Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2009
11/25/2009EP2124249A1 Surface-hydrophobicized film, material for formation of surface-hydrophobicized film, wiring layer, semiconductor device and process for producing semiconductor device
11/25/2009EP2124037A1 Method and apparatus for evaluating film quality and thin film device manufacturing system
11/25/2009EP2123802A1 N-type conductive aluminum nitride semiconductor crystal and method for producing the same
11/25/2009EP2123801A1 Method and equipment for producing group-iii nitride
11/25/2009EP2123790A1 Deep-pot-shaped copper sputtering target and process for producing the same
11/25/2009EP2123726A1 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and chemical mechanical polishing aqueous dispersion preparation kit
11/25/2009EP2123658A1 Material for forming silicon-containing film, and silicon-containing insulating film and method for forming the same
11/25/2009EP2123615A1 Ceramic member and corrosion-resistant member
11/25/2009EP2123581A1 Vacuum device and method of conveying substrate
11/25/2009EP2123572A1 Damping body for packaging and package body
11/25/2009EP2123400A1 Polishing pad and process for production of polishing pad
11/25/2009EP2123126A2 Optical electrical system in package for led based lighting systems
11/25/2009EP2122683A1 Semiconductor device and method of manufacture
11/25/2009EP2122679A1 Performance enhancement on both nmosfet and pmosfet using self-aligned dual stressed films
11/25/2009EP2122678A1 Formation of a reliable diffusion-barrier cap on a cu-containing interconnect element having grains with different crystal orientations
11/25/2009EP2122677A1 Trench formation in a semiconductor material
11/25/2009EP2122676A1 Method and device for separation of silicon wafers
11/25/2009EP2122675A1 Bowed wafer hybridization compensation
11/25/2009EP2122674A1 Underfill anchor structure for an integrated circuit
11/25/2009EP2122673A1 Ex-situ doped semiconductor transport layer
11/25/2009EP2122671A1 Semiconductor arrangement with trench capacitor and method for production thereof
11/25/2009EP2122670A2 Method of separating semiconductor dies
11/25/2009EP2122669A1 Radio frequency isolation for soi transistors
11/25/2009EP2122667A2 Low-temperature formation of layers of polycrystalline semiconductor material
11/25/2009EP2122655A2 High throughput sem tool
11/25/2009EP2122631A1 High speed otp sensing scheme
11/25/2009EP2122630A1 Mask programmable anti-fuse architecture
11/25/2009EP2122517A1 Moment-based method and system for evaluation of the reliability of a metal layer in an integrated circuit
11/25/2009EP2122050A2 Treatment of micropores in mica materials
11/25/2009EP2121857A1 Silicone coating composition
11/25/2009EP2121808A1 Silicon-based antifrelective coating compositions
11/25/2009EP2121514A2 Methods using block copolymer self-assembly for sub-lithographic patterning
11/25/2009EP1697994B1 Transistor gate electrode having conductor material layer and method of fabrication
11/25/2009EP1352421B1 Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnection structures
11/25/2009EP1346003B1 Cerium-based abrasive, production process thereof
11/25/2009EP1118104B2 Assembly device
11/25/2009EP1074047B1 Method for fabricating an electrically addressable silicon-on-sapphire light valve
11/25/2009EP1035183B1 Coating fluid for forming low-permittivity silica-based coating film and substrate with low-permittivity coating film
11/25/2009EP0941552B1 Semiconductor device with memory capacitor and method of manufacturing such a device
11/25/2009CN201352563Y Solar glass substrate processing device
11/25/2009CN201352552Y Advanced FI blade for high-temperature fetching
11/25/2009CN201352551Y Silver paste jet apparatus used in semiconductor package engineering
11/25/2009CN201352541Y Plasma treatment system
11/25/2009CN201352302Y Photomask box
11/25/2009CN101589659A Electronic component handler having gap set device
11/25/2009CN101589658A Wo2008091717
11/25/2009CN101589479A Light-emitting device and method for manufacturing the same
11/25/2009CN101589473A Nanowire-based transparent conductors and applications thereof
11/25/2009CN101589471A Semiconductor device and method of forming a semiconductor device
11/25/2009CN101589466A Electronic component
11/25/2009CN101589465A Board on chip package and process for making same
11/25/2009CN101589464A Wafer level CSP packaging concept
11/25/2009CN101589463A Method for fabricating semiconductor device
11/25/2009CN101589462A Wafer-level interconnect for high mechanical reliability applications
11/25/2009CN101589461A Electron blocking layers for electronic devices
11/25/2009CN101589460A Mobility enhancement in SiGe heterojunction bipolar transistors
11/25/2009CN101589459A Uv curing of pecvd-deposited sacrificial polymer films for air-gap ild
11/25/2009CN101589458A Bevel etcher with gap control
11/25/2009CN101589457A Configurable bevel etcher
11/25/2009CN101589456A Bevel etcher with vacuum chuck
11/25/2009CN101589455A Extending lifetime of yttrium oxide as a plasma chamber material
11/25/2009CN101589454A Plastic electronic component package
11/25/2009CN101589453A Device and method for wet treating plate-like-articles
11/25/2009CN101589452A Magnetic tunnel junction temperature sensors and methods
11/25/2009CN101589449A Technique for improving the performance and extending the lifetime of an ion source with gas dilution
11/25/2009CN101589175A Processing chamber with heated chamber liner
11/25/2009CN101589172A High strip rate downstream chamber
11/25/2009CN101588906A Multicolor molded item, method of multicolor molding and substrate accommodation container
11/25/2009CN101587968A Lithium secondary battery and method of manufacturing same
11/25/2009CN101587939A Organic thin film transistor and method for manufacturing same, pixel structure and method for manufacturing same and display panel
11/25/2009CN101587926A LED conducting bracket and combination method thereof
11/25/2009CN101587925A Packaging structure of luminous element and manufacturing method thereof
11/25/2009CN101587923A Method for using screen plate for packaging and molding light emitting diode (LED)
11/25/2009CN101587911A Semiconductor device and method of manufacturing the same
11/25/2009CN101587909A Lateral double-diffused metallic oxide metallic oxide of silicon on P-type insulator
11/25/2009CN101587907A Low junction capacitance overvoltage protection thyristor apparatus chip and production method thereof
11/25/2009CN101587905A Phase change nanometer transistor unit device and manufacturing method thereof
11/25/2009CN101587903A Electronic element packaging body and manufacturing method thereof
11/25/2009CN101587902A Silicon-on-nanometer-insulator material and preparing method thereof
11/25/2009CN101587901A Flat panel display driver chip of silicon materials on insulator and method for preparing the same
11/25/2009CN101587900A Flexible display device and manufacturing method thereof
11/25/2009CN101587899A Charge trap-type non-volatile memory device and method of fabricating the same
11/25/2009CN101587898A A semiconductor structure with an integrated circuit component and formation and operation method thereof
11/25/2009CN101587897A Memory assembly and method for fabricating same
11/25/2009CN101587896A Semiconductor device and method of fabricating the same
11/25/2009CN101587895A Gate pole sensitive triggering unidirectional thyristor chip and preparation method thereof
11/25/2009CN101587894A Electrostatic discharge (esd) protection applying high voltage lightly doped drain (ldd) cmos technologies
11/25/2009CN101587892A Semiconductor device and method of fabricating the same
11/25/2009CN101587891A Semiconductor memory device and method for forming capacitor thereof
11/25/2009CN101587888A Semiconductor device and process for manufacturing the same
11/25/2009CN101587886A Electronic device package and fabrication method thereof
11/25/2009CN101587885A Semiconductor device, semiconductor device module, and method for manufacturing the semiconductor device module
11/25/2009CN101587884A Stacked chip packaging structure and manufacturing method thereof
11/25/2009CN101587883A Chip packaging structure of light emitting diode using substrate as lamp cover and manufacturing method thereof
11/25/2009CN101587880A Wired circuit board and producing method thereof
11/25/2009CN101587877A Structure and manufacturing method of packaged base plate
11/25/2009CN101587875A Vertically electrically connected three-dimensional stacked chip packaging structure and manufacturing method thereof
11/25/2009CN101587873A Dielectric layer structure for reducing stress and manufacturing method thereof
11/25/2009CN101587872A Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device
11/25/2009CN101587871A Electronic device and method of manufacturing the same
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