimensional molded body
11/12/2009WO2009111668A3 Use of dopants with different diffusivities for solar cell manufacture
11/12/2009WO2009111121A3 Silsesquioxane resins
11/12/2009WO2009108543A3 Multi-photon exposure system
11/12/2009WO2009105466A3 Reduced leakage current field-effect transistor having asymmetric doping and fabrication method therefor
11/12/2009WO2009105347A3 Process sequence for formation of patterned hard mask film (rfp) without need for photoresist or dry etch
11/12/2009WO2009102762A3 Ion source cleaning in semiconductor processing systems
11/12/2009WO2009102499A3 Isolated cmos and bipolar transistors, isolation structures therefor and methods of fabricating the same
11/12/2009WO2009086027A4 Systems and methods for calibrating end effector alignment in a plasma processing system
11/12/2009WO2009048080A9 Heating device
11/12/2009US20090282213 Semiconductor integrated circuit
11/12/2009US20090281755 Recipe parameter management system and recipe parameter management method
11/12/2009US20090281653 Method for forming a back-to-back wafer batch to be positioned in a process boot, and handling system for forming the btb wafer batch
11/12/2009US20090281344 semiconductors; low dielectric thin films; chemical vapor deposition
11/12/2009US20090280723 Interpenetrating polymer network structure and polishing pad, and process for producing the same
11/12/2009US20090280654 Method of forming a silicon nitride layer on a gate oxide film of a semiconductor device and annealing the nitride layer
11/12/2009US20090280653 Method for forming low dielectric constant fluorine-doped layers
11/12/2009US20090280652 Production method for semiconductor device and substrate processing apparatus
11/12/2009US20090280651 Dry etching method
11/12/2009US20090280650 Flowable dielectric equipment and processes
11/12/2009US20090280649 Topography reduction and control by selective accelerator removal
11/12/2009US20090280648 Method and apparatus for 3d interconnect
11/12/2009US20090280647 Semiconductor through-electrode forming method
11/12/2009US20090280646 Manufacturing method for micro-transformers
11/12/2009US20090280645 Method of fabricating semiconductor device
11/12/2009US20090280644 Process for Producing Air Gaps in Microstructures, Especially of the Air Gap Interconnect Structure Type for Integrated Circuits
11/12/2009US20090280643 Optimal tungsten through wafer via and process of fabricating same
11/12/2009US20090280642 Semiconductor device having multiple wiring layers and method of producing the same
11/12/2009US20090280641 Method of forming a contact structure
11/12/2009US20090280640 Deposition and densification process for titanium nitride barrier layers
11/12/2009US20090280639 Atomic Layer Deposition Methods
11/12/2009US20090280638 Process for Producing Air Gaps in Microstructures, Especially of the Air Gap Interconnect Structure Type for Integrated Circuits
11/12/2009US20090280637 Method of manufacturing semiconductor device including ultra low dielectric constant layer
11/12/2009US20090280636 Methods of fabricating interconnect structures containing various capping materials for electrical fuse and other related applications
11/12/2009US20090280635 Method of forming an electronic device using a separation-enhancing species
11/12/2009US20090280634 Semiconductor device and method of manufacturing semiconductor device
11/12/2009US20090280633 Method of forming self-aligned contacts and local interconnects
11/12/2009US20090280632 MOSFETS Having Stacked Metal Gate Electrodes and Method
11/12/2009US20090280631 Electroless Metal Deposition For Dual Work Function
11/12/2009US20090280630 Method for making very low Vt metal-gate/high-k CMOSFETs using self-aligned low temperature shallow junctions
11/12/2009US20090280629 Integrated circuit system employing grain size enlargement
11/12/2009US20090280628 Plasma immersion ion implantation process with chamber seasoning and seasoning layer plasma discharging for wafer dechucking
11/12/2009US20090280627 Method of forming stepped recesses for embedded strain elements in a semiconductor device
11/12/2009US20090280626 Finfet structure with multiply stressed gate electrode
11/12/2009US20090280625 Method for separating semiconductor layer from substrate
11/12/2009US20090280624 Precursors for Formation of Copper Selenide, Indium Selenide, Copper Indium Diselenide, and/or Copper Indium Gallium Diselenide Films
11/12/2009US20090280623 Method Of Producing Semiconductor Wafer
11/12/2009US20090280622 Fabrication method for device having die attach film on the back side thereof
11/12/2009US20090280621 Method Of Producing Bonded Wafer
11/12/2009US20090280620 Method for Producing Soi Wafer
11/12/2009US20090280619 Method for fabricating semiconductor device having conductive liner for rad hard total dose immunity
11/12/2009US20090280618 Method of Planarizing a Semiconductor Device
11/12/2009US20090280617 Fabricating process for substrate with embedded passive component
11/12/2009US20090280616 Integrated transistor, particularly for voltages and method for the production thereof
11/12/2009US20090280615 Method of forming a conductive structure in a semiconductor device and method of manufacturing a semiconductor device
11/12/2009US20090280614 Method of making a P-type metal-oxide semiconductor transistor and method of making a complementary metal-oxide semiconductor transistor
11/12/2009US20090280613 Method of manufacturing semiconductor device
11/12/2009US20090280612 Semiconductor device and production method thereof
11/12/2009US20090280611 Non-volatile memory semiconductor device having an oxide-nitride-oxide (ono) top dielectric layer
11/12/2009US20090280610 Method of manufacturing semiconductor device
11/12/2009US20090280609 Method of making silicon carbide semiconductor device
11/12/2009US20090280608 Cmos device with metal and silicide gate electrodes and a method for making it
11/12/2009US20090280607 Methods of fabricating a device structure for use as a memory cell in a non-volatile random access memory
11/12/2009US20090280606 Method for fabricating photo sensor
11/12/2009US20090280605 Method of forming semiconductor device having stacked transistors
11/12/2009US20090280604 Heat radiation structure of semiconductor device, and manufacturing method thereof
11/12/2009US20090280603 Method of fabricating chip package
11/12/2009US20090280602 Double wafer carrier process for creating integrated circuit die with through-silicon vias and micro-electro-mechanical systems protected by a hermetic cavity created at the wafer level
11/12/2009US20090280601 Method and apparatus for facilitating proximity communication and power delivery
11/12/2009US20090280600 Amorphous oxide and thin film transistor
11/12/2009US20090280599 Phase change memory device and method of fabrication
11/12/2009US20090280598 Formation of Copper-Indium-Selenide and/or Copper-Indium-Gallium-Selenide Films from Indium Selenide and Copper Selenide Precursors
11/12/2009US20090280597 Surface cleaning and texturing process for crystalline solar cells
11/12/2009US20090280595 Process for assembling wafers by means of molecular adhesion
11/12/2009US20090280594 Three-axis accelerometers and fabrication methods
11/12/2009US20090280591 Method of manufacturing a display substrate and method of manufacturing a display apparatus using the same
11/12/2009US20090280590 Organic light emitting device and method of fabricating the same
11/12/2009US20090280588 Method of forming an electronic device including removing a differential etch layer
11/12/2009US20090280586 Methods for depositing nanomaterial, methods for fabricating a device, and methods for fabricating an array of devices
11/12/2009US20090280585 High-density field emission elements and a method for forming said emission elements
11/12/2009US20090280584 Wafer processing
11/12/2009US20090280583 Method of fabricating semiconductor device
11/12/2009US20090280582 Design Methodology for MuGFET ESD Protection Devices
11/12/2009US20090280581 Detection of arcing events in wafer plasma processing through monitoring of trace gas concentrations
11/12/2009US20090280580 Cmp pad thickness and profile monitoring system
11/12/2009US20090280579 Method of controlling embedded material/gate proximity
11/12/2009US20090280578 Ferroelectric memory device and fabrication process thereof, fabrication process of a semiconductor device
11/12/2009US20090280577 Manufacturing method of a semiconductor device
11/12/2009US20090280415 Transparent substrate for mask blank and mask blank
11/12/2009US20090280336 Semiconductor sheets and methods of fabricating the same
11/12/2009US20090280276 Method and Device for Plasma-Assisted Chemical Vapour Deposition on the Inner Wall of a Hollow Body
11/12/2009US20090280040 Plasma reactor
11/12/2009US20090280001 Unit and method for transferring substrates and apparatus and method for treating substrates with the unit
11/12/2009US20090279998 Vibration isolator for container and the like, and method of using the same
11/12/2009US20090279995 Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method
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