Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2010
01/21/2010WO2010007951A1 Semiconductor wiring
01/21/2010WO2010007945A1 Illuminating optical system, exposure apparatus and exposure method
01/21/2010WO2010007916A1 Semiconductor device and display device
01/21/2010WO2010007893A1 Magnetic random access memory and method for initializing thereof
01/21/2010WO2010007879A1 Semiconductor device manufacturing method and semiconductor device
01/21/2010WO2010007874A1 Method for modifying first film and composition for forming acid transfer resin film used therefor
01/21/2010WO2010007863A1 Microwave plasma processing apparatus and method for producing cooling jacket
01/21/2010WO2010007853A1 Surface processing method, mask for surface processing, and optical device
01/21/2010WO2010007816A1 Probe
01/21/2010WO2010007769A1 Nonvolatile semiconductor memory element, nonvolatile semiconductor memory cell, and nonvolatile semiconductor memory device
01/21/2010WO2010007702A1 Method for judging pass/fail of bonding, apparatus for judging pass/fail of bonding, and bonding apparatus
01/21/2010WO2010007695A1 Spin valve element and its driving method and storage device employing them
01/21/2010WO2010007657A1 Purging device, load port, and purging method
01/21/2010WO2010007653A1 Socket guide, socket, pusher and electronic part testing device
01/21/2010WO2010007559A1 A transistor device and a method of manufacturing the same
01/21/2010WO2010007478A1 Improved complementary metal oxide semiconductor devices
01/21/2010WO2010007477A1 Dual damascene via filling composition
01/21/2010WO2010007064A1 Process for the manufacture of etched items
01/21/2010WO2010006916A1 Method for producing a semiconductor component, and semiconductor component
01/21/2010WO2010006589A2 Laser scribing system for structuring substrates for thin-layer solar modules
01/21/2010WO2010006475A1 A ceramic packaging substrate for the high power led
01/21/2010WO2009145461A3 Substrate for ceramic printed circuit board and method for manufacturing the substrate
01/21/2010WO2009141459A8 Method for manufacturing a photovoltaic cell structure
01/21/2010WO2009140052A3 Metal gate integration structure and method including metal fuse, anti-fuse and/or resistor
01/21/2010WO2009139828A3 Detection of arcing events in wafer plasma processing through monitoring of trace gas concentrations
01/21/2010WO2009134778A3 Calibration of non-vibrating contact potential difference measurements to detect surface variations that are perpendicular to the direction of sensor motion
01/21/2010WO2009134636A3 Suitably short wavelength light for laser annealing of silicon in dsa type systems
01/21/2010WO2009134329A3 Vapor phase methods for forming electrodes in phase change memory devices
01/21/2010WO2009131364A3 Printed circuit board for electronic devices and method of manufacturing the same
01/21/2010WO2009131346A3 Mems probe card and manufacturing method thereof
01/21/2010WO2009129332A3 Atomic layer deposition of metal carbide films using aluminum hydrocarbon compounds
01/21/2010WO2009129105A3 Methods and systems for determining a defect criticality index for defects on wafers
01/21/2010WO2009128655A3 Method of forming chalcogenide thin film
01/21/2010WO2009126910A3 Laser scribe inspection methods and systems
01/21/2010WO2009126901A3 Dynamic scribe alignment for laser scribing, welding or any patterning system
01/21/2010WO2009121604A3 Photovoltaic solar cell and method of production thereof
01/21/2010US20100017015 Substrate processing apparatus and substrate processing method
01/21/2010US20100017005 Metrology through use of feed forward feed sideways and measurement cell re-use
01/21/2010US20100015893 Polishing pad
01/21/2010US20100015890 Polishing method, polishing apparatus, and program for controlling polishing apparatus
01/21/2010US20100015889 Processing end point detection method, polishing method,and polishing apparatus
01/21/2010US20100015818 Method for Producing a Stop Zone in a Semiconductor Body and Semiconductor Component Having a Stop Zone
01/21/2010US20100015817 Vertical heat treatment boat and heat treatment method for semiconductor wafer
01/21/2010US20100015816 Methods to promote adhesion between barrier layer and porous low-k film deposited from multiple liquid precursors
01/21/2010US20100015815 Plasma oxidizing method, plasma processing apparatus, and storage medium
01/21/2010US20100015814 MOSFET Device With Localized Stressor
01/21/2010US20100015813 Gap processing
01/21/2010US20100015812 Method and apparatus for processing workpiece
01/21/2010US20100015811 Substrate processing apparatus and semiconductor device manufacturing method for forming film
01/21/2010US20100015810 Surface processing method and surface processing apparatus
01/21/2010US20100015809 Organic line width roughness with h2 plasma treatment
01/21/2010US20100015808 Impact sensor and method for manufacturing the impact sensor
01/21/2010US20100015807 Chemical Mechanical Polishing Composition for Copper Comprising Zeolite
01/21/2010US20100015806 Cmp polishing slurry, additive liquid for cmp polishing slurry, and substrate-polishing processes using the same
01/21/2010US20100015805 Wet Etching Methods for Copper Removal and Planarization in Semiconductor Processing
01/21/2010US20100015804 Methods for removing a metal-comprising material from a semiconductor substrate
01/21/2010US20100015803 Method for fabricating semiconductor device using dual damascene process
01/21/2010US20100015802 Dynamic schottky barrier mosfet device and method of manufacture
01/21/2010US20100015801 Method of forming a seam-free tungsten plug
01/21/2010US20100015800 Method for forming metal film using carbonyl material, method for forming multi-layer wiring structure, and method for manufacturing semiconductor device
01/21/2010US20100015799 Semiconductor device manufacturing method, semiconductor device manufacturing apparatus, computer program and storage medium
01/21/2010US20100015798 Method for forming a ruthenium metal cap layer
01/21/2010US20100015797 Manufacturing method of semiconductor device
01/21/2010US20100015796 Semiconductor device, manufacturing method and apparatus for the same
01/21/2010US20100015795 Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof
01/21/2010US20100015794 Packaging conductive structure and method for forming the same
01/21/2010US20100015793 Contact surrounded by passivation and polymide and method therefor
01/21/2010US20100015792 Bonding Metallurgy for Three-Dimensional Interconnect
01/21/2010US20100015791 Supply apparatus, semiconductor manufacturing apparatus and semiconductor manufacturing method
01/21/2010US20100015790 TiC AS A THERMALLY STABLE p-METAL CARBIDE ON HIGH k SiO2 GATE STACKS
01/21/2010US20100015789 Manufacturing method of semiconductor device, and semiconductor device
01/21/2010US20100015788 Method for manufacturing semiconductor device
01/21/2010US20100015787 Realizing N-Face III-Nitride Semiconductors by Nitridation Treatment
01/21/2010US20100015786 Vapor growth apparatus, vapor growth method, and method for manufacturing semiconductor device
01/21/2010US20100015785 Method for reducing a reset current for resetting a portion of a phase change material in a memory cell of a phase change memory device and the phase change memory device
01/21/2010US20100015784 Semiconductor device manufacturing method
01/21/2010US20100015783 Method of cutting an object to be processed
01/21/2010US20100015782 Wafer Dicing Methods
01/21/2010US20100015781 Semiconductor substrate, and semiconductor device and method of manufacturing the semiconductor device
01/21/2010US20100015780 Transfer method with a treatment of a surface to be bonded
01/21/2010US20100015779 Method for producing bonded wafer
01/21/2010US20100015778 Method of forming finned semiconductor devices with trench isolation
01/21/2010US20100015777 Method of fabricating semiconductor device
01/21/2010US20100015776 Shallow Trench Isolation Corner Rounding
01/21/2010US20100015775 Method for fabricating semiconductor device with recess gate
01/21/2010US20100015774 Semiconductor device and method of manufacturing the same
01/21/2010US20100015773 Sonos memory device having curved surface and method for fabricating the same
01/21/2010US20100015772 Method of manufacturing semiconductor device
01/21/2010US20100015771 Method of fabricating strained silicon transistor
01/21/2010US20100015770 Double gate manufactured with locos techniques
01/21/2010US20100015769 Power Device With Trenches Having Wider Upper Portion Than Lower Portion
01/21/2010US20100015768 Method of fabricating semiconductor device having a junction extended by a selective epitaxial growth (SEG) layer
01/21/2010US20100015767 Cell region layout of semiconductor device and method of forming contact pad using the same
01/21/2010US20100015766 Complementary stress memorization technique layer method
01/21/2010US20100015765 Shallow and deep trench isolation structures in semiconductor integrated circuits
01/21/2010US20100015764 Semiconductor device and manufacturing method thereof
01/21/2010US20100015763 Rescue structure and method for laser welding
01/21/2010US20100015762 Solder Interconnect
01/21/2010US20100015761 Thermally Enhanced Single Inline Package (SIP)
01/21/2010US20100015760 Semiconductor device and manufacturing method thereof