Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2009
12/03/2009US20090294830 Memory device with high dielectric constant gate dielectrics and metal floating gates
12/03/2009US20090294829 Nand flash memory and method of manufacturing the same
12/03/2009US20090294828 Nonvolatile semiconductor memory device and method for manufacturing same
12/03/2009US20090294826 Semiconductor Device and Method of Fabricating the Same
12/03/2009US20090294825 Storage cell having a t-shaped gate electrode and method for manufacturing the same
12/03/2009US20090294823 Method of manufacturing a semiconductor integrated circuit using a selective disposal spacer technique and semiconductor integrated circuit manufactured thereby
12/03/2009US20090294821 Semiconductor device having driving transistors
12/03/2009US20090294820 Capacitors and Methods of Manufacture Thereof
12/03/2009US20090294819 Methods for enhancing capacitors having roughened features to increase charge-storage capacity
12/03/2009US20090294817 Ferroelectric memory device
12/03/2009US20090294814 Three-Dimensional Integrated Circuits and Techniques for Fabrication Thereof
12/03/2009US20090294810 Microstructure device including a compressively stressed low-k material layer
12/03/2009US20090294809 Reduction of metal silicide diffusion in a semiconductor device by protecting sidewalls of an active region
12/03/2009US20090294808 Thin Film Transistor, Method for Manufacturing the Same and Film Formation Apparatus
12/03/2009US20090294807 Methods of Fabricating Transistors and Structures Thereof
12/03/2009US20090294806 Method of Improving Minority Lifetime in Silicon Channel and Products Thereof
12/03/2009US20090294804 High-efficiency thinned imager with reduced boron updiffusion
12/03/2009US20090294803 Methods and devices for fabricating and assembling printable semiconductor elements
12/03/2009US20090294801 METHODS OF INTEGRATING REVERSE eSiGe ON NFET AND SiGe CHANNEL ON PFET, AND RELATED STRUCTURE
12/03/2009US20090294800 Hybrid fet incorporating a finfet and a planar fet
12/03/2009US20090294797 Semiconductor light emitting element and method for manufacturing same
12/03/2009US20090294795 Light emitting device and method for manufacturing same
12/03/2009US20090294793 Led package and method of manufacturing the same
12/03/2009US20090294789 Light emitting device and method of manufacturing light emitting device
12/03/2009US20090294785 Led device structure to improve light output
12/03/2009US20090294783 Process to fabricate integrated mwir emitter
12/03/2009US20090294781 Array substrate for liquid crystal display device and method of fabricating the same
12/03/2009US20090294779 Electronic element wafer module, method for manufacturing an electronic element wafer module, electronic element module,and electronic information device
12/03/2009US20090294776 Highly Oxygen-Sensitive Silicon Layer and Method for Obtaining Same
12/03/2009US20090294772 Thin film transistor, method of manufacturing the same and flat panel display device having the same
12/03/2009US20090294769 Semiconductor device and a method of manufacturing the same
12/03/2009US20090294768 Self-aligned thin-film transistor and method of forming same
12/03/2009US20090294765 Semiconductor device, method for producing the same, sensor and electro-optical device
12/03/2009US20090294759 Stack structure comprising epitaxial graphene, method of forming the stack structure, and electronic device comprising the stack structure
12/03/2009US20090294758 ZnO-CONTAINING SEMICONDUCTOR LAYER, ITS MANUFACTURE METHOD, AND SEMICONDUCTOR LIGHT EMITTING DEVICE
12/03/2009US20090294754 Novel techniques for precision pattern transfer of carbon nanotubes from photo mask to wafers
12/03/2009US20090294753 Carbon nanotube diameter selection by pretreatment of metal catalysts on surfaces
12/03/2009US20090294752 Highly integrated phase change memory device having micro-sized diodes and method for manufacturing the same
12/03/2009US20090294751 Nonvolatile storage device and method for manufacturing same
12/03/2009US20090294749 Chemical Mechanical Polishing Slurry Composition for Polishing Phase-Change Memory Device and Method for Polishing Phase-Change Memory Device Using the Same
12/03/2009US20090294682 Scintillator and Methods of Making and Using Same
12/03/2009US20090294680 Energy resolution in semiconductor gamma radiation detectors using heterojunctions and methods of use and preparation thereof
12/03/2009US20090294542 Transponder and Method of Producing a Transponder
12/03/2009US20090294066 Dry Etching Apparatus
12/03/2009US20090294064 Focus ring and plasma processing apparatus
12/03/2009US20090294063 Plasma processing apparatus
12/03/2009US20090294060 Semiconductor Device Manufacturing Apparatus Capable Of Reducing Particle Contamination
12/03/2009US20090293948 Method of manufacturing an amorphous/crystalline silicon heterojunction solar cell
12/03/2009US20090293809 Stage unit for supporting a substrate and apparatus for processing a substrate including the same
12/03/2009US20090293604 Multi-chip package
12/03/2009DE4343140B4 Halbleiteranordnung zur Beeinflussung der Durchbruchsspannung von Transistoren A semiconductor device for influencing the breakdown voltage of transistors
12/03/2009DE112007003303T5 Additiv für eine Zusammensetzung zum Polieren An additive for a composition for polishing
12/03/2009DE102009018397A1 Verfahren zur Herstellung einer Halbleiterstruktur A process for producing a semiconductor structure
12/03/2009DE102009016649A1 Halbleitervorrichtung und Verfahren mit einem ersten und zweiten Träger A semiconductor device and method having a first and second support
12/03/2009DE102009006926A1 Integrierte Schaltung, Verfahren zur Erfassung von Daten und Messsysteme An integrated circuit, A method for detecting data and measurement systems
12/03/2009DE102008047127A1 Integral ausgebildete Drain- und Source-Gebiete in einem Silizium/Germanium enthaltenden Transistorbauelement Integrally formed drain and source regions containing a silicon / germanium transistor device
12/03/2009DE102008030679A1 Vorrichtung zur Diffusionsbehandlung von Werkstücken Apparatus for diffusion treatment of workpieces
12/03/2009DE102008026399A1 Soldering contacts producing device for electrical components, has masking part arranged in retaining frames, where masking part and retainer are arranged with component by maintaining alignment in miniature furnace
12/03/2009DE102008026212A1 Semiconductor device comprises a chip area with a metallization system and a semiconductor area, which are formed over a substrate, circuit elements formed in the semiconductor area, a chip seal area, a conductive path, and a ceiling area
12/03/2009DE102008026182A1 Mikrostrukturbauelement mit einem kompressiv verspannten Material mit kleinem ε Microstructure device with a compressively stressed material with small ε
12/03/2009DE102008026133A1 Verfahren zum Verringern der Metallunregelmäßigkeiten in komplexen Metallisierungssystemen von Halbleiterbauelementen A method for reducing irregularities in the metal complex metallization systems of semiconductor devices
12/03/2009DE102008025484A1 Wärmeleitfähiger Verbundwerkstoff mit Aluminium-Pulver, Verfahren zum Herstellen des Verbundwerkstoffs und Verwendung des Verbundwerkstoffs Thermally conductive composite material with aluminum powder, method of manufacturing the composite and use of the composite material
12/03/2009DE102008024519A1 Integrierte Schaltung mit einer ferroelektrischen Speicherzelle und Herstellungsverfahren An integrated circuit comprising a ferroelectric memory cell, and manufacturing method
12/03/2009DE102008023907A1 Bernoulli gripper for use in process machine to grip and handle silicon solar cell elements, has fluid supply device that is formed such that fluids are discharged to respective openings with two different speeds by supply device
12/03/2009DE102008016512B4 Erhöhen der Verspannungsübertragungseffizienz in einem Transistor durch Verringern der Abstandshalterbreite während der Drain- und Source-Implantationssequenz Increasing the tension transmission efficiency in a transistor by reducing the spacer width during the drain and source implantation sequence
12/03/2009DE102006062403B4 Integriertes Schaltkreisbauelement sowie Herstellungs- und Betriebsverfahren Integrated circuit device and manufacturing and operating procedures
12/03/2009DE10131707B4 Verfahren zur Herstellung eines DMOS-Transistors und dessen Verwendung zur Herstellung einer integrierten Schaltung A process for the preparation of a DMOS transistor, and its use for the manufacture of an integrated circuit
12/03/2009CA2725835A1 Method for led-module assembly
12/03/2009CA2719996A1 Photonic clock stabilized laser comb processing
12/03/2009CA2666237A1 Apparatus for converting electrical energy for conductively heating semiconductor material in rod form
12/02/2009EP2128902A2 Thin film electronic device and methods for fabricating an electronic device
12/02/2009EP2128899A1 Method for electrodepositing a metal, especially copper, use of said method and integrated circuit
12/02/2009EP2128898A1 Active matrix substrate
12/02/2009EP2128897A1 Silicon dielectric treating agent for use after etching, process for producing semiconductor device, and semiconductor device
12/02/2009EP2128896A2 Method of polishing silicon wafer
12/02/2009EP2128895A2 Semiconductor wafer
12/02/2009EP2128894A1 Metal film polishing pad and method for polishing metal film using the same
12/02/2009EP2128893A1 Aqueous dispersion for chemical mechanical polishing and method of chemical mechanical polishing of semiconductor device
12/02/2009EP2128892A1 Optical integrator, illuminating optical device, exposure apparatus and device manufacturing method
12/02/2009EP2128891A1 Process for producing laminated substrate and laminated substrate
12/02/2009EP2128890A2 Purging of a wafer conveyance container
12/02/2009EP2128707A1 Cleaning composition and process for producing semiconductor device
12/02/2009EP2128706A1 Resist pattern formation method, and resin composition capable of insolubilizing resist pattern
12/02/2009EP2128630A1 Probe card
12/02/2009EP2128218A1 Powdery phosphor and process for producing the same, and light emitting device, display device and fluorescent lamp containing powdery phosphor
12/02/2009EP2127838A1 Device for positioning and blocking thin substrates on a cut substrate block
12/02/2009EP2127810A1 Method and device for grinding both surfaces of semiconductor wafers
12/02/2009EP2127806A2 Method of grinding semiconductor wafers, grinding surface plate, and grinding device
12/02/2009EP2126985A2 Iii-nitride light emitting devices grown on tempaltes to reduce strain
12/02/2009EP2126977A1 Electronic device including channel regions lying at different elevations and processes of forming the same
12/02/2009EP2126971A1 Wafer level csp packaging concept
12/02/2009EP2126970A2 Memory having a vertical access device
12/02/2009EP2126969A1 Method of interconnecting electronic wafers
12/02/2009EP2126968A1 Semiconductor device comprising circuit substrate with inspection connection pads and manufacturing method thereof
12/02/2009EP2126967A2 Etching solution and etching method
12/02/2009EP2126966A1 Amorphous insulator film and thin-film transistor
12/02/2009EP2126965A2 Doped nanoparticle semiconductor charge transport layer
12/02/2009EP2126964A1 Method for fabricating 1-3-6 2 compound thin film using single metal-organic chemical vapor deposition process
12/02/2009EP2126963A1 Semiconductor heterostructures and manufacturing thereof
12/02/2009EP2125985A1 Cmp slurry composition for forming metal wiring line
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