| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/14/2010 | DE112008000394T5 Verfahren zum Herstellen eines Substrats, das eine abgeschiedene vergrabene Oxidschicht umfasst A method for producing a substrate comprising a buried oxide layer deposited |
| 01/14/2010 | DE112008000239T5 Waferbehälter mit Polsterungsschicht Wafer container with padding layer |
| 01/14/2010 | DE112008000169T5 Gasbehandlungssysteme Gas treatment systems |
| 01/14/2010 | DE10362148B4 Verfahren zur Herstellung der Bodenelektrode eines Kondensators einer Halbleitervorrichtung Process for the preparation of the bottom electrode of a capacitor of a semiconductor device |
| 01/14/2010 | DE10356153B4 Modul für kontaktlose Chipkarten oder Identifizierungssysteme Module for contactless chip cards or identification systems |
| 01/14/2010 | DE10355581B4 Verfahren und Technik zur Herstellung einer Gateelektrode unter Anwendung einer Hartmaske Methods and technologies for the production of a gate electrode by using a hard mask |
| 01/14/2010 | DE10232788B4 Elektronisches Bauteil mit einem Halbleiterchip auf einem Systemträger, Systemträger und Verfahren zur Herstellung eines elektronischen Bauteils Electronic component having a semiconductor chip on a carrier, lead frame and method for manufacturing an electronic component |
| 01/14/2010 | DE102009031499A1 Halbleitersensor mit Heizung auf dem Isolationsfilm und Herstellungsverfahren hierfür A semiconductor sensor with heating on the insulating film and manufacturing method thereof |
| 01/14/2010 | DE102009030957A1 Verfahren zum Herstellen einer Halbleiteranordnung mittels Ätzung eines Halbleiterchips und Halbleiteranordnung A method of manufacturing a semiconductor arrangement by means of etching of a semiconductor chip and semiconductor device |
| 01/14/2010 | DE102009030510A1 Aufbau und Verfahren zum Ausbilden eines Trench-FET mit abgeschirmtem Gate mit einem Zwischenelektroden-Dielektrikum mit einer Nitridschicht darin Structure and method for forming a trench-shielded gate FET with an inter-electrode dielectric with a nitride layer is |
| 01/14/2010 | DE102009029873A1 Reparierbares Halbleiterbauelement und Verfahren A repairable semiconductor device and method |
| 01/14/2010 | DE102009025601A1 Structure and method for forming a thick bottom dielectric (TBD) for trench-gate devices Structure and method for forming a thick bottom dielectric (TBD) for trench-gate devices |
| 01/14/2010 | DE102008062482A1 Dünnschichttransistor und Verfahren zu dessen Herstellung Thin-film transistor and method of producing the |
| 01/14/2010 | DE102008055889A1 Semiconductor wafer i.e. silicon wafer, treating method for producing microelectronic component, involves transporting semiconductor wafer away from output opening of liquid container in transporting direction by transporting device |
| 01/14/2010 | DE102008040290A1 Hybrid circuit structure for use in automotive-area, has low-current substrate for carrying low current components, and power substrate comprising front side with contact surface section, where low-current substrate is fastened to section |
| 01/14/2010 | DE102008032554A1 Metallhaltige Zusammensetzung, Verfahren zur Herstellung von elektrischen Kontaktstrukturen auf elektronischen Bauteilen sowie elektronisches Bauteil Metal-containing composition, method of producing electrical contact structures to electronic components, and electronic component |
| 01/14/2010 | DE102008032346A1 Lighting unit for motor vehicle, has semiconductor source of light and circuit carrier, on which group of electrical component is arranged, where group has resistance and semiconductor source of light |
| 01/14/2010 | DE102008032171A1 Verfahren zum Herstellen einer einkristallinen Schicht A method of manufacturing a single crystalline layer |
| 01/14/2010 | DE102008031619A1 Verfahren und Vorrichtung zum Brechen von Halbleiterscheiben oder ähnlichen Substraten Method and device for breaking semiconductor disks or similar substrates |
| 01/14/2010 | DE102008030864A1 Doppelgate- und Tri-Gatetransistor, die auf einem Vollsubstrat aufgebaut sind und Verfahren zur Herstellung des Transistors Doppelgate- and tri-gate transistor constructed on a solid substrate and methods for producing the transistor |
| 01/14/2010 | DE102008030725A1 Galvanikmaske Electroplating mask |
| 01/14/2010 | DE102008030723A1 Transport device for multiple electronic components, particularly radio-frequency identification chips, has receiving or storing unit for receiving certain number of electronic components of transport elements |
| 01/14/2010 | DE102007040650B4 Verfahren zur induktiven Messung eines Schichtwiderstandes einer in einen multikristallinen Halbleiterwafer eingebrachten Dotierungsschicht A method for inductive measurement of a sheet resistance of introduced into a polycrystalline semiconductor wafer doping layer |
| 01/14/2010 | DE102006039302B4 Verfahren zur Herstellung eines integrierten BiCMOS-Schaltkreises A method for manufacturing an integrated BiCMOS circuit |
| 01/14/2010 | DE102004010956B4 Halbleiterbauteil mit einem dünnen Halbleiterchip und einem steifen Verdrahtungssubstrat sowie Verfahren zur Herstellung und Weiterverarbeitung von dünnen Halbleiterchips A semiconductor device comprising a thin semiconductor chip and a rigid wiring substrate and methods of making and further processing of thin semiconductor chips |
| 01/14/2010 | DE10147761B4 Verfahren zum Herstellen von Siliciumwafern A method for producing silicon wafers |
| 01/14/2010 | CA2729194A1 Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making |
| 01/13/2010 | EP2144307A2 High-reliability group iii-nitride light emitting diode |
| 01/13/2010 | EP2144295A2 Spin injection device having a shared superconductor electrode |
| 01/13/2010 | EP2144285A2 Device for loading and unloading substrates |
| 01/13/2010 | EP2144284A1 Method for manufacturing a connecting contact on a semiconductor device for power electronics and electronic component with a connecting contact on a semiconductor device manufactured in this way |
| 01/13/2010 | EP2144283A1 Method of transferring adhesive film |
| 01/13/2010 | EP2144282A1 Method for bonding semiconductor wafers and method for manufacturing semiconductor device |
| 01/13/2010 | EP2144281A1 Method for creating a substrate contact in a CMOS process |
| 01/13/2010 | EP2144280A1 Silicon wafer and method for manufacturing the same |
| 01/13/2010 | EP2144279A2 Aminosilanes for shallow trench isolation films |
| 01/13/2010 | EP2144278A2 Method of fabricating a quantum well structure |
| 01/13/2010 | EP2144277A2 A transistor of SiC having an insulated gate |
| 01/13/2010 | EP2144276A2 Purge device and method |
| 01/13/2010 | EP2144117A1 Process and system for fabrication of patterns on a surface |
| 01/13/2010 | EP2144026A1 Processing device for processing stacked goods for processing |
| 01/13/2010 | EP2143995A1 Discharge lamp, cable for connection, light source device, and exposure device |
| 01/13/2010 | EP2143763A1 Resin composition and molded article obtained from the composition |
| 01/13/2010 | EP2143687A2 Method for purifying a substrate in crystalline silicon and method for manufacturing a photovoltaic cell |
| 01/13/2010 | EP2143537A1 Method and device for breaking semiconductor discs or similar substrates |
| 01/13/2010 | EP2143145A2 Method of forming group iv semiconductor junctions using laser processing |
| 01/13/2010 | EP2143140A2 Method for the production of a rigid power module |
| 01/13/2010 | EP2143137A1 Process for manufacturing a composite substrate |
| 01/13/2010 | EP2143136A1 A method of processing semi conductor wafers |
| 01/13/2010 | EP2143135A1 Improved process for preparing cleaned surfaces of strained silicon |
| 01/13/2010 | EP2143134A2 Integrated electronic circuit including a thin film portion based on hafnium oxide |
| 01/13/2010 | EP2142682A2 Cobalt nitride layers for copper interconnects and methods for forming them |
| 01/13/2010 | EP1685584B1 SILICON DEVICE ON Si:C-OI and SGOI AND METHOD OF MANUFACTURE |
| 01/13/2010 | EP1593465B1 Vacuum suction head |
| 01/13/2010 | EP1576657B1 Method for reducing pattern deformation and photoresist poisoning in semiconductor device fabrication |
| 01/13/2010 | EP1570512B1 Slurry composition for secondary polishing of silicon wafer |
| 01/13/2010 | EP1542266B1 Semiconductor abrasive, process for producing the same and method of polishing |
| 01/13/2010 | EP1504376B1 Data archive recovery |
| 01/13/2010 | EP1216483B1 Electron-optical lens arrangement with a displaceable axis |
| 01/13/2010 | EP1195807B1 Open/close device for open/close lid of untreated object storing box and treating system for untreated object |
| 01/13/2010 | EP1065726B1 Silicon carbide junction-gate field effect transistor |
| 01/13/2010 | EP1060507B1 Mould part, mould and method for encapsulating electronic components mounted on a carrier |
| 01/13/2010 | CN201383496Y Static chuck |
| 01/13/2010 | CN201383495Y Automatic feeding device |
| 01/13/2010 | CN201383494Y High-temperature heat diffusion boat for semiconductors |
| 01/13/2010 | CN201383493Y Mechanical die and device guiding mechanism |
| 01/13/2010 | CN201383492Y Microwave excitation small-sized plasma etching device |
| 01/13/2010 | CN201383491Y Silicon chip machine |
| 01/13/2010 | CN201382962Y Cantilever-type probe card |
| 01/13/2010 | CN201382828Y 剪切力测试装置 Shear test device |
| 01/13/2010 | CN201381281Y Etching equipment |
| 01/13/2010 | CN201381280Y Etching equipment |
| 01/13/2010 | CN201380491Y Adsorption device |
| 01/13/2010 | CN101627470A Semiconductor device and process for producing the same |
| 01/13/2010 | CN101627469A Method for manufacturing semiconductor device and recording medium |
| 01/13/2010 | CN101627468A Trench formation in a semiconductor material |
| 01/13/2010 | CN101627467A Conveying device |
| 01/13/2010 | CN101627466A Package manufacturing method, package, optical module and die for integral molding |
| 01/13/2010 | CN101627465A Adhesive film for semiconductor and semiconductor device using the adhesive film |
| 01/13/2010 | CN101627464A Laminate structure and its manufacturing method |
| 01/13/2010 | CN101627463A Semiconductor device and process for producing the same |
| 01/13/2010 | CN101627462A Edge electrodes with dielectric covers |
| 01/13/2010 | CN101627461A Edge electrodes with variable power |
| 01/13/2010 | CN101627460A Method of damaged low-k dielectric film layer removal |
| 01/13/2010 | CN101627459A Semiconductor device manufacturing method and semiconductor device manufacturing apparatus |
| 01/13/2010 | CN101627458A Nitride semiconductor structures with interlayer structures and methods of fabricating nitride semiconductor structures with interlayer structures |
| 01/13/2010 | CN101627457A A method and device of diamond like carbon multi-layer doping growth |
| 01/13/2010 | CN101626012A Long-term annealed integrated circuit arrangements and method for producing the same |
| 01/13/2010 | CN101625999A Manufacturing method of SONOS storage |
| 01/13/2010 | CN101625998A Lateral double diffused metal oxide semiconductor device and manufacturing method of lateral double diffused metal oxide semiconductor device |
| 01/13/2010 | CN101625997A Dummy pattern design for reducing device performance drift |
| 01/13/2010 | CN101625996A ONO side wall etching process for reducing dark current |
| 01/13/2010 | CN101625995A Wafer processing method |
| 01/13/2010 | CN101625994A Large-sized wafer cutting method and device |
| 01/13/2010 | CN101625993A Dual-damascene structure and manufacturing method thereof |
| 01/13/2010 | CN101625992A Method for manufacturing dual-damascene structure |
| 01/13/2010 | CN101625991A Semiconductor deep trench insulation process |
| 01/13/2010 | CN101625990A Method for removing microgrooves in etching clearance wall |
| 01/13/2010 | CN101625989A Wire feeding/drawing device and method thereof |
| 01/13/2010 | CN101625988A Lens support and wirebond protector |