Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2009
11/19/2009DE102004023193B4 Transistoranordnung und Herstellungsverfahren derselben Transistor device and manufacturing method thereof
11/19/2009DE102004005506B4 Verfahren zur Erzeugung von aktiven Halbleiterschichten verschiedener Dicke in einem SOI-Wafer A process for the generation of active semiconductor layers of different thickness in a SOI wafer
11/19/2009CA2724228A1 In-line effluent analysis method and apparatus for cmp process control
11/18/2009EP2120264A2 Method of manufacturing solid-state imaging device and method of manufacturing electronic apparatus
11/18/2009EP2120259A1 Ball-bump bonded ribbon-wire interconnect
11/18/2009EP2120258A1 Method for manufacturing a transistor with metal source and drain
11/18/2009EP2120257A1 Method for manufacturing semiconductor element
11/18/2009EP2120097A1 Position measuring module, position measuring apparatus, stage apparatus, exposure apparatus and device manufacturing method
11/18/2009EP2120095A1 Resist lower layer film forming composition for electron lithography
11/18/2009EP2119815A1 Method for producing self-supporting nitride semiconductor substrate and self-supporting nitride semiconductor substrate
11/18/2009EP2119810A2 Magnetron sputtering source
11/18/2009EP2119806A1 Multilayer film forming method and multilayer film forming apparatus
11/18/2009EP2119526A1 Method of and apparatus for removal of surface oxides by electron attachment using two groups of electrodes electrically connected to opposed sources
11/18/2009EP2119518A1 Silver fine powder, method for producing the same, and ink
11/18/2009EP2118933A1 Semiconductor device and method of forming a semiconductor device
11/18/2009EP2118928A1 Semiconductor constructions, methods of forming multiple lines, and methods of forming high density structures and low density structures with a single photomask
11/18/2009EP2118927A2 Method for applying a structure to a semiconductor element
11/18/2009EP2118926A2 Passivation layer for a circuit device and method of manufacture
11/18/2009EP2118925A2 Technique for patterning differently stressed layers formed above transistors by enhanced etch control strategies
11/18/2009EP2118924A1 Plated pillar package formation
11/18/2009EP2118923A1 Method for polishing heterostructures
11/18/2009EP2118922A1 A method for processing elongate substrates and a substrate securing apparatus
11/18/2009EP2118921A1 Production of semiconductor devices
11/18/2009EP2118920A1 Plasma spraying of semiconductor grade silicon
11/18/2009EP2118227A1 Method of polishing a tungsten-containing substrate
11/18/2009EP2118204A1 Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof
11/18/2009EP2118175A2 Curable liquid composition, method of coating, inorganic substrate, and semiconductor device
11/18/2009EP1915435B1 Low dielectric constant silicon coating, method for the preparation and application thereof to integrated circuits
11/18/2009EP1771491B1 Photosensitive compositions based on polycyclic polymers
11/18/2009EP1704588B1 A method for forming rectangular-shape spacers for semiconductor devices
11/18/2009EP1590832B1 Storage cell, storage cell arrangement, and method for the production of a storage cell
11/18/2009EP1585169B1 Exposure system and exposure method
11/18/2009EP1495496B1 Non-volatile, programmable, electrically erasable memory semiconductor device having a single grid material layer and corresponding magnetic core plane
11/18/2009EP1292022B1 Saw device and method of manufacture thereof
11/18/2009CN201349366Y Liquid removing device of base plate horizontal wet process
11/18/2009CN201349025Y Feed system for LED solid crystal machine or welding wire machine
11/18/2009CN201349019Y LED support conveying device
11/18/2009CN201348993Y Wafer temporary storage device
11/18/2009CN201348992Y Ultrasonic welding device of thick membrane integrated circuit
11/18/2009CN201348991Y Encapsulation mold of a light-emitting diode
11/18/2009CN201348990Y Gasket cooling controlling device for wafer heating cavity
11/18/2009CN201348989Y Metal microsphere formation device
11/18/2009CN201348988Y Semiconductor silicon wafer cleaner
11/18/2009CN201346740Y Wafer grinding positioning ring
11/18/2009CN201346542Y Brush mechanism for TMTT printing
11/18/2009CN101584048A Trench gate type transistor and method for manufacturing the same
11/18/2009CN101584046A Image sensor using thin-film SOI
11/18/2009CN101584043A A metallization layer stack without a terminal aluminum metal layer
11/18/2009CN101584039A Performance enhancement on both NMOSFET and PMOSFET using self-aligned dual stressed films
11/18/2009CN101584038A Method of forming a semiconductor structure comprising a field effect transistor having a stressed channel region
11/18/2009CN101584037A Semiconductor structure with interconnect comprising silver and method of forming the same
11/18/2009CN101584036A Table structure, and processing apparatus
11/18/2009CN101584035A Substrate processing apparatus and substrate processing method
11/18/2009CN101584034A Substrate carrying method
11/18/2009CN101584033A Microelectronic assemblies having compliancy and methods therefor
11/18/2009CN101584032A Equipment and method for mounting electronic component
11/18/2009CN101584031A Methods and apparatus for wafer edge processing
11/18/2009CN101584030A Multilayer silicon nitride deposition for a semiconductor device
11/18/2009CN101584029A Semiconductor device and process for manufacturing the same
11/18/2009CN101584028A Method of manufacturing a semiconductor device, semiconductor device obtained herewith, and slurry suitable for use in such a method
11/18/2009CN101584027A Line end shortening reduction during etch
11/18/2009CN101584026A Apparatuses for adjusting electrode gap in capacitively-coupled RF plasma reactor
11/18/2009CN101584025A Method of producing highly strained PECVD silicon nitride thin films at low temperature
11/18/2009CN101584024A Multilayer structure and its fabrication process
11/18/2009CN101583860A Optical device inspecting apparatus
11/18/2009CN101583840A TCP handling device, and method for positional alignment of connecting terminals in the device
11/18/2009CN101583745A Process for production of GaN crystals, GaN crystals, GaN crystal substrate, semiconductor devices, and apparatus for production of GaN crystals
11/18/2009CN101583735A Multilayer film forming method and multilayer film forming apparatus
11/18/2009CN101583562A A cold-walled vessel process for compounding, homogenizing and consolidating semiconductor compounds
11/18/2009CN101583545A Damping body for packaging and package body
11/18/2009CN101583464A Polishing pad and method for producing the same
11/18/2009CN101583449A Silver fine powder, method for producing the same, and ink
11/18/2009CN101583439A Method for cleaning a surface
11/18/2009CN101583234A Inductive couple plasma processing device
11/18/2009CN101582489A Compound encapsulation structure and method of organic electroluminescence device
11/18/2009CN101582481A Nitride-based light-emitting device and method of manufacturing the same
11/18/2009CN101582478A Multi-quantum-well structure used in photoelectron device and manufacturing method thereof
11/18/2009CN101582471A LED seat stripping mechanism
11/18/2009CN101582470A Method for preparing single crystal silicon film components
11/18/2009CN101582456A Fast-recovery commutation diode used for high frequency electroplating and production method thereof
11/18/2009CN101582455A Avalanche commutation diode special for 16000A/200-400V welding machine and preparation method thereof
11/18/2009CN101582454A Double bit U-shaped memory structure and manufacturing method thereof
11/18/2009CN101582453A Transistor, semiconductor device and method of manufacturing the same
11/18/2009CN101582452A Thin film transistor, method for manufacturing the same and display device using the same
11/18/2009CN101582439A Organic light emitting display and method for making the same
11/18/2009CN101582435A Packaging structure for image sensing wafer and camera module applying same
11/18/2009CN101582434A Image sensor packaging structure, manufacturing method thereof and camera module
11/18/2009CN101582431A Thin film transistor (TFT) array substrate and manufacture method thereof
11/18/2009CN101582430A Array substrate and fabricating method thereof
11/18/2009CN101582429A Flash memory and making method thereof
11/18/2009CN101582428A Nonvolatile semiconductor memory cell with electron-trapping erase state and method for operating the same
11/18/2009CN101582427A Semiconductor device
11/18/2009CN101582426A Capless DRAM unit and preparation method thereof
11/18/2009CN101582424A Top-grate structure thin film transistor and manufacturing method thereof
11/18/2009CN101582423A Pixel structure and making method thereof
11/18/2009CN101582416A Electronic element wafer module and method for manufacturing the same
11/18/2009CN101582415A Semiconductor device
11/18/2009CN101582411A Semiconductor device and method for manufacturing the same
11/18/2009CN101582408A Semiconductor device and method for manufacturing the same
11/18/2009CN101582407A System, structure and method of manufacturing semiconductor substrate stack
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