Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2009
11/17/2009US7618873 MOS varactors with large tuning range
11/17/2009US7618872 Semiconductor device structures for bipolar junction transistors and methods of fabricating such structures
11/17/2009US7618871 Method for the production of a bipolar transistor comprising an improved base terminal
11/17/2009US7618870 Non-uniformly doped high voltage drain-extended transistor and method of manufacture thereof
11/17/2009US7618869 Manufacturing method for increasing product yield of memory devices suffering from source/drain junction leakage
11/17/2009US7618868 Method of manufacturing field effect transistors using sacrificial blocking layers
11/17/2009US7618867 Method of forming a doped portion of a semiconductor and method of forming a transistor
11/17/2009US7618866 Structure and method to form multilayer embedded stressors
11/17/2009US7618865 Method in the fabrication of a monolithically integrated vertical device on an SOI substrate
11/17/2009US7618864 Nonvolatile memory device and methods of forming the same
11/17/2009US7618862 Flash memory device and method for manufacturing the same
11/17/2009US7618861 Method of manufacturing non-volatile memory device using multiple element isolation regions and perpendicular extensive device regions
11/17/2009US7618860 Method for fabricating semiconductor device
11/17/2009US7618859 Thin film capacitor and fabrication method thereof
11/17/2009US7618858 Method of fabricating a heterojunction bipolar transistor
11/17/2009US7618857 Method of reducing detrimental STI-induced stress in MOSFET channels
11/17/2009US7618856 Method for fabricating strained-silicon CMOS transistors
11/17/2009US7618855 Manufacturing method of semiconductor device
11/17/2009US7618854 High frequency MOS transistor, method of forming the same, and method of manufacturing a semiconductor device including the same
11/17/2009US7618853 Field effect transistors with dielectric source drain halo regions and reduced miller capacitance
11/17/2009US7618852 Phase transition method of amorphous material using cap layer
11/17/2009US7618851 Method for the production of a semiconductor component having a metallic gate electrode disposed in a double-recess structure
11/17/2009US7618850 Method of making a diode read/write memory cell in a programmed state
11/17/2009US7618848 Integrated circuit package system with supported stacked die
11/17/2009US7618847 Bonding method of semiconductor and laminated structure fabricated thereby
11/17/2009US7618846 Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device
11/17/2009US7618845 Fabrication of an integrated circuit package
11/17/2009US7618844 Method of packaging and interconnection of integrated circuits
11/17/2009US7618843 stacking and firing; dimensional stability without delamination and warp; insulations, dielectrics, magnetism, piezoelectric; resistor thick films; semiconductor devices such as communication modules, vehicle modules
11/17/2009US7618842 Method of applying encapsulant to wire bonds
11/17/2009US7618841 Hydrazine-free solution deposition of chalcogenide films
11/17/2009US7618840 Sublithographic contact structure, in particular for a phase change memory cell, and fabrication process thereof
11/17/2009US7618839 Pinned photodiode structure and method of formation
11/17/2009US7618837 Method for fabricating high aspect ratio MEMS device with integrated circuit on the same substrate using post-CMOS process
11/17/2009US7618836 Method for manufacturing semiconductor optical device
11/17/2009US7618835 Fabricating a spatial light modulator
11/17/2009US7618834 Method of manufacturing image sensor
11/17/2009US7618833 Method for pre-treating epitaxial layer, method for evaluating epitaxial layer, and apparatus for evaluating epitaxial layer
11/17/2009US7618832 Semiconductor substrate having reference semiconductor chip and method of assembling semiconductor chip using the same
11/17/2009US7618831 Method of monitoring the manufacture of interferometric modulators
11/17/2009US7618830 Rapid thermal processing apparatus and methods
11/17/2009US7618767 Illuminant distribution evaluation method, optical member manufacturing method, illumination optical device, exposure apparatus, and exposure method
11/17/2009US7618754 Multilayer; radiation transparent substrate; shielded zones; exposure to light
11/17/2009US7618753 Photoresists; etching; semiconductor integrated circuit, charge-coupled device, color fiter, liquid crystal display device, magnetic head
11/17/2009US7618713 Circuit-connecting material and circuit terminal connected structure and connecting method
11/17/2009US7618681 Producing bismuth-containing ferroelectric or superconducting films by the Atomic Layer Deposition where a silylamido ligand is used as a source material for the bismuth; e.g. tris(bis(trimethylsilyl)amido)bismuth(III)
11/17/2009US7618575 Method for wafer scale molding of protective caps
11/17/2009US7618573 Resin sealing method for electronic part and mold used for the method
11/17/2009US7618548 Silicon-containing structure with deep etched features, and method of manufacture
11/17/2009US7618529 Thin cellular polymeric layer overlying a conductive substrate; improved electrical and thermal capabilities and control
11/17/2009US7618528 Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
11/17/2009US7618525 Method for electrochemical fabrication
11/17/2009US7618516 Method and apparatus to confine plasma and to enhance flow conductance
11/17/2009US7618510 Imprinting polymer film on patterned substrate
11/17/2009US7618494 Substrate holding structure and substrate processing device
11/17/2009US7618281 Interconnect assemblies and methods
11/17/2009US7618203 Substrate processing method, substrate processing apparatus, and computer readable storage medium
11/17/2009US7618074 Handling apparatus for passing electronic components, in particular ICs, to a testing apparatus
11/17/2009US7617966 Semiconductor device
11/17/2009US7617593 Micromachine and method of fabricating the same
11/17/2009CA2462940C Semiconductor device and fabricating method thereof
11/12/2009WO2009137773A2 Apparatus and methods for hyperbaric rapid thermal processing
11/12/2009WO2009137768A2 Oxygen and carbon dioxide sensing
11/12/2009WO2009137764A2 Cmp pad thickness and profile monitoring system
11/12/2009WO2009137685A2 Configuring of lapping and polishing machines
11/12/2009WO2009137610A2 Method of forming an electronic device including removing a differential etch layer
11/12/2009WO2009137604A2 Method of forming an electronic device using a separation-enhancing species
11/12/2009WO2009137578A2 Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making
11/12/2009WO2009137542A2 New method and loader apparatus for tem machine work chamber device
11/12/2009WO2009137447A2 Debris-extraction exhaust system
11/12/2009WO2009137405A2 Plasma reactor electrostatic chuck having a coaxial rf feed and multizone ac heater power transmission through the coaxial feed
11/12/2009WO2009137395A2 Slit valve having increased flow uniformity
11/12/2009WO2009137313A1 Through substrate via including variable sidewall profile
11/12/2009WO2009137279A2 Dynamic alignment of wafers using compensation values obtained through a series of wafer movements
11/12/2009WO2009137272A2 Flowable dielectric equipment and processes
11/12/2009WO2009137241A2 Process for fabricating nanowire arrays
11/12/2009WO2009137210A2 Methods of forming isolated active areas, trenches, and conductive lines in semiconductor structures and semiconductor structures including the same
11/12/2009WO2009137199A2 Boron nitride and boron-nitride derived materials deposition method
11/12/2009WO2009137174A1 Methods and systems for dynamically generating tailored laser pulses
11/12/2009WO2009137032A2 Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation
11/12/2009WO2009136873A2 Wafer level integration module with interconnects
11/12/2009WO2009136771A2 Ferroelectric material and a ferroelectric layer formation method using the same
11/12/2009WO2009136725A2 Super-resolution digital lithography
11/12/2009WO2009136718A2 Semiconductor element and a production method therefor
11/12/2009WO2009136688A1 Semiconductor apparatus, semiconductor fabricating method and semiconductor device isolation apparatus using the same
11/12/2009WO2009136615A1 Non-volatile semiconductor memory device
11/12/2009WO2009136606A1 Semiconductor device manufacturing method
11/12/2009WO2009136567A1 Article conveying robot device
11/12/2009WO2009136564A1 Reflective mask, reflective mask blank and method for manufacturing reflective mask
11/12/2009WO2009136558A1 Silicon etchant and etching method
11/12/2009WO2009136492A1 Jig for aligning leadframe
11/12/2009WO2009136468A1 Semiconductor device and method for manufacturing the same
11/12/2009WO2009136454A1 Spin valve element and storage device
11/12/2009WO2009136450A1 Semiconductor die pickup device and pickup metho
11/12/2009WO2009136441A1 Electron beam lithography system and method for electron beam lithography
11/12/2009WO2009136095A2 Method for making complementary p and n mosfet transistors, electronic device including such transistors, and processor including at least one such device
11/12/2009WO2009135800A2 A method of assembling wafers by molecular bonding
11/12/2009WO2009135780A1 Layered structures comprising silicon carbide layers, a process for their manufacture and their use
11/12/2009WO2009135737A1 Electrical bond connection arrangement
11/12/2009WO2009135576A1 Component for setting a scan-integrated illumination energy in an object plane of a microlithography projection exposure apparatus
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