Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2009
12/03/2009US20090294987 Semiconductor device and manufacturing method thereof
12/03/2009US20090294986 Methods of Forming Conductive Features and Structures Thereof
12/03/2009US20090294985 Thin chip scale semiconductor package
12/03/2009US20090294984 Three-dimensional integrated heterogeneous semiconductor structure
12/03/2009US20090294983 Hybrid conductive vias including small dimension active surface ends and larger dimension back side ends, semiconductor devices including the same, and associated methods
12/03/2009US20090294979 Semiconductor substrate and method of manufacturing the same
12/03/2009US20090294978 Semiconductor device, and manufacturing method therefor
12/03/2009US20090294977 Semiconductor die and bond pad arrangement method thereof
12/03/2009US20090294976 Method of Manufacuturing Semiconductor Memory Apparatus and Semiconductor Memory Apparatus Manufactured Thereby
12/03/2009US20090294974 Bonding method for through-silicon-via based 3d wafer stacking
12/03/2009US20090294973 Interconnect structure for integrated circuits having improved electromigration characteristics
12/03/2009US20090294972 Substrate for semiconductor package, method for manufacturing the same, and semiconductor package having the same
12/03/2009US20090294971 Electroless nickel leveling of lga pad sites for high performance organic lga
12/03/2009US20090294967 Diodes, And Methods Of Forming Diodes
12/03/2009US20090294965 Method of Manufacturing A Semiconductor Device
12/03/2009US20090294964 Electrically-conductive inorganic coating, method for producing the coating, circuit board, and semiconductor apparatus
12/03/2009US20090294963 Module including a sintered joint
12/03/2009US20090294962 Packaging substrate and method for fabricating the same
12/03/2009US20090294961 Semiconductor device
12/03/2009US20090294958 Wafer level redistribution using circuit printing technology
12/03/2009US20090294957 Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package
12/03/2009US20090294956 Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof
12/03/2009US20090294954 3-D ICs WITH MICROFLUIDIC INTERCONNECTS AND METHODS OF CONSTRUCTING SAME
12/03/2009US20090294953 Integrated circuit package module and method of the same
12/03/2009US20090294952 Chip package carrier and fabrication method thereof
12/03/2009US20090294951 Semiconductor device and method for manufacturing the same
12/03/2009US20090294950 Semiconductor device
12/03/2009US20090294949 Molded semiconductor device
12/03/2009US20090294947 Chip package structure and manufacturing method thereof
12/03/2009US20090294945 Semiconductor device and manufacturing method therefor
12/03/2009US20090294944 Semiconductor device assembly and method thereof
12/03/2009US20090294941 Package-on-package system with heat spreader
12/03/2009US20090294939 Lead frame and semiconductor device utilizing the same
12/03/2009US20090294936 Four mosfet full bridge module
12/03/2009US20090294935 Semiconductor package system with cut multiple lead pads
12/03/2009US20090294934 Conductive clip for semiconductor device package
12/03/2009US20090294933 Lead Frame and Chip Package Structure and Method for Fabricating the Same
12/03/2009US20090294931 Methods of Making an Electronic Component Package and Semiconductor Chip Packages
12/03/2009US20090294930 Semiconductor packages having electromagnetic interference-shielding function, manufacturing method thereof and jig
12/03/2009US20090294928 Semiconductor Device and Method of Forming Holes In Substrate to Interconnect Top Shield and Ground Shield
12/03/2009US20090294927 Semiconductor-device isolation structure and manufacturing method thereby
12/03/2009US20090294924 Hafnium lanthanide oxynitride films
12/03/2009US20090294922 Organic silicon oxide fine particle and preparation method thereof, porous film-forming composition, porous film and formation method thereof, and semiconductor device
12/03/2009US20090294921 Semiconductor device comprising metal lines with a selectively formed dielectric cap layer
12/03/2009US20090294920 Method for forming dual high-k metal gate using photoresist mask and structures thereof
12/03/2009US20090294919 Method of forming a finfet and structure
12/03/2009US20090294917 Method of producing semiconductor device
12/03/2009US20090294916 Bonding method for through-silicon-via based 3d wafer stacking
12/03/2009US20090294914 Semiconductor Device and Method of Forming Through Vias with Reflowed Conductive Material
12/03/2009US20090294913 Method for manufacturing semiconductor chip and semiconductor device
12/03/2009US20090294912 Semiconductor device and method for manufacturing the same
12/03/2009US20090294911 Semiconductor Device and Method of Forming Double-Sided Through Vias in Saw Streets
12/03/2009US20090294909 N-type group III nitride-based compound semiconductor and production method therefor
12/03/2009US20090294907 Semiconductor component with mim capacitor
12/03/2009US20090294906 Semiconductor device and fabrication method for the same, and light modulation device and fabrication method for the same
12/03/2009US20090294905 Semiconductor device
12/03/2009US20090294904 Integrated circuit system employing back end of line via techniques
12/03/2009US20090294903 Anti-fusse structure and method of fabricating the same
12/03/2009US20090294902 Semiconductor device and method of manufacturing the same
12/03/2009US20090294901 Structure and method of forming electrically blown metal fuses for integrated circuits
12/03/2009US20090294900 Fuse Device
12/03/2009US20090294899 Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole vias
12/03/2009US20090294898 Microstructure device including a metallization structure with self-aligned air gaps between closely spaced metal lines
12/03/2009US20090294895 Integrated circuit with conductive structures
12/03/2009US20090294894 INTEGRATED CIRCUIT HAVING LOCALIZED EMBEDDED SiGe AND METHOD OF MANUFACTURING
12/03/2009US20090294885 Silicon Nanoparticle Embedded Insulating Film Photodetector
12/03/2009US20090294883 Method for electronically pinning a back surface of a back-illuminated imager fabricated on a utsoi wafer
12/03/2009US20090294882 Methods and systems for magnetic sensing
12/03/2009US20090294880 Method for manufacturing a sensor element, and sensor element
12/03/2009US20090294879 Method for Capping a MEMS Wafer
12/03/2009US20090294878 Circuitry and gate stacks
12/03/2009US20090294877 Semiconductor device and manufacturing method thereof
12/03/2009US20090294874 Method of Fabricating Semiconductor Apparatus Having Saddle-Fin Transistor and Semiconductor Apparatus Fabricated Thereby
12/03/2009US20090294873 Field effect structure and method including spacer shaped metal gate with asymmetric source and drain regions
12/03/2009US20090294872 Ge/Xe IMPLANTS TO REDUCE JUNCTION CAPACITANCE AND LEAKAGE
12/03/2009US20090294871 Semiconductor devices having rare earth metal silicide contact layers and methods for fabricating the same
12/03/2009US20090294870 Semiconductor device with trench gate and method of manufacturing the same
12/03/2009US20090294869 Negative Differential Resistance Device and Memory Using the Same
12/03/2009US20090294868 Drive current adjustment for transistors formed in the same active region by locally inducing different lateral strain levels in the active region
12/03/2009US20090294867 Dual metal gates using one metal to alter work function of another metal
12/03/2009US20090294866 Transistor Fabrication Methods and Structures Thereof
12/03/2009US20090294862 Non-volatile semiconductor memory device and fabricating method thereof
12/03/2009US20090294860 In situ formed drain and source regions in a silicon/germanium containing transistor device
12/03/2009US20090294859 Trench MOSFET with embedded junction barrier Schottky diode
12/03/2009US20090294858 Transistor with contact over gate active area
12/03/2009US20090294857 Method for Manufacturing Semiconductor Apparatus Having Saddle-Fin Transistor and Semiconductor Apparatus Fabricated Thereby
12/03/2009US20090294853 Thin film transistor having a common channel and selectable doping configuration
12/03/2009US20090294851 Semiconductor Device and Method for Fabricating the Same
12/03/2009US20090294850 Method to tailor location of peak electric field directly underneath an extension spacer for enhanced programmability of a prompt-shift device
12/03/2009US20090294847 Plasma Display Apparatus
12/03/2009US20090294845 Insulated gate type semiconductor device and method for fabricating the same
12/03/2009US20090294843 Enclosed void cavity for low dielectric constant insulator
12/03/2009US20090294842 Methods of forming data cells and connections to data cells
12/03/2009US20090294840 Methods of providing electrical isolation and semiconductor structures including same
12/03/2009US20090294839 Recessed channel array transistor (rcat) structures and method of formation
12/03/2009US20090294838 Non-volatile semiconductor memory devices
12/03/2009US20090294836 Nonvolatile semiconductor storage device and method for manufacturing same
12/03/2009US20090294835 Semiconductor memory device including laminated gate having electric charge accumulating layer and control gate and method of manufacturing the same
12/03/2009US20090294834 Nonvolatile memory device, method of manufacturing the nonvolatile memory device, and method of manufacturing flat panel display device provided with the nonvolatile memory device
12/03/2009US20090294831 Semiconductor Constructions, Methods Of Forming Transistor Gates, And Methods Of Forming NAND Cell Units
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